Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2018-100PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		74	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	8 ns	100 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	174 flip-flops; typical gates = 1000-1500	e0	100 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XCS150E-6FG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	3888	Yes	1.89 V		CMOS		265		1.8	1.8,2.5,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B456	3		23 mm	No		e0	357 MHz	30 s	265	225 °C (437 °F)	23 mm
XA3S100E-4TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS	AEC-Q100	108	100000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	4.88 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s	80	260 °C (500 °F)	20 mm
XC6SLX150T-4CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes			CMOS		296			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1		30 s	296	260 °C (500 °F)	19 mm
XC3195-5PG175I	Xilinx	FPGA	Industrial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.5 V	484	CMOS		144	6500	5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	4.1 ns	484 CLBS, 6500 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	MAX 176 I/OS; 1320 flip-flops; typical gates = 6500 - 9000		190 MHz		144		42.164 mm
XC4010D-6PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS		160	8000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	6 ns	400 CLBS, 8000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	90.9 MHz	30 s	160	225 °C (437 °F)	29.3116 mm
XC3090-50CQ164ISPC0109	Xilinx	FPGA	Industrial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	320	CMOS			9000	5		Flatpack			4.5 V	.635 mm	85 °C (185 °F)		320 CLBS, 9000 Gates	-40 °C (-40 °F)		Quad	S-CQFP-F164		3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz				27.432 mm
XC6SLX25-3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS		266		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	1879 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	862 MHz	30 s	266	225 °C (437 °F)	23 mm
XC5VSX50T-2FFV1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		480		1		Grid Array	BGA1136,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	4080 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm			e1		30 s	480	245 °C (473 °F)	35 mm
XCVU9P-2FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780			832		0.85		Grid Array	BGA2577,51X51,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577		4.24 mm	52.5 mm						832		52.5 mm
XC6SLX150T-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS		296			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1		30 s	296	250 °C (482 °F)	23 mm
XC4010D-5PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS		160	8000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	4.5 ns	400 CLBS, 8000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	133.3 MHz	30 s	160	225 °C (437 °F)	28 mm
XQ5VFX100T-2EF1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8960	CMOS		680		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1738		3.5 mm	42.5 mm	No		e0	1265 MHz		680		42.5 mm
XC5VFX130T-1FFV1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	13172	Yes	1.05 V	10240	CMOS		840		1		Grid Array	BGA1738,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	10240 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm					30 s	840	245 °C (473 °F)	42.5 mm
XC3195-3PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	QFP	Square	Ceramic	484	Yes			CMOS		176		5	5 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays		.5 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-XQFP-G208	3			No		e0		30 s	176	225 °C (437 °F)
XC6SLX75-L1FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831	CMOS		280		1	1,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1		30 s	280	250 °C (482 °F)	23 mm
XCVU065-2FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes	.979 V	600			520		.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
XC6SLX75T-4FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS		348			1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1		30 s	348	250 °C (482 °F)	27 mm
XC4013-6PQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	576	Yes	5.5 V	576	CMOS		192	10000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	6 ns	576 CLBS, 10000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	90.9 MHz	30 s	192	225 °C (437 °F)	28 mm
XC7A200T-L2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	215360	Yes	.93 V	16825			500		0.9		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz		500		10 mm
XC4010-5MQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Metal	400	Yes	5.5 V	400	CMOS		160	8000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	4.5 ns	400 CLBS, 8000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-MQFP-G208	1	3.68 mm	27.64 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	133.3 MHz		160		27.64 mm
XCKU095-2FFVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95	0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm	No		e1		30 s	702	245 °C (473 °F)	42.5 mm
XC6VHX255T-1FF1923I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	253440	Yes	1.05 V		CMOS		480		1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1924		3.85 mm	45 mm	No		e0	1098 MHz		480		45 mm
XC5VLX330-2FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920			1200		1	1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	25920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1		30 s	1200	225 °C (437 °F)	42.5 mm
XC7A100T-L2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	.93 V	7925			300		0.9		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.87 V	.8 mm	100 °C (212 °F)	1.51 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC5VFX100T-1FFG1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	CMOS		680		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	8000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e1		30 s	680	245 °C (473 °F)	42.5 mm
XC5VLX220T-2FFG1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280			680		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	17280 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e1		30 s	680	245 °C (473 °F)	42.5 mm
XCKU115-L1FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.927 V	5520			832		.9	0.9 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	832	245 °C (473 °F)	42.5 mm
XCKU095-L1FFVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200			702		0.9		Grid Array	BGA1760,42X42,40		.88 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm		Also Operates at 0.95 V nominal supply	e1		30 s	702	245 °C (473 °F)	42.5 mm
XQVU7P-1FLRB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.876 V	98520			702		0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		98520 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e0		5 s	702	250 °C (482 °F)	47.5 mm
XCVU125-1FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200			884		.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm			e1		30 s	884	245 °C (473 °F)	42.5 mm
XC5VLX20T-1FF323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS		172		1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	1560 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No		e0		30 s	172	225 °C (437 °F)	19 mm
XC5VLX220-1FFV1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280			800		1		Grid Array	BGA1760,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	17280 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm					30 s	800	245 °C (473 °F)	42.5 mm
XC5VLX110-1FFG1153I	Xilinx	FPGA	Industrial	Ball	1153	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			800		1	1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	8640 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No		e1		30 s	800	245 °C (473 °F)	35 mm
XC4013D-5PQ240I	Xilinx	FPGA	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	576	Yes	5.5 V	576	CMOS		192	10000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	4.5 ns	576 CLBS, 10000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	3.75 mm	32 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	133.3 MHz	30 s	192	225 °C (437 °F)	32 mm
XQKU15P-1FFRA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		MIL-PRF-38535	564		0.85		Grid Array	BGA1156,34X34,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.71 mm	35 mm			e0		20 s	564	225 °C (437 °F)	35 mm
XC7A50T-3CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XC5VLX155T-2FF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160			640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	12160 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	640	225 °C (437 °F)	35 mm
XC5VLX50T-1FF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	46080	Yes	10.5 V	3600			480		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	3600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	480	225 °C (437 °F)	35 mm
XC5VLX330T-1FF1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920			960		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	25920 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e0		30 s	960	225 °C (437 °F)	42.5 mm
XC3064-70PP132ISPC0108	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.5 V	224	CMOS			6400	5		Grid Array			4.5 V	2.54 mm	85 °C (185 °F)	9 ns	224 CLBS, 6400 Gates	-40 °C (-40 °F)		Perpendicular	S-PPGA-P132		4.191 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		70 MHz				37.084 mm
XC6SLX45-1LFGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	500 MHz	30 s		250 °C (482 °F)	27 mm
XC3195-3PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	484	Yes			CMOS		70		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0		30 s	70	225 °C (437 °F)
XCS100E-6TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	QFP	Square	Plastic/Epoxy	2700	Yes	1.89 V		CMOS		202		1.8	1.8,2.5,3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3		20 mm	No		e0	357 MHz	30 s	202	225 °C (437 °F)	20 mm
XC3090-50CQ164I	Xilinx	FPGA	Industrial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes	5.5 V	320	CMOS		142	9000	5	5 V	Flatpack	QFL164,1.2SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	85 °C (185 °F)		320 CLBS, 9000 Gates	-40 °C (-40 °F)		Quad	S-CQFP-F164	1	3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops		50 MHz		142		27.432 mm
XC3142-3TQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Square	Plastic/Epoxy	144	Yes			CMOS		82		5	5 V	Flatpack	QFP100,.63SQ,20	Field Programmable Gate Arrays		.5 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3			No		e0		30 s	82	225 °C (437 °F)
XC3020-50CQ100ISPC0110	Xilinx	FPGA	Industrial	Flat	100	QFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.635 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-CQFP-F100		3.683 mm	17.272 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	50 MHz				17.272 mm
XC6VLX240T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	.93 V		CMOS		600		.9	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.