Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4005A-5PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	5.5 V	196	CMOS	112	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.5 ns	196 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	616 flip-flops; typical gates = 4000-5000	e0	133.3 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC3020-50PC68ISPC0110	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS		2000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz				24.2316 mm
XC3020-50PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.5 V	64	CMOS	64	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 64 I/OS; 256 flip-flops		50 MHz		64		27.94 mm
XCKU3P-L1FFVB676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340		304		0.72		Grid Array	BGA676,26X26,40		.698 V	1 mm	100 °C (212 °F)		20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
XC3164-3PP132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No			CMOS	110		5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)		Perpendicular	S-PPGA-P132				No					110
XC3130-4PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	80	2000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	3.3 ns	100 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	230 MHz	30 s	80	225 °C (437 °F)	20 mm
XC6SLX100-L1FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.05 V	7911	CMOS	480		1	1,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1		30 s	480	250 °C (482 °F)	27 mm
XC6SLX150-3NFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz				23 mm
XC4008-6PG191I	Xilinx	FPGA	Industrial	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired	770	No	5.5 V	324	CMOS	144	6500	5	5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	6 ns	324 CLBS, 6500 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P191		4.064 mm	47.244 mm	No	936 flip-flops; typical gates = 6500-8000		90.9 MHz		144		47.244 mm
XC6VHX380T-1FFG1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	640		1	1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm	No		e1	1098 MHz	30 s	640	245 °C (473 °F)	45 mm
XC6SLX16-3NCPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e1	806 MHz				8 mm
XC7A15T-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XC6SLX45T-3NFGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz				23 mm
XCKU115-1FLVF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832		.95	0.95 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	832	245 °C (473 °F)	45 mm
XC6VLX130T-L1FFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V		CMOS	400		.9	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XC4010-6PQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS	160	8000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	6 ns	400 CLBS, 8000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	90.9 MHz	30 s	160	225 °C (437 °F)	28 mm
XC6VHX380T-1FFG1923I	Xilinx	FPGA	Industrial	Ball	1923	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	720		1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No		e1	1098 MHz	30 s	720	245 °C (473 °F)	45 mm
XCKU040-3FBVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300		520		1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm			e1		30 s	520	250 °C (482 °F)	27 mm
XCKU025-3FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312		1		Grid Array	BGA1156,34X34,40		.97 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1		30 s	312	245 °C (473 °F)	35 mm
XCKU035-L1FBVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.927 V	1700		520		.9	0.9 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)		1700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	520	250 °C (482 °F)	27 mm
XQKU040-1RBA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	.979 V	30300				.95		Grid Array			.922 V	1 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B676	4	3.44 mm	27 mm			e0		5 s		250 °C (482 °F)	27 mm
XC4006-5PQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	608	Yes	5.5 V	256	CMOS	128	5000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	4.5 ns	256 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	768 flip-flops; typical gates = 5000-6000	e0	133.3 MHz	30 s	128	225 °C (437 °F)	28 mm
XC3030-50PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.5 V	100	CMOS	74	3000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)		100 CLBS, 3000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 74 I/OS; 360 flip-flops		50 MHz		74		27.94 mm
XC7A12T-L1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG	150		0.95		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC5VFX100T-1FFG1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	CMOS	640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	8000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	640	245 °C (473 °F)	35 mm
XC6VLX550T-1LFFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	.97 V	42960	CMOS	840				Grid Array	BGA1759,42X42,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	42960 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm			e1		30 s	840	245 °C (473 °F)	42.5 mm
XCV405E-6BGG560I	Xilinx	FPGA	Industrial	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	1.89 V	2400	CMOS		129600	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	2400 CLBS, 129600 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	357 MHz	30 s		260 °C (500 °F)	42.5 mm
XC2S100-5FGG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS		100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	600 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	263 MHz	30 s		250 °C (482 °F)	23 mm
XQ5VLX30T-1FF323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400	CMOS	172		1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No		e0	1098 MHz		172		19 mm
XC7A50T-L2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	.93 V	4075		250		0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC6SLX100T-4CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes			CMOS	296			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1		30 s	296	260 °C (500 °F)	19 mm
XC3120-5PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.1 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Typical gates = 1000-1500		188 MHz		58		24.2316 mm
XC3142-4PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS	74	3000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	3.3 ns	144 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	230 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC7K160T-2LFBG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	162240	Yes	.93 V	12675		185		0.9		Grid Array	BGA484,22X22,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	12675 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4	2.54 mm	23 mm			e1		30 s	185	250 °C (482 °F)	23 mm
XC3090-100PQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	320	Yes	5.5 V	320	CMOS	138	5000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	7 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e0	100 MHz	30 s	138	225 °C (437 °F)	28 mm
XCKU115-3FLVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920		832		1		Grid Array	BGA2104,46X46,40		.97 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XC2VP40-6FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	0.32 ns	4848 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1200 MHz	30 s	416	225 °C (437 °F)	27 mm
XCVU080-2FFVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672		832		.95		Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		672 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.81 mm	42.5 mm			e1		30 s	832	245 °C (473 °F)	42.5 mm
XC3142-3PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes			CMOS	74		5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0		30 s	74	225 °C (437 °F)
XCKU15P-2FFVE1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668		0.85		Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XC3030-50PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	74	3000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)		100 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 74 I/OS; 360 flip-flops	e0	50 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC6VHX565T-1FF1923I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V		CMOS	720		1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1924		3.85 mm	45 mm	No		e0	1098 MHz		720		45 mm
XC3190-3PG175I	Xilinx	FPGA	Industrial	Pin/Peg	175	PGA	Square	Ceramic	320	No			CMOS	144		5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)		Perpendicular	S-XPGA-P175				No					144
XC6VLX240T-1FFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS	720		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e1	1098 MHz	30 s	720	245 °C (473 °F)	42.5 mm
XCV3200E-8FG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	73008	Yes	1.89 V	16224	CMOS	804	876096	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.4 ns	16224 CLBS, 876096 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B1156	1	2.6 mm	35 mm	No			416 MHz		804		35 mm
XCVU13P-1FHGC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000		832		0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	52.5 mm						832		52.5 mm
XQ6VSX475T-2RFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V	37200	CMOS	840		1		Grid Array	BGA1759,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.67 ns	37200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm			e1			840		42.5 mm
XCVU190-1FLGC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	1800		702		.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1800 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1			702		47.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.