Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5VSX50T-2FF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS	480		1		1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	4080 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	480	225 °C (437 °F)	35 mm
XC5VTX150T-1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	148480	Yes	1.05 V	11600	CMOS	360		1		1,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	11600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0		30 s	360	225 °C (437 °F)	35 mm
XC6SLX100-2FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	326		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	326	225 °C (437 °F)	23 mm
XC6VLX240T-3FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS	600					Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.59 ns	18840 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e0	1412 MHz		600		35 mm
XCV405E-7FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8		1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	2400 CLBS, 129600 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	400 MHz	30 s	404	225 °C (437 °F)	27 mm
XC7A15T-L2CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	16640	Yes	.93 V	1300		250		0.9			Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	10 mm
XC5VLX220-1FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280		800		1		1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	17280 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1		30 s	800	225 °C (437 °F)	42.5 mm
XC3042A-7VQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS	82	2000	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	5.1 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 3000 Logic gates	e0	113 MHz	30 s	82	240 °C (464 °F)	14 mm
XCKU040-2SFVA784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520		0.95		0.95 V	Grid Array, Fine Pitch	BGA784,28X28,32	Field Programmable Gate Arrays	.922 V	.8 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm	No		e1			520		23 mm
XC6SLX25T-N3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	250		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz	30 s	250	225 °C (437 °F)	23 mm
XCVU7P-2FLVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.876 V	98520		832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		98520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XC7A25T-2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XC3S400A-4FG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	311	400000	1.2		1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	667 MHz	30 s	248	225 °C (437 °F)	21 mm
XCKU15P-L1FFVA1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340		668		0.72			Grid Array	BGA1760,42X42,40		.698 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1			668		42.5 mm
XC3064-50PG132ISPC0107	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	224	CMOS		6400	5			Grid Array			4.5 V	2.54 mm	85 °C (185 °F)		224 CLBS, 6400 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		50 MHz				37.084 mm
XC7A50T-L2FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	52160	Yes	.93 V	4075		250		0.9			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7A12T-L2CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	12800	Yes	.93 V	1000	HKMG	150		0.9			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.87 V	.8 mm	100 °C (212 °F)	1.51 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC6SLX150-1LFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	500 MHz				23 mm
XC5VTX150T-2FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	148480	Yes	1.05 V	11600	CMOS	680		1		1,2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	11600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm	No		e0			680		42.5 mm
XC7A12T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	150	245 °C (473 °F)	35 mm
XC5VLX155T-2FFG1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		680		1		1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	12160 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e1		30 s	680	245 °C (473 °F)	42.5 mm
XC6SLX75-3NCS484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831		328		1.2			Grid Array, Fine Pitch	BGA484,22X22,32		1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			328		19 mm
XC6SLX150T-N3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	396		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	806 MHz	30 s	396	250 °C (482 °F)	27 mm
XC6VLX240T-1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS	720		1		1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC7A50T-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XC6VLX195T-L1FF784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	199680	Yes	.93 V		CMOS	400		.9		1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e0	1098 MHz	30 s	400	220 °C (428 °F)	29 mm
XC3064-70PQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	224	Yes	5.5 V	224	CMOS	120	3500	5		5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	9 ns	224 CLBS, 3500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA	e0	70 MHz	30 s	120	225 °C (437 °F)	28 mm
XCV405E-8BG560I	Xilinx	FPGA	Industrial	Ball	560	LBGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS	404	129600	1.8		1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.4 ns	2400 CLBS, 129600 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	416 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC6VLX365T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	.93 V		CMOS	600		.9		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6SLX45-L1FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.05 V	3411	CMOS	316		1		1,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	3411 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1		30 s	316	250 °C (482 °F)	23 mm
XC7A50T-1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		250		10 mm
XC6VLX550T-L1FFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	.93 V		CMOS	840		.9		1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e1	1098 MHz	30 s	840	245 °C (473 °F)	42.5 mm
XCKU035-3SFVA784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520		1			Grid Array, Fine Pitch	BGA784,28X28,32		.97 V	.8 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm			e1			520		23 mm
XCKU115-1LFLVD1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520	CMOS	832		0.95	Tray		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm			e1		30 s	832	245 °C (473 °F)	45 mm
XC5VFX70T-1FFV1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	5600	CMOS	640		1			Grid Array	BGA1136,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	5600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm			e1		30 s	640	245 °C (473 °F)	35 mm
XC6SLX25T-3NFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz				23 mm
XCS300E-6FT256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V		CMOS	329		1.8		1.8,2.5,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3		17 mm	No		e0	357 MHz		329		17 mm
XQ5VLX110-1EF676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640	CMOS	440		1		1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676		3 mm	27 mm	No		e0	1098 MHz		440		27 mm
XC7A200T-3CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500		1			Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	0.94 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1412 MHz		500		10 mm
XC5VLX30T-2FF323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172		1		1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	2400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No		e0		30 s	172	225 °C (437 °F)	19 mm
XC4008-5MQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Metal	770	Yes	5.5 V	324	CMOS	144	6500	5		5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	4.5 ns	324 CLBS, 6500 Gates	-40 °C (-40 °F)		Quad	S-MQFP-G208	1	3.68 mm	27.64 mm	No	936 flip-flops; typical gates = 6500-8000		133.3 MHz		144		27.64 mm
XC4005-5PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	5.5 V	196	CMOS	112	4000	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.5 ns	196 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	616 flip-flops; typical gates = 4000-5000	e0	133.3 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC6SLX25-N3FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	186		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	806 MHz	30 s	186	225 °C (437 °F)	17 mm
XC6VLX365T-L1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	364032	Yes	.93 V		CMOS	720		.9		1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC5VLX155-2FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		800		1		1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	12160 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0		30 s	800	225 °C (437 °F)	42.5 mm
XC3190-5PG175I	Xilinx	FPGA	Industrial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No	5.5 V	320	CMOS	144	5000	5		5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	4.1 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; typical gates = 5000 - 7500		190 MHz		144		42.164 mm
XC6SLX75-N3FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	280		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz	30 s	280	250 °C (482 °F)	23 mm
XCVU095-1FFVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768		832		.95			Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.