Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3142-4PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.5 V	144	CMOS	74	3000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	3.3 ns	144 CLBS, 3000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		230 MHz		74		27.94 mm
XC7A200T-L2CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	215360	Yes	.93 V	16825		500		0.9		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	500	260 °C (500 °F)	10 mm
XC6SLX75T-2FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	320		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	667 MHz	30 s	320	225 °C (437 °F)	27 mm
XC4013D-5BG225I	Xilinx	FPGA	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm	85 °C (185 °F)	4.5 ns	576 CLBS, 10000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225	3	2.165 mm	27 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	133.3 MHz	30 s	192	225 °C (437 °F)	27 mm
XC3S700A-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	161	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	148	225 °C (437 °F)	17 mm
XC3190-3PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	QFP	Square	Plastic/Epoxy	320	Yes			CMOS	144		5	5 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays		.5 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3			No		e0		30 s	144	225 °C (437 °F)
XC6SLX45-2FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	358		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	3411 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	667 MHz	30 s	358	225 °C (437 °F)	27 mm
XC3S1600E-4FG400I	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	304	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	572 MHz	30 s	132	225 °C (437 °F)	21 mm
XC5VFX100T-2FFG1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	CMOS	640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	8000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	640	245 °C (473 °F)	35 mm
XC5VTX150T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	148480	Yes	1.05 V	11600	CMOS	360		1	1,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	11600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1		30 s	360	245 °C (473 °F)	35 mm
XC5VFX200T-1FFV1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	196608	Yes	1.05 V	15360	CMOS	960		1		Grid Array	BGA1738,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	15360 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm					30 s	960	245 °C (473 °F)	42.5 mm
XC6SLX100-1LFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	500 MHz				23 mm
XCS300E-6PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	QFP	Square	Plastic/Epoxy	6912	Yes	1.89 V		CMOS	329		1.8	1.8,2.5,3.3 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3		28 mm	No		e0	357 MHz	30 s	329	225 °C (437 °F)	28 mm
XC4013-5BG225I	Xilinx	FPGA	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm	85 °C (185 °F)	4.5 ns	576 CLBS, 10000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225	3	2.165 mm	27 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	133.3 MHz	30 s	192	225 °C (437 °F)	27 mm
XC7K325T-2LFBG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	.93 V	25475		350		0.9		Grid Array	BGA900,30X30,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	25475 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e1		30 s	350	245 °C (473 °F)	31 mm
XC8101-ESPQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	384	CMOS		1248	5		Flatpack			4.5 V	.65 mm	85 °C (185 °F)	5.5 ns	384 CLBS, 1248 Gates	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.4 mm	14 mm	No	MAX 78 I/OS; MAX 192 flip-flops; OTP based						20 mm
XC6VLX365T-L1FFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	364032	Yes	.93 V		CMOS	720		.9	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e1	1098 MHz	30 s	720	245 °C (473 °F)	42.5 mm
XC3130-4PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	3.3 ns	100 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	4.699 mm	29.3116 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	230 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC6SLX75-L1FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831	CMOS	280		1	1,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0		30 s	280	225 °C (437 °F)	23 mm
XCKU040-L1FBVA900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	530250	Yes	.927 V	1920		520		.9	0.9 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)		1920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	520	245 °C (473 °F)	31 mm
XQ6SLX75T-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831		268		1.2		Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1			268	250 °C (482 °F)	23 mm
XQ7A50T-2CS325I	Xilinx	FPGA	Industrial	Ball	324	FBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG	150		1	1 V	Grid Array, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B324	3		15 mm	No		e0	1286 MHz		150		15 mm
XC6VLX75T-L1FFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	74496	Yes	.93 V		CMOS	360		.9	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1098 MHz	30 s	360	245 °C (473 °F)	29 mm
XC7A35T-L1CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600		250		0.95		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		250		10 mm
XC7A35T-3CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	0.94 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	10 mm
XC4005-6PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	196	Yes	5.5 V	196	CMOS	112	4000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	6 ns	196 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	616 flip-flops; typical gates = 4000-5000	e0	90.9 MHz	30 s	112	225 °C (437 °F)	28 mm
XC5VLX155T-1FFV1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		680		1		Grid Array	BGA1738,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	12160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm					30 s	680	245 °C (473 °F)	42.5 mm
XC3S1400AN-4FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	375	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No			667 MHz		288		23 mm
XC6VLX240T-1LFFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	.97 V	18840	CMOS	600				Grid Array	BGA1156,34X34,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	18840 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XC6VHX380T-1FFG1155I	Xilinx	FPGA	Industrial	Ball	1155	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	440		1	1,1.2/2.5 V	Grid Array	BGA1155,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1155	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	440	245 °C (473 °F)	35 mm
XCVU125-1FLVC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200		884		.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.29 mm	47.5 mm			e1		30 s	884	245 °C (473 °F)	47.5 mm
XC6VLX550T-1FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS	1200		1	1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1098 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC7K70T-2LFBG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	65600	Yes	.93 V	5125		200		0.9		Grid Array	BGA676,26X26,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	5125 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1			200		27 mm
XC4006-5PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	608	Yes	5.5 V	256	CMOS	128	5000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	4.5 ns	256 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	768 flip-flops; typical gates = 5000-6000	e0	133.3 MHz	30 s	128	225 °C (437 °F)	28 mm
XC3090L-8TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	320	Yes	3.6 V	320	CMOS	122	5000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	6.7 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 6000 Logic gates	e0	80 MHz	30 s	122	225 °C (437 °F)	20 mm
XC2S15-5TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	432	Yes	2.625 V	96		86	15000	2.5	1.5/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	96 CLBS, 15000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	263 MHz	30 s	86	260 °C (500 °F)	20 mm
XC4003-6PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	238	Yes	5.5 V	100	CMOS	61	2500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	6 ns	100 CLBS, 2500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 2500-3000	e0	90.9 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC6VHX565T-2FFG1923I	Xilinx	FPGA	Industrial	Ball	1923	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V		CMOS	720		1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No		e1	1286 MHz	30 s	720	245 °C (473 °F)	45 mm
XCV3200E-7FGG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	73008	Yes	1.89 V	18252	CMOS	804		1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1156			35 mm	No			400 MHz		804		35 mm
XC7A100T-1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC2064-100PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	34	600	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	8 ns	64 CLBS, 600 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	122 flip-flops; typical gates = 600-1000	e0	100 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3042A-7PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	HPGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.5 V	144	CMOS	74	2000	5	5 V	Grid Array, Heat Sink/Slug	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	5.1 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Max usable 3000 Logic gates		113 MHz		74		27.94 mm
XC7A12T-L1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG	150		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	17 mm
XC5VFX100T-1FF1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	CMOS	680		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	8000 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e0		30 s	680	225 °C (437 °F)	42.5 mm
XC5VLX50T-2FFG1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	46080	Yes	10.5 V	3600		480		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	3600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	480	245 °C (473 °F)	35 mm
XC3195-3PP175I	Xilinx	FPGA	Industrial	Pin/Peg	175	PGA	Square	Plastic/Epoxy	484	No			CMOS	144		5	5 V	Grid Array	PGA175,16X16	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)		Perpendicular	S-PPGA-P175				No					144
XC2VP40-5FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	416		1.5		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)	0.36 ns	4848 CLBS	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	1050 MHz	30 s	416	225 °C (437 °F)	27 mm
XC3142-5PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS	82	3000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	190 MHz	30 s	82	225 °C (437 °F)	20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.