Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU115-1LFLVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520	CMOS		832		0.95	Tray		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.71 mm	40 mm			e1		30 s	832	245 °C (473 °F)	40 mm
XC6VLX130T-L1FFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V		CMOS		240		.9		1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC3064-100PQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	224	Yes	5.5 V	224	CMOS		120	3500	5		5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	7 ns	224 CLBS, 3500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA	e0	100 MHz	30 s	120	225 °C (437 °F)	28 mm
XCVU160-1FLGB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	.979 V	1560			702		.95			Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1560 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1			702		47.5 mm
XCKU085-3FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190			676		1			Grid Array	BGA1517,39X39,40		.97 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	676	245 °C (473 °F)	40 mm
XC3064A-7PP132I	Xilinx	FPGA	Industrial	Pin/Peg	132	HPGA	Square	Plastic/Epoxy	224	No	5.5 V	224	CMOS		110	3500	5		5 V	Grid Array, Heat Sink/Slug	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	5.1 ns	224 CLBS, 3500 Gates	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	Max usable 4500 Logic gates	e0	113 MHz		110		37.084 mm
XC6VLX365T-1FFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V		CMOS		720		1		1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e1	1098 MHz	30 s	720	245 °C (473 °F)	42.5 mm
XC3120-3PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.5 V	64	CMOS		64	1000	5		5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	2.7 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1000-1500		270 MHz		64		27.94 mm
XC3S1600E-4FGG484IS1	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS		376	1600000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	572 MHz	30 s	294	250 °C (482 °F)	23 mm
XCVU11P-2FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000			624		0.85			Grid Array	BGA2577,51X51,40		.825 V	1 mm	100 °C (212 °F)		162000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577		4.24 mm	52.5 mm						624		52.5 mm
XC6SLX100T-3FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		498		1.2		1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	862 MHz	30 s	498	225 °C (437 °F)	31 mm
XC6SLX9-3NFT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	806 MHz				17 mm
XC7A200T-1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825			500		1			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	500	260 °C (500 °F)	15 mm
XC5VLX50T-1FFV1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	46080	Yes	10.5 V	3600			480		1			Grid Array	BGA1136,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.9 ns	3600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm			e1		30 s	480	245 °C (473 °F)	35 mm
XC6SLX75-3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		280		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	862 MHz	30 s	280	225 °C (437 °F)	23 mm
XC7A200T-1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825			500		1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	500	260 °C (500 °F)	17 mm
XC6SLX100T-N3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		376		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	806 MHz	30 s	376	250 °C (482 °F)	27 mm
XC7K160T-2LFFG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	162240	Yes	.93 V	12675			250		0.9			Grid Array	BGA676,26X26,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	12675 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	3.37 mm	27 mm			e1		30 s	250	250 °C (482 °F)	27 mm
XC6SLX150-1LFGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	500 MHz				23 mm
XC6SLX150-2FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		570		1.2		1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	667 MHz	30 s	570	225 °C (437 °F)	31 mm
XC6SLX75-L1FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831	CMOS		400		1		1,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1		30 s	400	250 °C (482 °F)	27 mm
XC5VLX85T-2FF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480			480		1		1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	6480 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	480	225 °C (437 °F)	35 mm
XC6VLX550T-1LFF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	.97 V	42960	CMOS		1200					Grid Array	BGA1760,42X42,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	42960 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm			e0			1200		42.5 mm
XC2018-33PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic	100	No			CMOS		74		5		5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)		Perpendicular	S-XPGA-P84				No			33 MHz		74
XC6SLX100-N3FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		480		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	806 MHz	30 s	480	225 °C (437 °F)	27 mm
XC2S200-5PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			144	200000	2.5		1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)	0.7 ns	1176 CLBS, 200000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	263 MHz		140		28 mm
XA3S400-4FGG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896		AEC-Q100	264	400000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	125 MHz	30 s	264	250 °C (482 °F)	23 mm
XCKU11P-2FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320			512		0.85			Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	512	245 °C (473 °F)	40 mm
XCKU5P-2FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120			304		0.85			Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XC3090-100PG175I	Xilinx	FPGA	Industrial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No	5.5 V	320	CMOS		144	5000	5		5 V	Grid Array	PGA176,16X16MOD	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	7 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P175		3.81 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA		100 MHz		144		42.164 mm
XC4013-5PQ240I	Xilinx	FPGA	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	576	Yes	5.5 V	576	CMOS		192	10000	5		5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	4.5 ns	576 CLBS, 10000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	3.75 mm	32 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	133.3 MHz	30 s	192	225 °C (437 °F)	32 mm
XC3S250E-4FTG256IS1	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		172	250000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	132	260 °C (500 °F)	17 mm
XCKU085-L1FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.92 V	62190			676		0.9		0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.88 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	676	245 °C (473 °F)	40 mm
XC5VLX155T-2FFG1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160			640		1		1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	12160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	640	245 °C (473 °F)	35 mm
XC6SLX75-1LCSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	500 MHz	30 s		260 °C (500 °F)	19 mm
XC7A50T-3FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1412 MHz	30 s	250	245 °C (473 °F)	35 mm
XC5VLX20T-2FFV323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	19968	Yes	1.05 V	1560	CMOS		172		1			Grid Array	BGA323,18X18,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	1560 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B323	4	2.85 mm	19 mm			e1		30 s	172	250 °C (482 °F)	19 mm
XC6SLX100-1LFG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	500 MHz				27 mm
XC3020-70PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		64	1000	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	9 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	70 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC6SLX150T-N3FGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		540		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	806 MHz		540		31 mm
XC2064LPC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	3.6 V	64	CMOS			1000	3.3			Chip Carrier			3 V	1.27 mm	85 °C (185 °F)		64 CLBS, 1000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68		4.445 mm	24.2316 mm	No	MAX 58 I/OS; 800 to 1000 available gates						24.2316 mm
XC6VLX760-1LFF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	.97 V	59280	CMOS		1200					Grid Array	BGA1760,42X42,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	59280 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm			e0			1200		42.5 mm
XC6SLX100T-4FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes			CMOS		296				1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0		30 s	296	225 °C (437 °F)	23 mm
XC5VLX155T-2FFV1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160			680		1			Grid Array	BGA1738,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	12160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm					30 s	680	245 °C (473 °F)	42.5 mm
XC6SLX45-L1CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.05 V	3411	CMOS		310		1		1,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.46 ns	3411 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1		30 s	310	260 °C (500 °F)	19 mm
XC6SLX75T-4FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes			CMOS		268				1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0		30 s	268	225 °C (437 °F)	23 mm
XC3090-70PQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	320	Yes	5.5 V	320	CMOS		138	5000	5		5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	9 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e0	70 MHz	30 s	138	225 °C (437 °F)	28 mm
XC6VSX475T-1LFF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	.97 V	37200	CMOS		600					Grid Array	BGA1156,34X34,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	37200 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e0			600		35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.