Industrial Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VSX315T-1FFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS		720		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e1	1098 MHz	30 s	720	245 °C (473 °F)	42.5 mm
XCKU115-3FLVD1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	82920			832		1		Grid Array	BGA1924,44X44,40		.97 V	1 mm	100 °C (212 °F)		82920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm			e1		30 s	832	245 °C (473 °F)	45 mm
XC5VLX110-2FF676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	8640 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e0		30 s	440	225 °C (437 °F)	27 mm
XC3142-5PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.5 V	144	CMOS		74	3000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 3000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700		190 MHz		74		27.94 mm
XC6SLX9-N3TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS		102		1.2	1.2,1.2/3.3,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.26 ns	715 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	806 MHz		102		20 mm
XC5VLX30T-1FF323I	Xilinx	FPGA	Industrial	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			172		1	1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	2400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No		e0		30 s	172	225 °C (437 °F)	19 mm
XC3120-5PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS		64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.1 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 1000-1500	e0	188 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC4006-6PQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy	608	Yes	5.5 V	256	CMOS		128	5000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	6 ns	256 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	768 flip-flops; typical gates = 5000-6000	e0	90.9 MHz	30 s	128	225 °C (437 °F)	28 mm
XC6SLX25-3NFGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz	30 s		250 °C (482 °F)	23 mm
XC6SLX45-3NFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz				23 mm
XC6SLX75-N3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		408		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	806 MHz	30 s	408	250 °C (482 °F)	27 mm
XC3042-70PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS		82	2000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	9 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	70 MHz	30 s	82	225 °C (437 °F)	20 mm
XA3S250E-4CPG132I	Xilinx	FPGA	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	AEC-Q100	92	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	4.88 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XCKU11P-L1FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.742 V	37320			512		0.72		Grid Array	BGA1517,39X39,40		.698 V	1 mm	100 °C (212 °F)		37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1			512		40 mm
XC5VTX150T-1FFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	148480	Yes	1.05 V	11600	CMOS		680		1	1,2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	11600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e1		30 s	680	245 °C (473 °F)	42.5 mm
XC6VHX255T-1FFG1923I	Xilinx	FPGA	Industrial	Ball	1923	BGA	Square	Plastic/Epoxy	253440	Yes	1.05 V		CMOS		480		1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No		e1	1098 MHz	30 s	480	245 °C (473 °F)	45 mm
XCVU440-2FLGA2892I	Xilinx	FPGA	Industrial	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880			1456		.95		Grid Array	BGA2892,54X54,40		.922 V	1 mm	100 °C (212 °F)		2880 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm			e1			1456		55 mm
XCKU095-L1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200			702		0.9		Grid Array	BGA1156,34X34,40		.88 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm		Also Operates at 0.95 V nominal supply	e1			702		35 mm
XQ5VLX220T-1EF1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	221184	Yes	1.05 V	17280	CMOS		680		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1738		3.5 mm	42.5 mm	No		e0	1098 MHz		680		42.5 mm
XC7A12T-3CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	0.94 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	10 mm
XQ6SLX75-1LCS484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831			328		1		Grid Array, Fine Pitch	BGA484,22X22,32		.95 V	.8 mm	100 °C (212 °F)	0.46 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			328		19 mm
XC6SLX100T-3FGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		498		1.2	1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	862 MHz	30 s	498	250 °C (482 °F)	31 mm
XC2S400E-6TGGQGG144I	Xilinx	FPGA	Industrial	G	144	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz				20 mm
XC7A50T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	250	245 °C (473 °F)	35 mm
XC6VLX240T-1LFFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	.97 V	18840	CMOS		720				Grid Array	BGA1759,42X42,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	18840 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm			e1		30 s	720	245 °C (473 °F)	42.5 mm
XC3S100E-4TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS		108	100000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	572 MHz		80		20 mm
XC3030-70PC84ISPC0104	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS			3000	5		Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)	9 ns	100 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				29.3116 mm
XC7A35T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600			250		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	250	245 °C (473 °F)	35 mm
XC4010D-5BG225I	Xilinx	FPGA	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS		160	8000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm	85 °C (185 °F)	4.5 ns	400 CLBS, 8000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225	3	2.165 mm	27 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	133.3 MHz	30 s	160	225 °C (437 °F)	27 mm
XC5VLX155-1FF1153I	Xilinx	FPGA	Industrial	Ball	1153	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160			800		1	1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	12160 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No		e0		30 s	800	225 °C (437 °F)	35 mm
XC4002A-6PG120I	Xilinx	FPGA	Industrial	Pin/Peg	120	PGA	Square	Ceramic, Metal-Sealed Cofired	152	No	5.5 V	64	CMOS		80	1600	5	5 V	Grid Array	PGA120,13X13	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	6 ns	64 CLBS, 1600 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P120		3.81 mm	34.544 mm	No	256 flip-flops; typical gates = 1600-2000		90.9 MHz		80		34.544 mm
XC6VLX550T-1LFF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	.97 V	42960	CMOS		840				Grid Array	BGA1759,42X42,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	42960 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm			e0			840		42.5 mm
XC6VSX475T-1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS		840		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	840	225 °C (437 °F)	42.5 mm
XC7A75T-3CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1412 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7K480T-2LFFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes	.93 V	37325			400		0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	37325 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm			e1		30 s	400	250 °C (482 °F)	35 mm
XC3042L-8VQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	144	Yes	3.6 V	144	CMOS		82	2000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	6.7 ns	144 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 3000 Logic gates	e0	80 MHz	30 s	82	240 °C (464 °F)	14 mm
XC3020-50PQ100ISPC0110	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	64	CMOS			2000	5		Flatpack			4.5 V	.65 mm	85 °C (185 °F)		64 CLBS, 2000 Gates	-40 °C (-40 °F)		Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 64 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C		50 MHz				20 mm
XC7A25T-L1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825	HKMG		150		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	17 mm
XC3064-70PG132ISPC0108	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	224	CMOS			6400	5		Grid Array			4.5 V	2.54 mm	85 °C (185 °F)	9 ns	224 CLBS, 6400 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		70 MHz				37.084 mm
XC6VLX130T-L1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V		CMOS		600		.9	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6SLX150T-4FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes			CMOS		296			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0		30 s	296	225 °C (437 °F)	23 mm
XC5VSX50T-2FFV665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		360		1		Grid Array	BGA665,26X26,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	4080 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm			e1		30 s	360	250 °C (482 °F)	27 mm
XC7A12T-1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC5VLX85-1FF676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480			440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	6480 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e0		30 s	440	225 °C (437 °F)	27 mm
XCKU060-3FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	41460			624		1		Grid Array	BGA1156,34X34,40		.97 V	1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1			624		35 mm
XC8106-ESPQ160I	Xilinx	FPGA	Industrial	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.5 V	1728	CMOS			5616	5		Flatpack			4.5 V	.65 mm	85 °C (185 °F)	5.5 ns	1728 CLBS, 5616 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	MAX 130 I/OS; MAX 864 flip-flops; OTP based						28 mm
XC3130-5PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS		34	2000	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	MAX 80 I/OS; 360 flip-flops; typical gates = 2000 - 2700	e0	190 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3090-50PG175I	Xilinx	FPGA	Industrial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired	320	No	5.5 V	320	CMOS		144	9000	5	5 V	Grid Array	PGA176,16X16MOD	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)		320 CLBS, 9000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P175		3.5052 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops		50 MHz		144		42.164 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.