Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VLX75T-1LFFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	74496	Yes	.97 V	5820	CMOS	360					Grid Array	BGA784,28X28,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	5820 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	2.86 mm	29 mm			e1			360		29 mm
XC2018-33PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes			CMOS	74		5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays		1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3			No		e0	33 MHz	30 s	74	225 °C (437 °F)
XCKU115-1LFLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520	CMOS	624		0.95	Tray		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm			e1		30 s	624	245 °C (473 °F)	40 mm
XC3042-70PP132ISPC0107	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.5 V	144	CMOS		4200	5			Grid Array			4.5 V	2.54 mm	85 °C (185 °F)	9 ns	144 CLBS, 4200 Gates	-40 °C (-40 °F)		Perpendicular	S-PPGA-P132		4.191 mm	37.084 mm	No	MAX 96 I/OS; 480 flip-flops; power-down supplier current = 3 µA @ VCC = 3.2 V & T = 25°C		70 MHz				37.084 mm
XC6VLX550T-1FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS	1200		1		1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC7VX980T-2LFFG1930I	Xilinx	FPGA	Industrial	Ball	1930	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500		900		1			Grid Array	BGA1930,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	76500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930	4	3.65 mm	45 mm			e1			900		45 mm
XCVU125-2FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200		884		.95			Grid Array	BGA1760,42X42,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm			e1		30 s	884	245 °C (473 °F)	42.5 mm
XC6SLX100-L1CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.05 V	7911	CMOS	320		1		1,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.46 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1			320		19 mm
XC6VSX315T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6SLX9-L1FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	9152	Yes	1.05 V	715	CMOS	186		1		1,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s	186	260 °C (500 °F)	17 mm
XC5VLX110T-2FF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		640		1		1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	8640 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	640	225 °C (437 °F)	35 mm
XC3064-50PG132ISPC0108	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	224	CMOS		6400	5			Grid Array			4.5 V	2.54 mm	85 °C (185 °F)		224 CLBS, 6400 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P132		4.318 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops; power-down supplier current = 4 µA @ VCC = 3.2 V & T = 25°C		50 MHz				37.084 mm
XCVU125-1FLVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200		884		.95			Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	884	245 °C (473 °F)	47.5 mm
XC4013-6PQ256I	Xilinx	FPGA	Industrial	Gull Wing	256	QFP		Plastic/Epoxy	1368	Yes			CMOS	192		5		5 V	Flatpack	QFP256(UNSPEC)	Field Programmable Gate Arrays			85 °C (185 °F)			-40 °C (-40 °F)		Quad					No			90.9 MHz		192
XC6SLX45-1LCSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2			Grid Array, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	500 MHz	30 s		260 °C (500 °F)	19 mm
XC5VTX240T-1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS	680		1		1,2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	18720 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm	No		e0			680		42.5 mm
XCVU13P-2FSGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000		832		0.85			Grid Array	BGA2577,51X51,40		.825 V	1 mm	100 °C (212 °F)		216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577		4.51 mm	52.5 mm						832		52.5 mm
XC3090L-8TQ176I	Xilinx	FPGA	Industrial	Gull Wing	176	LFQFP	Square	Plastic/Epoxy	320	Yes	3.6 V	320	CMOS	144	5000	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	6.7 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G176	3	1.6 mm	24 mm	No	Max usable 6000 Logic gates	e0	80 MHz	30 s	144	225 °C (437 °F)	24 mm
XC6SLX16-2CS225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139		160		1.2			Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B225		1.4 mm	13 mm			e0			160		13 mm
XC5VLX85-2FFG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480		440		1		1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	6480 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e1		30 s	440	250 °C (482 °F)	27 mm
XC6SLX4-N3CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V	300				1.2			Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	300 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm			e1		30 s		260 °C (500 °F)	13 mm
XQ6VSX475T-2RFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V	37200	CMOS	600		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.67 ns	37200 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XC6SLX25-2FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	266		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	1879 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	266	225 °C (437 °F)	23 mm
XC6VLX365T-L1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	.93 V		CMOS	600		.9		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XQ6VLX240T-1LRFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	241152	Yes	.93 V	18840	CMOS	400		0.9			Grid Array	BGA784,28X28,32		.87 V	1 mm	100 °C (212 °F)	0.85 ns	18840 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.17 mm	29 mm			e1			400		29 mm
XC6SLX150-1LFGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	500 MHz				31 mm
XC6SLX25-1LCSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2			Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	500 MHz				15 mm
XCVU27P-2FIGD2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	128700		676		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		128700 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.59 mm	52.5 mm						676		52.5 mm
XC3030L-8PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	3.6 V	100	CMOS	74	1500	3.3		3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	6.7 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 2000 Logic gates	e0	80 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC6SLX45T-3NCSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2			Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz				15 mm
XCKU3P-1FFVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340		304		0.85			Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
XC6SLX9-3NCSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2			Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	806 MHz				15 mm
XC3020-100PC68I	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	58	1000	5		5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	7 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA		100 MHz		58		24.2316 mm
XQ6VLX130T-1LRFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V	10000	CMOS	600		0.9			Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	0.85 ns	10000 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XC4003H-6PG191I	Xilinx	FPGA	Industrial	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired	238	No	5.5 V	100	CMOS	160	2500	5		5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	6 ns	100 CLBS, 2500 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P191		4.064 mm	47.244 mm	No	200 flip-flops; typical gates = 2500-3000		90.9 MHz		160		47.244 mm
XC6VLX550T-L1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	.93 V		CMOS	840		.9		1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	840	225 °C (437 °F)	42.5 mm
XC6VHX250T-2FFG1154I	Xilinx	FPGA	Industrial	Ball	1154	BGA	Square	Plastic/Epoxy	251904	Yes	1.05 V		CMOS	320		1		1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1154	4	3.5 mm	35 mm	No		e1	1286 MHz	30 s	320	245 °C (473 °F)	35 mm
XC2S150-5FG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864		264	150000	2.5		1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)	0.7 ns	864 CLBS, 150000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	263 MHz	30 s	260	225 °C (437 °F)	23 mm
XC3S1600E-4FG484IS1	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	376	1600000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	572 MHz	30 s	294	225 °C (437 °F)	23 mm
XC7A35T-3FTG256I	Xilinx	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	17 mm
XC3064-50PP132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.5 V	224	CMOS	110	6400	5		5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)		224 CLBS, 6400 Gates	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	MAX 110 I/OS; 688 flip-flops	e0	50 MHz		110		37.084 mm
XC5VLX30-1FF324I	Xilinx	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		220		1		1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	2400 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No		e0		30 s	220	225 °C (437 °F)	19 mm
XCV812E-7FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS	556	254016	1.8		1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	4704 CLBS, 254016 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	400 MHz	30 s	556	225 °C (437 °F)	31 mm
XC7A100T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	300	245 °C (473 °F)	35 mm
XC3030-70PQ100ISPC0104	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.5 V	100	CMOS		3000	5			Flatpack			4.5 V	.65 mm	85 °C (185 °F)	9 ns	100 CLBS, 3000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100		3.1496 mm	14 mm	No	MAX 80 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				20 mm
XCKU15P-L1FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340		668		0.72			Grid Array	BGA1517,39X39,40		.698 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1			668		40 mm
XC3120-5PG84I	Xilinx	FPGA	Industrial	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	64	No	5.5 V	64	CMOS	64	1000	5		5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	4.1 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1000-1500		188 MHz		64		27.94 mm
XC6VLX195T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.