Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU115-1LFLVF1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520	CMOS	728		0.95	Tray		Grid Array	BGA1924,44X44,40		.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm			e1		30 s	728	245 °C (473 °F)	45 mm
XC7A200T-3CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500		1			Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	0.94 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1412 MHz	30 s	500	260 °C (500 °F)	10 mm
XC6VLX240T-1LFFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	241152	Yes	.97 V	18840	CMOS	400					Grid Array	BGA784,28X28,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	18840 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	2.86 mm	29 mm			e1			400		29 mm
XQ4VFX100-11FFG1152I	Xilinx	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.26 V								Grid Array			1.14 V	1 mm	100 °C (212 °F)	0.66 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.4 mm	35 mm								35 mm
XCKU15P-1FFVE1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668		0.85			Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XCVU7P-2FLVC2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.876 V	98520		832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		98520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XC7A15T-3CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	0.94 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1412 MHz		250		10 mm
XCVU190-1FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	2349900	Yes	.979 V	1800		702		.95			Grid Array	BGA2577,51X51,40		.922 V	1 mm	100 °C (212 °F)		1800 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2577		4.01 mm	52.5 mm			e1			702		52.5 mm
XC3030-100PC44I	Xilinx	FPGA	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.5 V	100	CMOS	34	1500	5		5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	7 ns	100 CLBS, 1500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.318 mm	16.5862 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	100 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XCS600E-6FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V		CMOS	514		1.8		1.8,2.5,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3		27 mm	No		e0	357 MHz	30 s	514	225 °C (437 °F)	27 mm
XC5VLX50T-2FF1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	46080	Yes	10.5 V	3600		480		1		1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	3600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	480	225 °C (437 °F)	35 mm
XC3S1400AN-4FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	502	1400000	1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	2816 CLBS, 1400000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	667 MHz	30 s	408	225 °C (437 °F)	27 mm
XC4003A-6PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	238	Yes	5.5 V	100	CMOS	61	2500	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	6 ns	100 CLBS, 2500 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 2500-3000	e0	90.9 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XC6VSX315T-1LFFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	.97 V	24600	CMOS	600					Grid Array	BGA1156,34X34,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	24600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XQ6SLX150T-2FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519		296		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm			e1			296	250 °C (482 °F)	23 mm
XC6VHX565T-2FFG1924I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	566784	Yes	1.05 V		CMOS	640		1		1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm	No		e1	1286 MHz	30 s	640	245 °C (473 °F)	45 mm
XC6VLX365T-1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V		CMOS	720		1		1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC6SLX100T-3NFGG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	806 MHz				31 mm
XC6SLX150-3NFGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz				23 mm
XCS50E-6FT256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	1.89 V		CMOS	182		1.8		1.8,2.5,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3		17 mm	No		e0	357 MHz		182		17 mm
XCKU040-3FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	530250	Yes	1.03 V	30300		520		1			Grid Array	BGA1156,34X34,40		.97 V	1 mm	100 °C (212 °F)		30300 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1		30 s	520	245 °C (473 °F)	35 mm
XCVU080-1FFVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672		832		.95			Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		672 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XC6SLX25-3NFTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2			Grid Array, Low Profile			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	806 MHz				17 mm
XC3090L-8PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	3.6 V	320	CMOS	70	5000	3.3		3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	6.7 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 6000 Logic gates	e0	80 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC6VHX380T-1FF1155I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	440		1		1,1.2/2.5 V	Grid Array	BGA1155,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No		e0	1098 MHz		440		35 mm
XC3020-100PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	64	1000	5		5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	7 ns	64 CLBS, 1000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	100 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC7A200T-L1CPG236I	Xilinx	FPGA	Industrial	Ball	236	LFBGA	Square	Plastic/Epoxy	215360	Yes	.98 V	16825		500		0.95			Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	500	260 °C (500 °F)	10 mm
XC3S1200E-4FG400IS1	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	304	1200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	2168 CLBS, 1200000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	572 MHz	30 s	232	225 °C (437 °F)	21 mm
XC6VHX250T-1FFG1154I	Xilinx	FPGA	Industrial	Ball	1154	BGA	Square	Plastic/Epoxy	251904	Yes	1.05 V		CMOS	320		1		1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1154	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	320	245 °C (473 °F)	35 mm
XC7A25T-L1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825	HKMG	150		0.95			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7V2000T-2FLG1925I	Xilinx	FPGA	Industrial	Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	HKMG	1200		1			Grid Array	BGA1925,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	152700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925		3.75 mm	45 mm			e1			1200		45 mm
XC4025-5PG299I	Xilinx	FPGA	Industrial	Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired	1024	No	5.5 V	1024	CMOS	256	20000	5		5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	4.5 ns	1024 CLBS, 20000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P299		4.2418 mm	52.324 mm	No	2560 flip-flops; typical gates = 20000-25000		133.3 MHz		256		52.324 mm
XC3090-70CQ164I	Xilinx	FPGA	Industrial	Flat	164	QFF	Square	Ceramic, Metal-Sealed Cofired	320	Yes	5.5 V	320	CMOS	142	9000	5		5 V	Flatpack	QFL164,1.2SQ,25	Field Programmable Gate Arrays	4.5 V	.635 mm	85 °C (185 °F)	9 ns	320 CLBS, 9000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-CQFP-F164	1	3.683 mm	27.432 mm	No	MAX 142 I/OS; 928 flip-flops	e0	70 MHz		142		27.432 mm
XC6VLX195T-1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC7A15T-L1CSG325I	Xilinx	FPGA	Industrial	Ball	325	LFBGA	Square	Plastic/Epoxy	16640	Yes	.98 V	1300		250		0.95			Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC3142-5PP132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No			CMOS	96		5		5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays		2.54 mm	85 °C (185 °F)			-40 °C (-40 °F)		Perpendicular	S-PPGA-P132				No					96
XC5VLX155T-1FFG1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		680		1		1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	12160 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e1		30 s	680	245 °C (473 °F)	42.5 mm
XC5VLX50-2FFG1153I	Xilinx	FPGA	Industrial	Ball	1153	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600		560		1		1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	3600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No		e1		30 s	560	245 °C (473 °F)	35 mm
XC6SLX150-3NFG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2			Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	806 MHz				31 mm
XC5VFX30T-2FFV665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	32768	Yes	1.05 V	2560	CMOS	360		1			Grid Array	BGA665,26X26,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	2560 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm			e1		30 s	360	250 °C (482 °F)	27 mm
XC3064-100PP132I	Xilinx	FPGA	Industrial	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.5 V	224	CMOS	110	3500	5		5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	7 ns	224 CLBS, 3500 Gates	-40 °C (-40 °F)		Perpendicular	S-PPGA-P132	1	3.7338 mm	37.084 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA		100 MHz		110		37.084 mm
XC6VLX365T-1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VHX380T-2FFG1154I	Xilinx	FPGA	Industrial	Ball	1154	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	320		1		1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1154	4	3.5 mm	35 mm	No		e1	1286 MHz	30 s	320	245 °C (473 °F)	35 mm
XC4020-5PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	784	Yes	5.5 V	784	CMOS	224	16000	5		5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	4.5 ns	784 CLBS, 16000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	2016 flip-flops; typical gates = 16000-20000	e0	133.3 MHz	30 s	224	225 °C (437 °F)	28 mm
XC3020-70PC68ISPC0110	Xilinx	FPGA	Industrial	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	64	CMOS		2000	5			Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)	9 ns	64 CLBS, 2000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J68		4.699 mm	24.2316 mm	No	MAX 58 I/OS; 256 flip-flops; power-down supplier current = 1 µA @ VCC = 3.2 V & T = 25°C	e0	70 MHz				24.2316 mm
XQ6VSX315T-2RFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V	24600	CMOS	720		1			Grid Array	BGA1759,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.67 ns	24600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm			e1			720		42.5 mm
XC6VLX75T-2FFG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS	240		1		1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e1	1286 MHz	30 s	240	250 °C (482 °F)	23 mm
XC3030-50PC84ISPC0107	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.5 V	100	CMOS		3000	5			Chip Carrier			4.5 V	1.27 mm	85 °C (185 °F)		100 CLBS, 3000 Gates	-40 °C (-40 °F)		Quad	S-PQCC-J84		4.699 mm	29.3116 mm	No	MAX 74 I/OS; 360 flip-flops; power-down supplier current = 2 µA @ VCC = 3.2 V & T = 25°C		50 MHz				29.3116 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.