Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VSX315T-2FFG1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS		720		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e1	1286 MHz	30 s	720	245 °C (473 °F)	42.5 mm
XCVU125-1FLVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	1200			884		.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	884	245 °C (473 °F)	47.5 mm
XCKU035-3FBVA900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391			520		1		Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.8 mm	31 mm			e1		30 s	520	245 °C (473 °F)	31 mm
XCV812E-7BGG560I	Xilinx	FPGA	Industrial	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	1.89 V	4704	CMOS			254016	1.8		Grid Array, Low Profile			1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	4704 CLBS, 254016 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	400 MHz	30 s		260 °C (500 °F)	42.5 mm
XC7A75T-2CPG238I	Xilinx	FPGA	Industrial	Ball	238	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		300		10 mm
XC6SLX25T-4FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes			CMOS		250			1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0		30 s	250	225 °C (437 °F)	23 mm
XQ6VLX130T-1LRFG784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V	10000	CMOS		400		0.9		Grid Array	BGA784,28X28,32		.87 V	1 mm	100 °C (212 °F)	0.85 ns	10000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.17 mm	29 mm			e1			400		29 mm
XC6SLX150-L1FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519	CMOS		498		1	1,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1		30 s	498	250 °C (482 °F)	27 mm
XCKU095-L1FFVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1176000	Yes	.92 V	67200			702		0.9		Grid Array	BGA2104,46X46,40		.88 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm		Also Operates at 0.95 V nominal supply	e1		30 s	702	245 °C (473 °F)	47.5 mm
XC3S100E-4CP132IS1	Xilinx	FPGA	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS		83	100000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	572 MHz	30 s	72	225 °C (437 °F)	8 mm
XC6SLX100-3NCSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz				19 mm
XC6SLX150T-3NFG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	806 MHz				31 mm
XQ6VLX550T-1LRF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	.97 V	42960	CMOS		840				Grid Array	BGA1759,42X42,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	42960 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	4.37 mm	42.5 mm			e0			840		42.5 mm
XA3S700A-4FGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	AEC-Q100	372	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	4.88 ns	1472 CLBS, 700000 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm
XC6SLX25-1LFGG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	500 MHz	30 s		250 °C (482 °F)	23 mm
XC7A25T-1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC6SLX75-1LCS484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831			328		1		Grid Array, Fine Pitch	BGA484,22X22,32		.95 V	.8 mm	100 °C (212 °F)	0.46 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	1.8 mm	19 mm			e0			328		19 mm
XC6VLX240T-1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC7K410T-2LFBG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	.93 V	31775			250		0.9		Grid Array	BGA676,26X26,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	31775 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm			e1			250		27 mm
XC4005-6PQ100I	Xilinx	FPGA	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	196	Yes	5.5 V	196	CMOS		112	4000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)	6 ns	196 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	616 flip-flops; typical gates = 4000-5000	e0	90.9 MHz	30 s	112	225 °C (437 °F)	20 mm
XC3S100E-4CPG132I	Xilinx	FPGA	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS		83	100000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	72	260 °C (500 °F)	8 mm
XCS50E-6PQ208I	Xilinx	FPGA	Industrial	Gull Wing	208	QFP	Square	Plastic/Epoxy	1728	Yes	1.89 V		CMOS		182		1.8	1.8,2.5,3.3 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3		28 mm	No		e0	357 MHz	30 s	182	225 °C (437 °F)	28 mm
XC6SLX4-1LTQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.26 V						1.2		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	500 MHz				20 mm
XA3S250E-4TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	AEC-Q100	108	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	4.88 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s	80	260 °C (500 °F)	20 mm
XC3S200A-4FT256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS		195	200000	1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	160	225 °C (437 °F)	17 mm
XC6VLX130T-L1FF484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V		CMOS		240		.9	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e0	1098 MHz	30 s	240	220 °C (428 °F)	23 mm
XQ6VLX130T-1LFFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V	10000	CMOS		600		0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	0.85 ns	10000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XC3090-70PP175I	Xilinx	FPGA	Industrial	Pin/Peg	175	PGA	Square	Plastic/Epoxy	320	No	5.5 V	320	CMOS		144	5000	5	5 V	Grid Array	PGA176,16X16MOD	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	9 ns	320 CLBS, 5000 Gates	-40 °C (-40 °F)	Tin Lead	Perpendicular	S-PPGA-P175	1	3.937 mm	42.164 mm	No	928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA	e0	70 MHz		144		42.164 mm
XC4013D-6BG225I	Xilinx	FPGA	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS		192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm	85 °C (185 °F)	6 ns	576 CLBS, 10000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225	3	2.165 mm	27 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	90.9 MHz	30 s	192	225 °C (437 °F)	27 mm
XC6SLX100T-2CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		290		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	290	260 °C (500 °F)	19 mm
XCV812E-7BG560I	Xilinx	FPGA	Industrial	Ball	560	LBGA	Square	Plastic/Epoxy	21168	Yes	1.89 V	4704	CMOS		404	254016	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	4704 CLBS, 254016 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	400 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC6SLX150-L1FG900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519	CMOS		570		1	1,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.46 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0		30 s	570	225 °C (437 °F)	31 mm
XC6VLX130T-L1FF784I	Xilinx	FPGA	Industrial	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V		CMOS		400		.9	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e0	1098 MHz	30 s	400	220 °C (428 °F)	29 mm
XC3090-50PG175ISPC0109	Xilinx	FPGA	Industrial	Pin/Peg	175	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V	320	CMOS			9000	5		Grid Array			4.5 V	2.54 mm	85 °C (185 °F)		320 CLBS, 9000 Gates	-40 °C (-40 °F)		Perpendicular	S-CPGA-P175		3.5052 mm	42.164 mm	No	MAX 144 I/OS; 928 flip-flops; power-down supplier current = 5 µA @ VCC = 3.2 V & T = 25°C		50 MHz				42.164 mm
XC4004A-6TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	144	Yes	5.5 V	144	CMOS		96	3200	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm	85 °C (185 °F)	6 ns	144 CLBS, 3200 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	480 flip-flops; typical gates = 3200-4000	e0	90.9 MHz	30 s	96	225 °C (437 °F)	20 mm
XC6SLX75-N3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		280		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	5831 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	806 MHz	30 s	280	225 °C (437 °F)	23 mm
XCKU5P-L1FFVA676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120			304		0.72		Grid Array	BGA676,26X26,40		.698 V	1 mm	100 °C (212 °F)		27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1			304		27 mm
XC6VHX380T-2FF1923I	Xilinx	FPGA	Industrial	Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS		720		1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1924		3.85 mm	45 mm	No		e0	1286 MHz		720		45 mm
XCV405E-8FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.89 V	2400	CMOS			129600	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.4 ns	2400 CLBS, 129600 Gates	-40 °C (-40 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	416 MHz	30 s		250 °C (482 °F)	27 mm
XC4005-6PC84I	Xilinx	FPGA	Industrial	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	5.5 V	196	CMOS		112	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.5 V	1.27 mm	85 °C (185 °F)	6 ns	196 CLBS, 4000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	616 flip-flops; typical gates = 4000-5000	e0	90.9 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC5VTX150T-1FF1759I	Xilinx	FPGA	Industrial	Ball	1759	BGA	Square	Plastic/Epoxy	148480	Yes	1.05 V	11600	CMOS		680		1	1,2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	11600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm	No		e0			680		42.5 mm
XC4013-6BG225I	Xilinx	FPGA	Industrial	Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS		192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm	85 °C (185 °F)	6 ns	576 CLBS, 10000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B225	3	2.165 mm	27 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	90.9 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4020-5PG299I	Xilinx	FPGA	Industrial	Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired	1862	No	5.5 V	784	CMOS		256	16000	5	5 V	Grid Array	PGA299,20X20	Field Programmable Gate Arrays	4.5 V	2.54 mm	85 °C (185 °F)	4.5 ns	784 CLBS, 16000 Gates	-40 °C (-40 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.2418 mm	52.324 mm	No	2016 flip-flops; typical gates = 16000-20000	e3	133.3 MHz		256		52.324 mm
XC3S1600E-4FG400IS1	Xilinx	FPGA	Industrial	Ball	400	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS		304	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	572 MHz	30 s	232	225 °C (437 °F)	21 mm
XC6VLX550T-2FF1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS		1200		1	1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e0	1286 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XCVU13P-2FLGA2577I	Xilinx	FPGA	Industrial	Ball	2577	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000			832		0.85		Grid Array	BGA2577,51X51,40		.825 V	1 mm	100 °C (212 °F)		216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2577		4.24 mm	52.5 mm						832		52.5 mm
XC5VLX330T-2FFV1738I	Xilinx	FPGA	Industrial	Ball	1738	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920			960		1		Grid Array	BGA1738,42X42,40		.95 V	1 mm	100 °C (212 °F)	0.77 ns	25920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm					30 s	960	245 °C (473 °F)	42.5 mm
XC5VLX30-1FFG324I	Xilinx	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400			220		1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	2400 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No		e1		30 s	220	250 °C (482 °F)	19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.