Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP1C12F256I7N	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206			185		1.5	1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	100 °C (212 °F)		1206 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No		e1	320 MHz		185		17 mm
EP2AGX260EF29I3N	Intel	FPGA	Industrial	Ball	780	HBGA	Square	Plastic/Epoxy	244188	Yes	.93 V	10260			372		.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		2.7 mm	29 mm	No		e1	500 MHz		372		29 mm
EP2AGX95EF35I5N	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747			612		.9	0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		3747 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.6 mm	35 mm	No		e1	500 MHz		612		35 mm
EP2S30F484I4N	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	33880	Yes	1.25 V	1694	CMOS		342		1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	5.117 ns	1694 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	3.5 mm	23 mm	No		e1	717 MHz		334		23 mm
EP2S30F672I4N	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	33880	Yes	1.25 V	1694	CMOS		500		1.2	1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)	5.117 ns	1694 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	3.5 mm	27 mm	No		e1	717 MHz		492		27 mm
EP3C10E144I7	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS		94		1.2		Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.4 mm	100 °C (212 °F)		10320 CLBS	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144		1.65 mm	20 mm	No		e0	472.5 MHz		94		20 mm
EP3C40U484I7N	Intel	FPGA	Industrial	Ball	484	FBGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS		331		1.2		Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		39600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B484	3	2.2 mm	19 mm	No		e1	472.5 MHz		331		19 mm
EP3SL150F780I3N	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	142500	Yes	.94 V	5700			488		0.9	1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	100 °C (212 °F)		5700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	3.2 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1			488		29 mm
ICE40LP1K-CB81	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS		62		1.2	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	5 mm	No		e1	133 MHz	30 s	62	260 °C (500 °F)	5 mm
ICE40LP1K-SWG16TR	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS		10		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B16		.491 mm	1.4 mm						10		1.48 mm
LCMXO2280C-4BN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285			211		1.8	1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.71 V	.8 mm	100 °C (212 °F)		285 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1			211	260 °C (500 °F)	14 mm
LFE2M20E-5FN484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2375			304		1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	311 MHz		304	250 °C (482 °F)	23 mm
LFE2M35E-5FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	35000	Yes	1.26 V	4250			140		1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	140	250 °C (482 °F)	17 mm
LFE3-17EA-8FTN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	17000	Yes	1.26 V				133		1.2	1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.281 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	500 MHz	30 s	133	260 °C (500 °F)	17 mm
LFE3-35EA-6FTN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	33000	Yes	1.26 V				133		1.2	1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	375 MHz	30 s	133	260 °C (500 °F)	17 mm
XA3S100E-4VQG100I	Xilinx	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS	AEC-Q100	66	100000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	4.88 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	572 MHz	30 s	59	260 °C (500 °F)	14 mm
XC3S1600E-4FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS		376	1600000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.76 ns	3688 CLBS, 1600000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	572 MHz	30 s	294	225 °C (437 °F)	23 mm
XC3S400A-4FGG320I	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		251	400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	896 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	667 MHz	30 s	192	260 °C (500 °F)	19 mm
XC5VSX50T-1FF665I	Xilinx	FPGA	Industrial	Ball	665	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	4080 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e0		30 s	360	225 °C (437 °F)	27 mm
XC5VSX95T-2FFG1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	94208	Yes	1.05 V	7360	CMOS		640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.77 ns	7360 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	640	245 °C (473 °F)	35 mm
XC6SLX150-3FG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		498		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	862 MHz	30 s	498	225 °C (437 °F)	27 mm
XC6SLX75T-3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS		348		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	5831 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	348	250 °C (482 °F)	27 mm
XC6SLX9-L1CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	9152	Yes	1.05 V	715	CMOS		100		1	1,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	.95 V	.5 mm	100 °C (212 °F)	0.46 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8		30 s	100	260 °C (500 °F)	8 mm
XCVU065-1FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes	.979 V	600			520		.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	520	245 °C (473 °F)	40 mm
XCVU9P-2FLGA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780			832		0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.24 mm	47.5 mm						832		47.5 mm
10AX027E1F29I1HG	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.98 V	10162	TSMC		360		.95		Grid Array			.92 V	1 mm	100 °C (212 °F)		10162 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm						360		29 mm
10AX032H4F34I3LG	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	TSMC		384		0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					384		35 mm
10AX090H1F34I1SG	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC		504		0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)		33962 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm		Also Operates at 0.95 V nominal supply				504		35 mm
10M02DCU324I7G	Intel	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	2000	Yes	1.25 V	125			246		1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					246		15 mm
5AGTFD3H3F35I3G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	362000	Yes	1.18 V	13688			704		1.15		Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)		13688 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						704		35 mm
5AGXBB1D4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321	TSMC		704		1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)		11321 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm						704		40 mm
5AGXFA5H4F35I5N	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170			544		1.1	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		7170 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1			544		35 mm
5CGTFD9E5F35I7N	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V	11356	CMOS		560		1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	100 °C (212 °F)		11356 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.4 mm	35 mm	No					560		35 mm
5SGXEA7N2F45I3N	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS		840		.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		23472 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
EP1C3T100I7	Intel	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	2910	Yes	1.575 V	291			65		1.5	1.5,1.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.425 V	.5 mm	100 °C (212 °F)		291 CLBS	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	320 MHz		65		14 mm
EP3C55U484I7	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS		327		1.2		Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.15 V	.8 mm	100 °C (212 °F)		55856 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484		2.05 mm	19 mm	No		e0	472.5 MHz		327		19 mm
ICE40LM2K-CM49TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	49	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	256	CMOS				1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		256 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B49		1 mm	3 mm								3 mm
ICE40LP1K-SWG16TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS		10		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B16		.491 mm	1.4 mm						10		1.48 mm
ICE40LP4K-CM121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS		93		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	5 mm			e1			93	260 °C (500 °F)	5 mm
ICE40LP4K-CM121TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	440	CMOS				1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		440 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B121		1 mm	5 mm								5 mm
ICE40LP4K-CM225	Lattice Semiconductor	FPGA	Industrial	Ball	225	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS		167		1.2	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA225,15X15,16	Field Programmable Gate Arrays	1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1 mm	7 mm	No		e1	133 MHz	30 s	167	260 °C (500 °F)	7 mm
LFD2NX-40-9BG196I	Lattice Semiconductor	FPGA	Industrial	Ball	196		Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		92		1					.95 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B196			12 mm						92		12 mm
LFE2-12E-5FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500			193		1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2-6E-6FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	6000	Yes	1.26 V	750			190		1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	357 MHz	40 s	190	250 °C (482 °F)	17 mm
LFE2-70SE-5FN672I	Lattice Semiconductor	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	70000	Yes	1.26 V	8500			500		1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	311 MHz	30 s	500	250 °C (482 °F)	27 mm
LFE2M100E-6FN900I	Lattice Semiconductor	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	100000	Yes	1.26 V				416		1.2	1.2 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	357 MHz	40 s	416	250 °C (482 °F)	31 mm
LFE3-150EA-7FN1156I	Lattice Semiconductor	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	149000	Yes	1.26 V				586		1.2	1.2 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.335 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	420 MHz	30 s	586	250 °C (482 °F)	35 mm
LFE3-150EA-8FN672I	Lattice Semiconductor	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	149000	Yes	1.26 V				380		1.2	1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.281 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	500 MHz	30 s	380	250 °C (482 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.