Industrial Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
A54SX32ATQG100I	Microsemi	FPGA	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	2880	Yes	2.75 V	2880	CMOS	81	48000	2.5		2.5,3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	85 °C (185 °F)	1.2 ns	2880 CLBS, 48000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	32000 typical gates available	e3	238 MHz	30 s	81	260 °C (500 °F)	14 mm
A54SX32A-TQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	2880	Yes	2.75 V	2880	CMOS	81	48000	2.5		2.5,3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	85 °C (185 °F)	1.2 ns	2880 CLBS, 48000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	32000 typical gates available	e3	238 MHz	30 s	81	260 °C (500 °F)	14 mm
AGL030V5-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	768	Yes	1.575 V		CMOS	77	30000	1.5			Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ		1.425 V	.5 mm	100 °C (212 °F)		30000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3			77		14 mm
AGL125V2-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS	97	125000	1.2			Grid Array, Low Profile	BGA144,12X12,40		1.14 V	1 mm	100 °C (212 °F)		125000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
APA600-BG456I	Microchip Technology	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS	356	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA456,26X26,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)		600000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.54 mm	35 mm	No		e0	180 MHz	20 s	356	225 °C (437 °F)	35 mm
ICE40HX4K-BG121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	440	CMOS			1.2			Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)		440 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm			e2				260 °C (500 °F)	9 mm
ICE40LP1K-CM36TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	25		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B36	3	1 mm	2.5 mm			e1			25	260 °C (500 °F)	2.5 mm
LCMXO2280C-3BN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		211		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.71 V	.8 mm	100 °C (212 °F)		285 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1			211	260 °C (500 °F)	14 mm
LCMXO640C-3BN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80		159		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.71 V	.8 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1			159	260 °C (500 °F)	14 mm
LFD2NX-40-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
LFE2-6SE-6FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	6000	Yes	1.26 V	750		190		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	357 MHz	40 s	190	250 °C (482 °F)	17 mm
LIFCL-40-8MG289I	Lattice Semiconductor	FPGA	Industrial	Ball	289	TFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74		1			Grid Array, Thin Profile, Fine Pitch	BGA289,17X17,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B289		1.2 mm	9.5 mm						74		9.5 mm
M1A3PE3000-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	147	3000000	1.5	Tray	1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	350 MHz	30 s	147	245 °C (473 °F)	28 mm
M1AGL1000V2-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V		CMOS	97	1000000	1.2			Grid Array, Low Profile	BGA144,12X12,40		1.14 V	1 mm	100 °C (212 °F)		1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
M2GL090-1FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V			267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0			267		23 mm
M2GL090TS-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS	267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
XC3S250E-4TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	108	250000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s	80	260 °C (500 °F)	20 mm
XC3S250E-4TQG144IS1	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	108	250000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s	80	260 °C (500 °F)	20 mm
XC3S500E-4PQG208I	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	158	500000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
XC3S500E-4PQG208IS1	Xilinx	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	158	500000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
XC3S50A-4FTG256I	Xilinx	FPGA	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	144	50000	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	667 MHz	30 s	112	260 °C (500 °F)	17 mm
XC3S50A-4TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	108	50000	1.2		1.2,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.71 ns	176 CLBS, 50000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	667 MHz		101		20 mm
XCKU085-2FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No		e1			676		42.5 mm
10AX016E4F27I3SG	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151	TSMC	240		0.9		0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		6151 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672		3.35 mm	27 mm	No					240		27 mm
10CX085YU484I5G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	85000	Yes	.93 V	31000	TSMC	188		.9			Grid Array			.87 V		100 °C (212 °F)		31000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484									188
10M40DCF672I7G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		2500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			500		27 mm
10M50DCF256I6G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2			Grid Array	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			500		17 mm
10M50DCF672I7G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			500		27 mm
5AGXMA7G4F35I5G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	242000	Yes	1.13 V	9168	TSMC	544		1.1			Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.07 V	1 mm	100 °C (212 °F)		9168 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						544		35 mm
A3P060-1VQ100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS		60000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	350 MHz				14 mm
A3P060-2VQ100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS		60000	1.5	Tray		Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	100 °C (212 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	350 MHz				14 mm
A3P1000L-1FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	97	1000000	1.2	Tray	1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
A3PE3000-PQG208I	Microchip Technology	FPGA	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	147	3000000	1.5		1.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3		30 s	147	245 °C (473 °F)	28 mm
A42MX24-TQG176I	Microchip Technology	FPGA	Industrial	Gull Wing	176	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1890	CMOS		36000	3.3	Tray		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	2.5 ns	1890 CLBS, 36000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G176	3	1.6 mm	24 mm	No	Also Operates at 5 V supply	e3	91.8 MHz				24 mm
AGLN020V2-QNG68I	Microchip Technology	FPGA	Industrial	No Lead	68	HVQCCN	Square			Yes	1.575 V	520	CMOS		20000	1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.4 mm	85 °C (185 °F)		520 CLBS, 20000 Gates	-40 °C (-40 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
AGLN060V2-CSG81I	Microchip Technology	FPGA	Industrial	Ball	81	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS		60000	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	.8 mm	5 mm	No		e1		30 s		260 °C (500 °F)	5 mm
AGLN125V2-VQG100I	Microchip Technology	FPGA	Industrial	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS		125000	1.2			Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3					14 mm
APA600-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	21504	Yes	2.7 V		CMOS	370	600000	2.5	Tray	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	25 mm	No		e1	180 MHz	30 s	370	250 °C (482 °F)	25 mm
LCMXO2280C-3MN132I	Lattice Semiconductor	FPGA	Industrial	Ball	132	LFBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		101		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		285 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		40 s	101	260 °C (500 °F)	8 mm
LCMXO2280C-4MN132I	Lattice Semiconductor	FPGA	Industrial	Ball	132	LFBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		101		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		285 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		40 s	101	260 °C (500 °F)	8 mm
LFD2NX-17-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
LFD2NX-40-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
LFE3-17EA-6FN484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V			222		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	375 MHz		222	250 °C (482 °F)	23 mm
LFXP6E-3FN256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	720	Yes	1.26 V	720	CMOS	188		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.63 ns	720 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	375 MHz	40 s	188	250 °C (482 °F)	17 mm
M1A3P400-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	9216	CMOS		400000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		9216 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0					13 mm
M1A3P400-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	9216	CMOS		400000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		9216 CLBS, 400000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s		260 °C (500 °F)	13 mm
M1A3PE3000-2FG324I	Microchip Technology	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	221	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B324	3	1.78 mm	19 mm	No		e0	350 MHz		221		19 mm
M1A3PE3000-FG324I	Microchip Technology	FPGA	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS	221	3000000	1.5	Tray	1.5/3.3 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		75264 CLBS, 3000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B324	3	1.78 mm	19 mm	No		e0	350 MHz		221		19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.