Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10M25DCF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1563 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			360		23 mm
10M40DAF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			500		23 mm
EP2C70F896C8N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	68416	Yes	1.25 V	4276	CMOS	622		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		4276 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B896	3	2.6 mm	31 mm	No	Also requires 3.3 V supply	e1	402.5 MHz	30 s	606	260 °C (500 °F)	31 mm
EP3C55F780C8N	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	55856	Yes	1.25 V	55856	CMOS	377		1.2			Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		55856 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz	30 s	377	260 °C (500 °F)	29 mm
EP4CE10F17C6N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	645		179		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		179		17 mm
LFXP2-17E-5FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS	201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LIFCL-40-9BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74		1			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.7 mm	17 mm					30 s	74	260 °C (500 °F)	17 mm
XC3S1000-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	173	1000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	630 MHz	30 s	173	260 °C (500 °F)	17 mm
XC6VCX195T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS	600		1		1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.79 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XCKU15P-L2FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340		668		0.72			Grid Array	BGA1156,34X34,40		.698 V	1 mm	110 °C (230 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.71 mm	35 mm		Also Operates at 0.85 V nominal supply	e1			668		35 mm
XCVU3P-2FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.876 V	49260		520		0.85			Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		49260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1			520		40 mm
10CL080YF780C8G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	5079				1.2			Grid Array			1.15 V	1 mm	85 °C (185 °F)		5079 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm								29 mm
10M02DCU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	2000	Yes	1.25 V	125		246		1.2		1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					246		15 mm
EP3C16U256C8N	Intel	FPGA	Other	Ball	256	FBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168		1.2			Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e1	472.5 MHz		168		14 mm
EP3C25F256C6N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		156		17 mm
EP4CGX30BF14C8N	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		72		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz		72		14 mm
LCMXO2-1200HC-5MG132C	Lattice Semiconductor	FPGA	Other	Ball	132	BGA	Square	Plastic/Epoxy	1280	Yes	3.465 V			104		2.5	Tray	2.5/3.3 V	Grid Array	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	104	250 °C (482 °F)	8 mm
LFD2NX-40-8MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
LFXP2-17E-5FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS	358		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.494 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		358	250 °C (482 °F)	23 mm
LFXP2-5E-6TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	100		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	435 MHz	40 s	100	260 °C (500 °F)	20 mm
XC7S100-2FGGA484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	HKMG	400		1			Grid Array	BGA484,22X22,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	8000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.44 mm	23 mm			e1	1286 MHz		400		23 mm
XCKU035-1FBVA676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700		520		.95		0.95 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		1700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm	No		e1		30 s	520	250 °C (482 °F)	27 mm
5CEBA4F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	49000	Yes	1.13 V		CMOS	224		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					224		23 mm
EP1C3T144C7N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2910	Yes	1.575 V	291		104		1.5		1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		291 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	320 MHz		104		20 mm
LFE2-6E-5TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6000	Yes	1.26 V	750		90		1.2		1.2 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	311 MHz	40 s	90	260 °C (500 °F)	20 mm
LFXP2-8E-6TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	100		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	435 MHz	40 s	100	260 °C (500 °F)	20 mm
M2GL060-FGG676	Microchip Technology	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B676	3	2.44 mm	27 mm					30 s		250 °C (482 °F)	27 mm
XC3S400-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	221	400000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	630 MHz	30 s	221	260 °C (500 °F)	19 mm
10M08DCU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No					250		15 mm
10M08SCM153C8G	Intel	FPGA	Other	Ball	153	BGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250		3			Grid Array	BGA153,15X15,20		2.85 V	.5 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B153	3	1 mm	8 mm		Also Operates at 3.3 V nominal supply				250		8 mm
EP3C120F780C8N	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	119088	Yes	1.25 V	119088	CMOS	531		1.2			Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz		531		29 mm
EP4CE55F23C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491		327		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		327		23 mm
EP4CE6E22C8LN	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.03 V	392		91		1		1,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.97 V	.5 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	362 MHz		91		20 mm
EP4SGX180FF35C3N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	175750	Yes	.93 V	7030		564		.9		0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		7030 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.4 mm	35 mm	No		e1	717 MHz		564		35 mm
XC3S500E-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	190	500000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	149	260 °C (500 °F)	17 mm
XC6SLX16-2CPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	100		1.2		1.2,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.26 ns	1139 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8	667 MHz	30 s	100	260 °C (500 °F)	8 mm
XC7A50T-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7V2000T-2FHG1761C	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS	850		1		1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761		3.75 mm	45 mm	No		e1	1818 MHz		850		45 mm
XCKU085-2FLVA1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	676	245 °C (473 °F)	40 mm
10CL080YF780C6G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	5079				1.2			Grid Array			1.15 V	1 mm	85 °C (185 °F)		5079 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		2.4 mm	29 mm								29 mm
10CX105YF672E5G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	236		.9			Grid Array			.87 V		100 °C (212 °F)		38000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672									236
10M25DAF484C7G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1563 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			360		23 mm
10M40DCF256C7G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	40000	Yes	1.25 V	2500		500		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			500		17 mm
5CEBA2F17C7N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	128		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No					128		17 mm
EP3C25F324C8	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215		1.2			Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.9 mm	19 mm	No		e0	472.5 MHz		215		19 mm
LCMXO2-1200HC-4TG144CR1	Lattice Semiconductor	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	1280	Yes	3.465 V		CMOS	108		2.5		2.5/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3			No		e3	133 MHz	30 s	108	260 °C (500 °F)
LCMXO2-256ZE-3UMG64C	Lattice Semiconductor	FPGA	Other	Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			44		1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
LFE3-70EA-6FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	67000	Yes	1.26 V			380		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	375 MHz	30 s	380	250 °C (482 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.