Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4028XL-09HQ208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS	256	18000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.2 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Typical gates = 18000-50000	e0	217 MHz	30 s	256	225 °C (437 °F)	28 mm
XC3190A-09PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS		5000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	1.5 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 6000 Logic gates	e3	370 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC7A50T-1CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		250		10 mm
XC5VLX85-3FF1153C	Xilinx	FPGA	Other	Ball	1153	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480		560		1	1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	6480 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No		e0		30 s	560	225 °C (437 °F)	35 mm
XC4013D-4PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS	192	10000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	133.3 MHz	30 s	192	225 °C (437 °F)	28 mm
XC4006E-3TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	256	CMOS		4000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	2 ns	256 CLBS, 4000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 6000 Logic gates	e3	125 MHz	30 s		260 °C (500 °F)	20 mm
XC4036XLA-09HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS	288	22000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Can also use 65000 gates	e0	227 MHz		288		28 mm
XC4044XLA-08HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS	320	27000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Can also use 80000 gates	e0	263 MHz		320		28 mm
XC3S400-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0					27 mm
XCVU160-2FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	.979 V	1560		702		.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		1560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1			702		47.5 mm
XC2VP7-6FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	11088	Yes	1.575 V	1232	CMOS	396		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	1232 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No		e1	1200 MHz	30 s	396	250 °C (482 °F)	27 mm
XC4005-6PG156C	Xilinx	FPGA	Other	Pin/Peg	156	PGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.25 V	196	CMOS	112	4000	5	5 V	Grid Array	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	6 ns	196 CLBS, 4000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P156		3.683 mm	42.164 mm	No	616 flip-flops; typical gates = 4000-5000	e3	90.9 MHz		112		42.164 mm
XC3130A-2PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	80	1500	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	2.2 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 2000 Logic gates	e0	323 MHz	30 s	80	225 °C (437 °F)	20 mm
XC4052XLA-08BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 100000 gates	e1	263 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4013XLA-09PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS		10000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 30000 gates	e3	227 MHz	30 s		245 °C (473 °F)	28 mm
XCV600-5BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	3456	CMOS		661111	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.7 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	294 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4085XLA-8HQ304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS		55000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No		e0	263 MHz				40 mm
XC7K160T-2FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	12675				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	12675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		3.37 mm	27 mm			e1					27 mm
XC6VHX255T-2FFG1923C	Xilinx	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy	253440	Yes	1.05 V		CMOS	480		1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No		e1	1286 MHz	30 s	480	245 °C (473 °F)	45 mm
XC2V4000-4FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	824	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	650 MHz	30 s	824	245 °C (473 °F)	35 mm
XC3S100E-4TQ144CS1	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS	108	100000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	240 CLBS, 100000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	572 MHz	30 s	80	225 °C (437 °F)	20 mm
XC2V1000-5FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS		1000000	1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.39 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e1	750 MHz	30 s		245 °C (473 °F)	31 mm
XC7K420T-3FFG901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy		Yes	1.03 V					1		Grid Array	BGA901,30X30,40		.97 V	1 mm	85 °C (185 °F)	0.58 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1		30 s		245 °C (473 °F)	31 mm
XC4044XL-2HQG240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.5 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Max usable 44000 Logic gates	e3	179 MHz				32 mm
XCS20-4PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	5.25 V	400	CMOS		7000	5		Flatpack, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 20000	e3	166 MHz	30 s		245 °C (473 °F)	28 mm
XC6SLX100-1LFGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	500 MHz	30 s		250 °C (482 °F)	27 mm
XC4044XLA-8HQG208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	263 MHz				28 mm
XC2VP20-7FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	1350 MHz	30 s	564	245 °C (473 °F)	35 mm
XC3S200AN-4FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS		200000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz				23 mm
XCV300-6BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.4 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0					42.5 mm
XCV800-4BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	4704	CMOS		888439	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	40 mm
XC4085XLA-09HQG304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS		55000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)		Quad	S-PQFP-G304		4.5 mm	40 mm	No	Can also use 180000 gates		227 MHz				40 mm
XC4044XLA-8HQG304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3	263 MHz				40 mm
XC5204-4TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	120	Yes	5.25 V	120	CMOS	124	4000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3.8 ns	120 CLBS, 4000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAX available 6000 Logic gates	e0	83 MHz	30 s	124	225 °C (437 °F)	20 mm
XCV300-4FGG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No		e1					40 mm
XC3030-125TQ100C	Xilinx	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	80	1500	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	5.5 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.7 mm	14 mm	No	360 flip-flops; typical gates = 1500-2000; power-down supplier current = 80 µA	e0	125 MHz	30 s	80	225 °C (437 °F)	14 mm
XC7A15T-L2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	16640	Yes	.93 V	1300		250		0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC4013XLA-9BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS		10000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	227 MHz				27 mm
XC7K325T-1FBG900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V					1		Grid Array	BGA900,30X30,40		.97 V	1 mm	100 °C (212 °F)	0.74 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No		e1		30 s		245 °C (473 °F)	31 mm
XC6VLX365T-L1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	.93 V		CMOS	600		.9	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XCV1600E-6FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	700	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	357 MHz	30 s	700	225 °C (437 °F)	31 mm
XC2V6000-6FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	824	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	820 MHz	30 s	824	245 °C (473 °F)	35 mm
XC3S400-5FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0					31 mm
XC5210-4PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS	196	10000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3.8 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	32 mm
XCV100E-7FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	176	32400	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	400 MHz	30 s	176	260 °C (500 °F)	17 mm
XC3S700A-4FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	311	700000	1.2	1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	667 MHz	30 s	248	225 °C (437 °F)	21 mm
XC7A25T-2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	150	245 °C (473 °F)	35 mm
XC4010XL-1BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS	160	7000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.3 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	200 MHz	30 s	160	225 °C (437 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.