Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4002XL-09PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	64	Yes	3.6 V	64	CMOS	64	1000	3.3	3.3 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.2 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 1000-3000	e0	217 MHz	30 s	64	225 °C (437 °F)	20 mm
XC4003-4PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	238	Yes	5.25 V	100	CMOS	77	2500	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	4 ns	100 CLBS, 2500 Gates	0 °C (32 °F)	Tin Lead	Quad	R-PQFP-G100	3	2.87 mm	14 mm	No	360 flip-flops; typical gates = 2500-3000	e0	133.3 MHz	30 s	77	225 °C (437 °F)	20 mm
XCS10-3VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS	112	3000	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAXIMUM usable gates 10000	e0	125 MHz	30 s	112	240 °C (464 °F)	14 mm
XC2V1000-6FFG896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.575 V	1280	CMOS		1000000	1.5		Grid Array			1.425 V	1 mm	85 °C (185 °F)	0.35 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e1	820 MHz	30 s		245 °C (473 °F)	31 mm
XC4085XLA-9BGG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS		55000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	227 MHz				40 mm
XCV1000E-8FGG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No		e1	416 MHz	30 s	660	245 °C (473 °F)	42.5 mm
XC7K325T-2LFFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	.93 V					0.9		Grid Array	BGA900,30X30,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1		30 s		245 °C (473 °F)	31 mm
XC7K160T-1FBG676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V					1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)	0.74 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1					27 mm
XC3195A-2PP175C	Xilinx	FPGA	Other	Pin/Peg	175	HPGA	Square	Plastic/Epoxy	484	No	5.25 V	484	CMOS	144	6500	5	5 V	Grid Array, Heat Sink/Slug	PGA175,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2.2 ns	484 CLBS, 6500 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P175	1	4.191 mm	42.164 mm	No	Max usable 7500 Logic gates		323 MHz		144		42.164 mm
XC5VFX130T-1FF1738C	Xilinx	FPGA	Other	Ball	1738	BGA	Square	Plastic/Epoxy	13172	Yes	1.05 V	10240	CMOS	840		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	10240 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e0		30 s	840	225 °C (437 °F)	42.5 mm
XC4005A-4PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS	112	4000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4 ns	196 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	616 flip-flops; typical gates = 4000-5000	e0	133.3 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC4052XLA-8HQG240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	263 MHz				32 mm
XC4062XLA-8BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS		40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	263 MHz				35 mm
XC6VSX315T-2FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS	720		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e1	1286 MHz	30 s	720	245 °C (473 °F)	42.5 mm
XC7A35T-L1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600		250		0.95		Grid Array	BGA1156,34X34,40		.92 V	1 mm	85 °C (185 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC4VLX40-11FFG668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	41472	Yes	1.26 V	4608	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		4608 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e1	1205 MHz	30 s	448	250 °C (482 °F)	27 mm
XC3S400-5CP132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B132		1.1 mm	8 mm	No							8 mm
XCKU5P-2SFVB784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304		0.85		Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm			e1		30 s	304	250 °C (482 °F)	23 mm
XC7K420T-2FFG901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	CMOS	350		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	32575 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1	1286 MHz	30 s	350	245 °C (473 °F)	31 mm
XC5210-5PQG160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	324	CMOS		10000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	4.6 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	MAX available 16000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	28 mm
XC7A15T-2CPG236E	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1286 MHz	30 s	250	260 °C (500 °F)	10 mm
XCS20XL-5TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS	160	7000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 20000	e0	250 MHz	30 s	160	225 °C (437 °F)	20 mm
XC2V40-4FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	1.575 V	64	CMOS	88	40000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	64 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	650 MHz	30 s	88	225 °C (437 °F)	17 mm
XC3S700AN-4FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS		700000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	667 MHz	30 s		225 °C (437 °F)	21 mm
XC4020XL-3PQG240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS		13000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.6 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Max usable 20000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	32 mm
XC3030A-6PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	100	CMOS		1500	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm		Max usable 2000 Logic gates	e3	135 MHz	30 s		245 °C (473 °F)	20 mm
XC4028EX-1HQ304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		18000	5		Flatpack, Heat Sink/Slug, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)		1024 CLBS, 18000 Gates	0 °C (32 °F)		Quad	S-PQFP-G304		4.5 mm	40 mm	No							40 mm
XCVU13P-1FHGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000		832		0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	52.5 mm						832		52.5 mm
XCS30-4PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS	196	10000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 30000	e0	166 MHz	30 s	196	225 °C (437 °F)	28 mm
XC7VX415T-1FFV1157C	Xilinx	FPGA	Other	Ball	1157	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32200				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	32200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1157		3.35 mm	35 mm			e1					35 mm
XC6SLX100T-4CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	101261	Yes			CMOS	296			1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1		30 s	296	260 °C (500 °F)	19 mm
XC6VCX240T-2FFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS	400		1	1,1.2/2.5,2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XC2V6000-4FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	824	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	650 MHz	30 s	824	245 °C (473 °F)	35 mm
XC4020XL-1BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS		13000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.3 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 20000 Logic gates	e1	200 MHz	30 s		250 °C (482 °F)	27 mm
XC6SLX75-N3CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	328		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz	30 s	328	260 °C (500 °F)	19 mm
XC5VLX50T-1FF665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	46080	Yes	10.5 V	3600		360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	3600 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e0		30 s	360	225 °C (437 °F)	27 mm
XC4VFX12-11SF363C	Xilinx	FPGA	Other	Ball	363	FBGA	Square	Plastic/Epoxy	12312	Yes	1.26 V	1368	CMOS	240		1.2		Grid Array, Fine Pitch	BGA363,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)		1368 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B363	4	1.99 mm	17 mm	No		e0	1181 MHz	30 s	240	225 °C (437 °F)	17 mm
XCS100E-6TQ144C	Xilinx	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	2700	Yes	1.89 V		CMOS	202		1.8	1.8,2.5,3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3		20 mm	No		e0	357 MHz	30 s	202	225 °C (437 °F)	20 mm
XC4052XLA-07HQG304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	0.9 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No	Can also use 100000 gates	e3	294 MHz				40 mm
XC7K325T-1FBV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC2VP30-5FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	30816	Yes	1.575 V	3424	CMOS	644		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	3424 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1050 MHz	30 s	644	225 °C (437 °F)	35 mm
XC3S1500-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		30 s		260 °C (500 °F)	17 mm
XC3020A-7PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	64	CMOS		1000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	5.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm		Max usable 1500 Logic gates	e3	113 MHz	30 s		245 °C (473 °F)	20 mm
XC4005XL-2VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS	112	3000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.5 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 5000 Logic gates	e0	179 MHz	30 s	112	240 °C (464 °F)	14 mm
XC3S500E-5CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	92	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.66 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	657 MHz	30 s	85	260 °C (500 °F)	8 mm
XC2VP2-7FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	140		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	352 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	1350 MHz	30 s	140	225 °C (437 °F)	17 mm
XC6VSX315T-3FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1412 MHz	30 s	600	225 °C (437 °F)	35 mm
XC3S5000-4FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS	784	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	8320 CLBS, 5000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	630 MHz	30 s	784	245 °C (473 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.