Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6SLX100T-2FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	296		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	296	225 °C (437 °F)	23 mm
XC3142A-2PP132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Plastic/Epoxy	144	No	5.25 V	144	CMOS	96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2.2 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	Typical gates = 2000-3000		323 MHz		96		37.084 mm
XC3164A-09PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	70	3500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.5 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 4500 Logic gates	e0	370 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC3164A-4TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	120	3500	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3.3 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 4500 Logic gates	e0	227 MHz	30 s	120	225 °C (437 °F)	20 mm
XC4052XLA-9HQG304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3	227 MHz				40 mm
XC3S1500-5FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS	487	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	725 MHz		487		27 mm
XC3042-125PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	125 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC7A35T-L1CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600		250		0.95		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC5VLX30-3FFG324C	Xilinx	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		220		1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No		e1		30 s	220	250 °C (482 °F)	19 mm
XC6SLX150T-3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	396		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	396	250 °C (482 °F)	27 mm
XC4044XLA-09HQG240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Can also use 80000 gates		227 MHz				32 mm
XC6VLX195T-2FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XCVU5P-2FLVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1313763	Yes	.876 V	75072		832		0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		75072 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
XC2VP20-5FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0	1050 MHz	30 s	564	225 °C (437 °F)	35 mm
XC4013XL-1PQG160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS		10000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)	1.3 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 13000 Logic gates	e3	200 MHz	30 s		245 °C (473 °F)	28 mm
XC4006E-1PQG160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	256	CMOS		4000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	1.3 ns	256 CLBS, 4000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 6000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	28 mm
XC6VCX195T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS	600		1	1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XCV1600E-7BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	404	419904	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	400 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC7A100T-1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		300		10 mm
XC4013XL-09CPQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS	160	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 13000 Logic gates	e0	217 MHz	30 s	160	225 °C (437 °F)	28 mm
XC4013E-1PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	5.25 V	576	CMOS		10000	5		Flatpack, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.3 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 13000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	28 mm
XC4013XL-1HTG176C	Xilinx	FPGA	Other	Gull Wing	176	HLFQFP	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS		10000	3.3		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.3 ns	576 CLBS, 10000 Gates	0 °C (32 °F)		Quad	S-PQFP-G176		1.6 mm	24 mm	No	Max usable 13000 Logic gates		200 MHz				24 mm
XC3S50-4CP132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	1728	Yes	1.26 V	192	CMOS	89	50000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.61 ns	192 CLBS, 50000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	630 MHz	30 s	89	225 °C (437 °F)	8 mm
XC40110XV-09HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	4096	Yes	2.7 V	4096	CMOS	448	75000	2.5	2.5,3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)	1.3 ns	4096 CLBS, 75000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can also use 235000 gates	e0	225 MHz	30 s	448	225 °C (437 °F)	32 mm
XC4036XL-2HQG160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS		22000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	1.5 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	Max usable 36000 Logic gates		179 MHz				28 mm
XC4052XLA-7HQG240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	0.9 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	294 MHz				32 mm
XC4044XLA-9BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	227 MHz				35 mm
XC40250XV-9BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.7 V	8464	CMOS		180000	2.5		Grid Array, Low Profile			2.3 V	1.27 mm	85 °C (185 °F)	1.2 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B560		1.7 mm	42.5 mm	No			188 MHz				42.5 mm
XC3030A-6PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	100	No	5.25 V	100	CMOS	74	1500	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 1500-2000		135 MHz		74		27.94 mm
XC7A50T-L1FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075		250		0.95		Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC4020E-2HQG240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	5.25 V	784	CMOS		13000	5		Flatpack, Heat Sink/Slug, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Max usable 20000 Logic gates	e3	125 MHz				32 mm
XC4005H-5PG223C	Xilinx	FPGA	Other	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	466	No	5.25 V	196	CMOS	190	4000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.5 ns	196 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P223	1	4.064 mm	47.244 mm	No	392 flip-flops; typical gates = 4000-5000	e0	133.3 MHz		190		47.244 mm
XC40150XV-08BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	5184	Yes	2.7 V	5184	CMOS	448	100000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 300000 gates	e0	258 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XC2VP100-6FF1696C	Xilinx	FPGA	Other	Ball	1696	BGA	Square	Plastic/Epoxy	99216	Yes	1.575 V	11024	CMOS	1164		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1696,42X42,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	11024 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1696	4	3.45 mm	42.5 mm	No		e0	1200 MHz	30 s	1164	225 °C (437 °F)	42.5 mm
XC4036XLA-8HQ208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS		22000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	263 MHz				28 mm
XC4044XLA-7HQG160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	0.9 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160		4.1 mm	28 mm	No		e3	294 MHz				28 mm
XC3064-70PC84CSPC0107	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	224	CMOS		3500	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	9 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	688 flip-flops; typical gates = 3500-4500	e0	70 MHz				29.3116 mm
XCKU115-3FLVD1924E	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	5520		832		1	1 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	832	245 °C (473 °F)	45 mm
XC6VLX365T-L1FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	.93 V		CMOS	600		.9	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC3064-125PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	120	3500	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	5.5 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	688 flip-flops; typical gates = 3500-4500; power-down supplier current = 170 µA	e0	125 MHz	30 s	120	225 °C (437 °F)	28 mm
XCV1600E-8FGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	700	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	416 MHz	30 s	700	250 °C (482 °F)	31 mm
XC7A200T-1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500		1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		500		10 mm
XC2VP2-6FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	204		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	352 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No		e0	1200 MHz	30 s	204	220 °C (428 °F)	27 mm
XC4085XL-09BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS	352	55000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.2 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Typical gates = 55000-180000	e0	217 MHz	30 s	352	225 °C (437 °F)	40 mm
XCE7K420T-1FFV1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG	400		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	32575 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm			e1		30 s	400	245 °C (473 °F)	35 mm
XC7K325T-2FBV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.54 mm	27 mm			e1					27 mm
XC7VX980T-2LFFG1928E	Xilinx	FPGA	Other	Ball	1928	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500		480		1		Grid Array	BGA1928,44X44,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	76500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1928		3.65 mm	45 mm			e1			480		45 mm
XC3S5000-5FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0					17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.