Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VLX760-L1FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	.93 V		CMOS	1200		.9	1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1098 MHz	30 s	1200	245 °C (473 °F)	42.5 mm
XC3S500E-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	190	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.66 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	657 MHz		149		17 mm
XC3190A-5PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	144	5000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.1 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Typical gates = 5000-6000	e0	188 MHz	30 s	144	225 °C (437 °F)	28 mm
XCS300E-6FT256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V		CMOS	329		1.8	1.8,2.5,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns		0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3		17 mm	No		e0	357 MHz		329		17 mm
XC4010XL-3PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS	160	7000	3.3	3.3 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.6 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 10000 Logic gates	e0	166 MHz	30 s	160	225 °C (437 °F)	28 mm
XC4062XL-2BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	2304	Yes	3.6 V	2304	CMOS	384	40000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.5 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 62000 Logic gates	e0	179 MHz	30 s	384	225 °C (437 °F)	40 mm
XCV100-5BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	600	CMOS		108904	2.5		Grid Array			2.375 V	1.27 mm	85 °C (185 °F)	0.7 ns	600 CLBS, 108904 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No		e1	294 MHz	30 s		250 °C (482 °F)	27 mm
XC3S200AN-5TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS		200000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)	4.36 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	770 MHz				20 mm
XC7A15T-3CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	0.94 ns	1300 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XC6SLX100T-3NFGG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e1	806 MHz				31 mm
XC6VCX130T-1FFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS	400		1	1,1.2/2.5,2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.79 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XC4005E-2PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	196	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	1.6 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 5000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4044XL-2HQG208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.5 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 44000 Logic gates	e3	179 MHz	30 s		245 °C (473 °F)	28 mm
XC2V3000-6FFG1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	3584	CMOS		3000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1					40 mm
XC5206-3VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	196	CMOS		6000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	3 ns	196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAX available 10000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	14 mm
XC4010XL-3PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS	160	7000	3.3	3.3 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.6 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 10000 Logic gates	e0	166 MHz	30 s	160	225 °C (437 °F)	20 mm
XC5VSX240T-2FF1738C	Xilinx	FPGA	Other	Ball	1738	BGA	Square	Plastic/Epoxy	239616	Yes	1.05 V	18720	CMOS	960		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	18720 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e0		30 s	960	225 °C (437 °F)	42.5 mm
XC4013D-6PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS	192	10000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	90.9 MHz	30 s	192	225 °C (437 °F)	28 mm
XC2VP20-7BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XCE7VX690T-2FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm			e1		30 s		245 °C (473 °F)	35 mm
XC7A200T-L1FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	.98 V	16825		500		0.95		Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	500	245 °C (473 °F)	35 mm
XC4005H-5MQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Metal	466	Yes	5.25 V	196	CMOS	192	4000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.5 ns	196 CLBS, 4000 Gates	0 °C (32 °F)		Quad	S-MQFP-G240	1	4.19 mm	31.64 mm	No	392 flip-flops; typical gates = 4000-5000		133.3 MHz		192		31.64 mm
XC4052XLA-8HQ304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No		e0	263 MHz				40 mm
XC4044XLA-9BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	227 MHz				35 mm
XCE7VX980T-2FFG1928C	Xilinx	FPGA	Other	Ball	1928	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	HKMG	480		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	76500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1928		3.65 mm	45 mm						480		45 mm
XCS30XL-3PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	196	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)		576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0		30 s	196	225 °C (437 °F)	28 mm
XC7A200T-2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500		1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		500		10 mm
XC3090-100PC84CSPC0107	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS		5000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	928 flip-flops; typical gates = 5000-6000		100 MHz				29.3116 mm
XC5VLX155T-3FF1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	155648	Yes	1.05 V	12160		640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	12160 CLBS	0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	640	225 °C (437 °F)	35 mm
XC4VFX60-12FFG672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	56880	Yes	1.26 V	6320	CMOS	352		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e1	1181 MHz	30 s	352	250 °C (482 °F)	27 mm
XC4013XLA-07PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	192	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	0.9 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can also use 30000 gates	e0	294 MHz	30 s	192	225 °C (437 °F)	32 mm
XCV1000E-6FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No		e0	357 MHz		660		35 mm
XC7K410T-2LFFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	.93 V					0.9		Grid Array	BGA900,30X30,40		.87 V	1 mm	85 °C (185 °F)	0.61 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm			e1					31 mm
XC7A100T-1CPG236C	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	10 mm
XC7A75T-L1FTG256E	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	75520	Yes	.98 V	5900		300		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
XC4002A-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	1600	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.5 ns	64 CLBS, 1600 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	256 flip-flops; typical gates = 1600-2000	e0	133.3 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC2V6000-5BFG957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	684	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e1	750 MHz	30 s	684	245 °C (473 °F)	40 mm
XC3142A-3TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS		2000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	2.7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm		Max usable 3000 Logic gates	e3	270 MHz	30 s		260 °C (500 °F)	20 mm
XC4VLX25-11FFG668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e1	1205 MHz	30 s	448	250 °C (482 °F)	27 mm
XC6VLX550T-2FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS	840		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1286 MHz	30 s	840	225 °C (437 °F)	42.5 mm
XC4044XLA-07HQG208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	0.9 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 80000 gates	e3	294 MHz	30 s		245 °C (473 °F)	28 mm
XC4052XLA-07HQG240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	0.9 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can also use 100000 gates	e3	294 MHz				32 mm
XC2VP20-8BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XC4010E-4HQG208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	5.25 V	400	CMOS		7000	5		Flatpack, Heat Sink/Slug, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	2.7 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 10000 Logic gates	e3	111 MHz	30 s		245 °C (473 °F)	28 mm
XC6VLX195T-1FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC3190A-09PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	70	5000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.5 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 6000 Logic gates	e0	370 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XC4005E-4PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS	112	3000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	2.7 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 5000 Logic gates	e0	111 MHz	30 s	112	225 °C (437 °F)	20 mm
XC2V1000-5FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	432	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0	750 MHz	30 s	432	225 °C (437 °F)	31 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.