Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3S1500-4VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3		30 s		260 °C (500 °F)	14 mm
XCKU085-2FLVF1924E	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95	0.95 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	676	245 °C (473 °F)	45 mm
XC2S100-6FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600		180	100000	2.5	1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	600 CLBS, 100000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	263 MHz	30 s	176	260 °C (500 °F)	17 mm
XC4036XL-1BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS	288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.3 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Max usable 36000 Logic gates	e0	200 MHz	30 s	288	225 °C (437 °F)	35 mm
XC4010E-3PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	7000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 10000 Logic gates	e0	125 MHz	30 s	160	225 °C (437 °F)	28 mm
XCV600-5BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS	316	661111	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.7 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	294 MHz	30 s	316	225 °C (437 °F)	40 mm
XC5210-6PQG160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	324	CMOS		10000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	5.6 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	MAX available 16000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	28 mm
XC4VLX60-10FFG668C	Xilinx	FPGA	Other	Ball	668	BGA	Square	Plastic/Epoxy	59904	Yes	1.26 V	6656	CMOS	448		1.2		Grid Array	BGA668,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		6656 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B668	4	2.85 mm	27 mm	No		e1	1028 MHz	30 s	448	250 °C (482 °F)	27 mm
XC4013XL-3PQG240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS		10000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Max usable 13000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	32 mm
XC4028XLA-07HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS	256	18000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	0.9 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Can also use 50000 gates	e0	294 MHz		256		28 mm
XC7A12T-2CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XCV1000-4BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	27648	Yes	2.625 V	6144	CMOS	404	1124022	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	6144 CLBS, 1124022 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	250 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC3190A-3PPG175C	Xilinx	FPGA	Other	Pin/Peg	175	HPGA	Square	Plastic/Epoxy		No	5.25 V	320	CMOS		5000	5		Grid Array, Heat Sink/Slug			4.75 V	2.54 mm	85 °C (185 °F)	2.7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P175		4.191 mm	42.164 mm	No	Max usable 6000 Logic gates		270 MHz				42.164 mm
XC2VP20-6FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	404		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	2320 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1200 MHz	30 s	404	250 °C (482 °F)	27 mm
XC2V10000-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.39 ns	15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	880 MHz	30 s		245 °C (473 °F)	35 mm
XC7A35T-1CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7A15T-L2CPG238E	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	16640	Yes	.93 V	1300		250		0.9		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.87 V	.5 mm	100 °C (212 °F)	1.51 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm		Also Operates at 1 V nominal supply	e1	1098 MHz		250		10 mm
XC6SLX100T-3NFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	806 MHz				31 mm
XC3S700AN-5FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS		700000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	770 MHz				17 mm
XC3S50AN-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.26 V	176	CMOS		50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.88 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	667 MHz				27 mm
XC7A12T-L2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	12800	Yes	.93 V	1000	HKMG	150		0.9		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.87 V	.8 mm	85 °C (185 °F)	1.51 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC3090-70CB164CSPC0107	Xilinx	FPGA	Other	Flat	164	GQFF	Square	Ceramic, Metal-Sealed Cofired		Yes	5.25 V	320	CMOS		5000	5		Flatpack, Guard Ring			4.75 V	.65 mm	85 °C (185 °F)	9 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-CQFP-F164		2.921 mm	28.702 mm	No	928 flip-flops; typical gates = 5000-6000	e0	70 MHz				28.702 mm
XC4052XLA-8BG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e0	263 MHz				40 mm
XC5210-3PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS	196	10000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	3 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	29.3116 mm
XC4005XL-09PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS	112	3000	3.3	3.3 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Typical gates = 3000-9000	e0	217 MHz	30 s	112	225 °C (437 °F)	20 mm
XC5202-5VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	4.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	14 mm
XC6VLX760-2FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	758784	Yes	1.05 V		CMOS	1200		1	1,1.2/2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1286 MHz	30 s	1200	225 °C (437 °F)	42.5 mm
XC4020XLA-9PQG240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS		13000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e3	227 MHz				32 mm
XC7V2000T-2LFHG1761E	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700		850		1		Grid Array	BGA1761,42X42,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761		3.75 mm	45 mm			e1			850		45 mm
XC4062XLA-7BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS		40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	294 MHz				35 mm
XC4028XL-1HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS	256	18000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ,20	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.3 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 28000 Logic gates	e0	200 MHz		256		28 mm
XC4025-4PG223C	Xilinx	FPGA	Other	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	1024	No	5.25 V	1024	CMOS	256	20000	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4 ns	1024 CLBS, 20000 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P223	1	4.064 mm	47.244 mm	No	2560 flip-flops; typical gates = 20000-25000	e0	133.3 MHz		256		47.244 mm
XC4VFX20-10FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	19224	Yes	1.26 V	2136	CMOS	320		1.2		Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2136 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	3 mm	27 mm	No		e0	1028 MHz	30 s	320	220 °C (428 °F)	27 mm
XCS05XL-4PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	3.6 V	100	CMOS	77	2000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Maximum usable gates 5000	e0	217 MHz	30 s	77	225 °C (437 °F)	29.3116 mm
XC3020-100PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	7 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	100 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC4VLX60-10FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy		Yes	1.26 V		CMOS			1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No		e0					27 mm
XC5VSX35T-3FFV665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	34816	Yes	1.05 V	2720	CMOS	360		1		Grid Array	BGA665,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.67 ns	2720 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm			e1		30 s	360	250 °C (482 °F)	27 mm
XC6VCX130T-2FFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS	400		1	1,1.2/2.5,2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No		e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XC4044XLA-09BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS	320	27000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 80000 gates	e0	227 MHz	30 s	320	225 °C (437 °F)	40 mm
XC5210-4PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS	196	10000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	3.8 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	28 mm
XC3190A-4TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	122	5000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3.3 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 6000 Logic gates	e0	227 MHz	30 s	122	225 °C (437 °F)	20 mm
XC6SLX75-N3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	408		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	806 MHz	30 s	408	250 °C (482 °F)	27 mm
XCS40XL-5BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1862	Yes	3.6 V	784	CMOS	205	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e1	250 MHz	30 s	205	250 °C (482 °F)	27 mm
XC3020-125PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	4.445 mm	24.2316 mm	No	256 flip-flops; typical gates = 1000-1500; power-down supplier current = 50 µA	e0	125 MHz		58		24.2316 mm
XC4010D-6PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	8000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	6 ns	400 CLBS, 8000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	3.92 mm	28 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	90.9 MHz	30 s	160	225 °C (437 °F)	28 mm
XC4020-4PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1862	Yes	5.25 V	784	CMOS	193	16000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4 ns	784 CLBS, 16000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	3.75 mm	32 mm	No	2016 flip-flops; typical gates = 16000-20000	e0	133.3 MHz	30 s	193	225 °C (437 °F)	32 mm
XC4020E-3HQ208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	784	Yes	5.25 V	784	CMOS	224	13000	5	5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 20000 Logic gates	e0	125 MHz	30 s	224	225 °C (437 °F)	28 mm
XC3S50-5VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1728	Yes	1.26 V	192	CMOS	63	50000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.53 ns	192 CLBS, 50000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	725 MHz		63		14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.