Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3142A-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 2000-3000	e0	188 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC4052XLA-08BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	4598	Yes	3.6 V	1936	CMOS	289	33000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 100000 gates	e0	263 MHz	30 s	289	225 °C (437 °F)	35 mm
XC4062XLA-7BGG432C	Xilinx	FPGA	Other	Ball	432	HLBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS		40000	3.3		Grid Array, Heat Sink/Slug, Low Profile			3 V	1.27 mm	85 °C (185 °F)	0.9 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	294 MHz				40 mm
XCV600E-7FGG680C	Xilinx	FPGA	Other	Ball	680	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	512	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA680,39X39,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.9 mm	40 mm	No		e1	400 MHz	30 s	512	260 °C (500 °F)	40 mm
XC2VPX20-7FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	22032	Yes	1.575 V	2448	CMOS	552		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.28 ns	2448 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0	1350 MHz	30 s	552	225 °C (437 °F)	31 mm
XC5202-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	3 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC4010-5PG191C	Xilinx	FPGA	Other	Pin/Peg	191	PGA	Square	Ceramic, Metal-Sealed Cofired	400	No	5.25 V	400	CMOS	160	8000	5	5 V	Grid Array	PGA191M,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.5 ns	400 CLBS, 8000 Gates	0 °C (32 °F)	Tin Silver Copper	Perpendicular	S-CPGA-P191		4.064 mm	47.244 mm	No	1120 flip-flops; typical gates = 8000-10000	e1	133.3 MHz		160		47.244 mm
XC3S1400AN-5FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	375	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B484		2.6 mm	23 mm	No			770 MHz		288		23 mm
XC3142A-3PG84C	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS	74	2000	5	5 V	Grid Array	PGA84M,11X11	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2.7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P84		5.207 mm	27.94 mm	No	Typical gates = 2000-3000		270 MHz		74		27.94 mm
XC4036XLA-09BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS		22000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 65000 gates	e1	227 MHz	30 s		260 °C (500 °F)	35 mm
XC2VP20-8FF896C	Xilinx	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0		30 s		225 °C (437 °F)	31 mm
XC4004A-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	61	3200	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.5 ns	144 CLBS, 3200 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	480 flip-flops; typical gates = 3200-4000	e0	133.3 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XCV150-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy		Yes	2.625 V	864	CMOS		164674	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.8 ns	864 CLBS, 164674 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	250 MHz	30 s		250 °C (482 °F)	23 mm
XCKU115-3FLVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	1.03 V	5520		832		1	1 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1		30 s	832	245 °C (473 °F)	40 mm
XC4013XL-1BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	192	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.3 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	200 MHz	30 s	192	225 °C (437 °F)	27 mm
XCE7K325T-1FFV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		3.37 mm	27 mm								27 mm
XC4085XLA-08HQ208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS	160	55000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 180000 gates	e0	263 MHz	30 s	160	225 °C (437 °F)	28 mm
XC4020XLA-09PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS	224	13000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 40000 gates	e0	227 MHz	30 s	224	225 °C (437 °F)	28 mm
XC4085XLA-9HQG304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	3136	CMOS		55000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G304		4.5 mm	40 mm	No		e3	227 MHz				40 mm
XC4003-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	238	Yes	5.25 V	100	CMOS	61	2500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.5 ns	100 CLBS, 2500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	360 flip-flops; typical gates = 2500-3000	e0	133.3 MHz	30 s	61	225 °C (437 °F)	29.3116 mm
XCE7K420T-2FFV1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG	400		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	32575 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm			e1		30 s	400	245 °C (473 °F)	35 mm
XC4020-6PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	5.25 V	784	CMOS		16000	5		Flatpack, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	6 ns	784 CLBS, 16000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	2016 flip-flops; typical gates = 16000-20000	e3		30 s		245 °C (473 °F)	28 mm
XC4VFX140-10FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS	896		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		15792 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1028 MHz	30 s	896	225 °C (437 °F)	42.5 mm
XCV800-4BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	4704	CMOS		888439	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	4704 CLBS, 888439 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	42.5 mm
XC6VCX130T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS	600		1	1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XCV50-6CSG144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy		Yes	2.625 V	384	CMOS		57906	2.5		Grid Array, Thin Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)	0.6 ns	384 CLBS, 57906 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	333 MHz	30 s		260 °C (500 °F)	12 mm
XC5VLX85T-2FFG1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480		480		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	6480 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	480	245 °C (473 °F)	35 mm
XC4005-5PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS	112	4000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.5 ns	196 CLBS, 4000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	616 flip-flops; typical gates = 4000-5000	e0	133.3 MHz	30 s	112	225 °C (437 °F)	28 mm
XC4025E-3PG299C	Xilinx	FPGA	Other	Pin/Peg	299	HPGA	Square	Ceramic, Metal-Sealed Cofired	1024	No	5.25 V	1024	CMOS	256	15000	5	5 V	Grid Array, Heat Sink/Slug	PGA299,20X20	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2 ns	1024 CLBS, 15000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P299		4.318 mm	52.324 mm	No	Max usable 25000 Logic gates		125 MHz		256		52.324 mm
XC5215-4PQG299C	Xilinx	FPGA	Other	Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	484			15000	5		Grid Array			4.75 V	2.54 mm	85 °C (185 °F)	3.8 ns	484 CLBS, 15000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P299		4.2418 mm	52.324 mm	No	23000 Logic gates can also be used	e3	48 MHz				52.324 mm
XC3S1400AN-4TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	2816	CMOS		1400000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)	4.88 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	667 MHz				20 mm
XC3S2000-4FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array, Low Profile			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1					17 mm
XC4036XLA-07HQG208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS		22000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	0.9 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 65000 gates	e3	294 MHz	30 s		245 °C (473 °F)	28 mm
XC4052XLA-9BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	227 MHz				42.5 mm
XCVU125-H1FLVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	89520		884		0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		89520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.29 mm	47.5 mm		Also Operates at 1 V nominal supply	e1		30 s	884	245 °C (473 °F)	47.5 mm
XC2V10000-6BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XC7A25T-1CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC2VPX20-6FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	22032	Yes	1.575 V	2448	CMOS	552		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	2448 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0	1200 MHz	30 s	552	225 °C (437 °F)	31 mm
XC4028XLA-08BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS		18000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 50000 gates	e1	263 MHz	30 s		250 °C (482 °F)	27 mm
XC3S250E-5VQ100CS1	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	66	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.66 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Nickel/Palladium/Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4	657 MHz		59		14 mm
XCE7K420T-2FFV901C	Xilinx	FPGA	Other	Ball	901	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG	380		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	32575 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm			e1		30 s	380	245 °C (473 °F)	31 mm
XC2VP70-6FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	74448	Yes	1.575 V	8272	CMOS	964		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	8272 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1200 MHz	30 s	964	245 °C (473 °F)	40 mm
XCV300E-8FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	176	82944	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	1536 CLBS, 82944 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	416 MHz	30 s	176	225 °C (437 °F)	17 mm
XC5202-4VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS	84	2000	5	5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3.8 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAX available 3000 Logic gates	e0	83 MHz	30 s	84	240 °C (464 °F)	14 mm
XCV150-6HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	2.625 V	864			164674	2.5		Flatpack, Heat Sink/Slug, Fine Pitch			2.375 V	.5 mm	85 °C (185 °F)	0.6 ns	864 CLBS, 164674 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	333 MHz	30 s		225 °C (437 °F)	32 mm
XC7A12T-3FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150		1		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.95 V	1 mm	85 °C (185 °F)	0.94 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	17 mm
XC3S200AN-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	195	200000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	160	240 °C (464 °F)	17 mm
XCV300-6BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS	260	322970	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.6 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	333 MHz	30 s	260	225 °C (437 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.