Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A100T-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	7925 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1286 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7A12T-2CPG236C	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150		1			Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	10 mm
XC7K480T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	CMOS	400		1		1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	37325 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm	No		e1	1098 MHz	30 s	400	245 °C (473 °F)	35 mm
XC7VX1140T-1FLG1928C	Xilinx	FPGA	Other	Ball	1928	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS	480		1		0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	89000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1928		3.75 mm	45 mm	No		e1	1818 MHz		480		45 mm
XC7VX1140T-2FLG1928C	Xilinx	FPGA	Other	Ball	1928	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS	480		1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	89000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1928		3.75 mm	45 mm	No		e1	1818 MHz		480		45 mm
XC7VX1140T-2FLG1930C	Xilinx	FPGA	Other	Ball	1930	BGA	Square	Plastic/Epoxy	1139200	Yes	1.03 V	89000	CMOS	1100		1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	89000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.75 mm	45 mm	No		e1	1818 MHz		1100		45 mm
XC7VX485T-2FFG1761C	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V	37950	CMOS	700		1		1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	37950 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761		3.5 mm	42.5 mm	No		e1	1818 MHz		700		42.5 mm
XC7VX550T-2FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	554240	Yes	1.03 V	43300	CMOS	350		1		1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	43300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No		e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX690T-2FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	600		1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No		e1	1818 MHz		600	245 °C (473 °F)	45 mm
XCKU035-2FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700		520		.95		0.95 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm	No		e1			520		35 mm
XCKU085-1FLVB1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676		0.95		0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No		e1		30 s	676	245 °C (473 °F)	42.5 mm
XCKU115-1FLVB1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832		.95		0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No		e1		30 s	832	245 °C (473 °F)	42.5 mm
XCKU15P-2FFVA1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668		0.85			Grid Array	BGA1760,42X42,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.71 mm	42.5 mm			e1		30 s	668	245 °C (473 °F)	42.5 mm
XCKU15P-3FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.927 V	65340		668		0.9			Grid Array	BGA1517,39X39,40		.873 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	668	245 °C (473 °F)	40 mm
XCS05XL-4VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	238	Yes	3.6 V	100	CMOS	77	2000	3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 5000	e3	217 MHz	30 s	77	260 °C (500 °F)	14 mm
XCS10-4VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS	112	3000	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAXIMUM usable gates 10000	e0	166 MHz	30 s	112	240 °C (464 °F)	14 mm
XCS10XL-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	466	Yes	3.6 V	196	CMOS	112	3000	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAXIMUM usable gates 10000	e3	217 MHz	30 s	112	260 °C (500 °F)	20 mm
XCS20-3TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	7000	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 20000	e0	125 MHz	30 s	160	225 °C (437 °F)	20 mm
XCS20XL-5PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	950	Yes	3.6 V	400	CMOS	160	7000	3.3		3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 20000	e3	250 MHz	30 s	160	245 °C (473 °F)	28 mm
XCS30-3VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS	196	10000	5		5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)		Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 30000		125 MHz	30 s	196	240 °C (464 °F)	14 mm
XCS30XL-4PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	196	10000	3.3		3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 30000	e0	217 MHz	30 s	196	225 °C (437 °F)	28 mm
XCS30XL-5TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS	113	10000	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 30000	e3	250 MHz	30 s	113	260 °C (500 °F)	20 mm
XCS40XL-4PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS	205	13000	3.3		3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 40000	e0	217 MHz	30 s	205	225 °C (437 °F)	28 mm
XCV100-4CS144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS	94	108904	2.5		1.5/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)	0.8 ns	600 CLBS, 108904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	250 MHz	30 s	94	240 °C (464 °F)	12 mm
XCV300-5FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS	312	322970	2.5		1.2/3.6,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	294 MHz	30 s	312	225 °C (437 °F)	23 mm
XCV600-6HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS	166	661111	2.5		1.2/3.6,2.5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.6 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	333 MHz	30 s	166	225 °C (437 °F)	32 mm
XCVU095-H1FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		832		0.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 1 V nominal supply	e1		30 s	832	245 °C (473 °F)	40 mm
XCVU125-H1FLVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	89520		884		0.95			Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)		89520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm		Also Operates at 1 V nominal supply	e1		30 s	884	245 °C (473 °F)	40 mm
XCVU13P-1FHGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000		832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	52.5 mm						832		52.5 mm
XCVU13P-2FIGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000		832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		216000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.59 mm	52.5 mm			e1			832		52.5 mm
XCVU13P-3FHGA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.927 V	216000		832		0.9			Grid Array	BGA2104,46X46,40		.873 V	1 mm	100 °C (212 °F)		216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.24 mm	52.5 mm						832		52.5 mm
XCVU13P-3FHGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.927 V	216000		832		0.9			Grid Array	BGA2104,46X46,40		.873 V	1 mm	100 °C (212 °F)		216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	52.5 mm						832		52.5 mm
XCVU29P-2FIGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000		676		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		216000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.59 mm	52.5 mm						676		52.5 mm
XCVU440-2FLGA2892E	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	.979 V	2880		1456		.95			Grid Array	BGA2892,54X54,40		.922 V	1 mm	100 °C (212 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm			e1			1456		55 mm
XCVU440-3FLGA2892E	Xilinx	FPGA	Other	Ball	2892	BGA	Square	Plastic/Epoxy	5540850	Yes	1.03 V	2880		1456		1			Grid Array	BGA2892,54X54,40		.97 V	1 mm	100 °C (212 °F)		2880 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2892		3.83 mm	55 mm			e1			1456		55 mm
XCVU9P-3FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.927 V	147780		832		0.9			Grid Array	BGA2104,46X46,40		.873 V	1 mm	100 °C (212 °F)		147780 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm						832		47.5 mm
A3PN250-VQG100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS	68	250000	1.5			Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ		1.425 V	.5 mm	85 °C (185 °F)		250000 Gates	-20 °C (-4 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3			68		14 mm
M2GL060-FCSG325	Microchip Technology	FPGA	Other	Ball	325	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array			1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B325	3		11 mm					30 s		260 °C (500 °F)	11 mm
A3PN060-VQG100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1536	Yes	1.575 V		CMOS	71	60000	1.5			Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ		1.425 V	.5 mm	85 °C (185 °F)		60000 Gates	-20 °C (-4 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3		30 s	71	260 °C (500 °F)	14 mm
AGLN010V5-UCG36	Microchip Technology	FPGA	Other	Ball	36	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	260	CMOS		10000	1.5	Tray		Grid Array, Very Thin Profile, Fine Pitch			1.425 V	.4 mm	70 °C (158 °F)		260 CLBS, 10000 Gates	-20 °C (-4 °F)		Bottom	S-PBGA-B36		.8 mm	3 mm	No							3 mm
AGLN060V5-VQG100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS		60000	1.5			Flatpack, Thin Profile, Fine Pitch			1.425 V	.5 mm	70 °C (158 °F)		1536 CLBS, 60000 Gates	-20 °C (-4 °F)	Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3					14 mm
AGLN125V2-CSG81	Microchip Technology	FPGA	Other	Ball	81	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS		125000	1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	70 °C (158 °F)		3072 CLBS, 125000 Gates	-20 °C (-4 °F)		Bottom	S-PBGA-B81	3	.8 mm	5 mm	No				30 s		260 °C (500 °F)	5 mm
AGLN250V2-CSG81	Microchip Technology	FPGA	Other	Ball	81	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.2	Tray		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	70 °C (158 °F)		6144 CLBS, 250000 Gates	-20 °C (-4 °F)		Bottom	S-PBGA-B81	3	.8 mm	5 mm	No				30 s		260 °C (500 °F)	5 mm
AGLN250V2-VQ100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.2	Tray		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	70 °C (158 °F)		6144 CLBS, 250000 Gates	-20 °C (-4 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0					14 mm
M2GL010-VFG400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V			195		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					195		17 mm
M2GL025T-VF400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V			207		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400		1.51 mm	17 mm	No				20 s	207	240 °C (464 °F)	17 mm
M2GL090-FG484	Microchip Technology	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V			267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No					267		23 mm
XCS10XL-5VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	466	Yes	3.6 V	196	CMOS	77	3000	3.3		3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAXIMUM usable gates 10000	e3	250 MHz	30 s	77	260 °C (500 °F)	14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.