Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
10AX027H4F35E3LG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	TSMC	384	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	10162 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No				384	35 mm
10AX032E2F29E1SG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990		384	0.9	0.9 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	11990 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No	Also Operates at 0.95 V nominal supply			384	29 mm
10AX032H2F35E2SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	TSMC	384	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	11990 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply			384	35 mm
10AX048H2F34E2LG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V	18359	TSMC	492	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	18359 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply			492	35 mm
10AX048H2F34E2SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V	18359	TSMC	492	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	18359 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply			492	35 mm
10AX048K3F35E2SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V	18359	TSMC	396	0.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	18359 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply			396	35 mm
10AX057K4F40E3SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V	21708	TSMC	696	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	21708 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No				696	40 mm
10AX066N2F40E1HG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes		25168	TSMC	588			Grid Array	BGA1517,39X39,40			1 mm	100 °C (212 °F)	25168 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm					588	40 mm
10AX090R4F40E3SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	342	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm	No				342	40 mm
10AX090S3F45E2SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	624	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply			624	45 mm
10AX090U2F45E1SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC	480	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply			480	45 mm
10AX115N2F40E2LG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	600	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm	No	Also Operates at 0.95 V nominal supply			600	40 mm
10AX115N2F45E1SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	768	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply			768	45 mm
10AX115N3F45E2SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	768	0.9	0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply			768	45 mm
10AX115R4F40E3SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	342	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm	No				342	40 mm
10CL016YM164C8G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm						8 mm
10M04DAU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	4000	Yes	1.25 V	250		246	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No				246	15 mm
10M16DAU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No				320	15 mm
10M16DCF256C7G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	1000 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1		320	17 mm
10M16DCU324C8G	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2	1.2 V	Grid Array	BGA324,18X18,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)	1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324	3	1.55 mm	15 mm	No				320	15 mm
1SM16BHU2F53E2VG	Intel	FPGA	Other	Ball	2597	BGA	Square	Plastic/Epoxy	1650000	Yes		206250		656			Grid Array	BGA2597,51X51,40			1 mm	100 °C (212 °F)	206250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2597		3.881 mm	52.5 mm					656	52.5 mm
1SM21BHU2F53E1VG	Intel	FPGA	Other	Ball	2597	BGA	Square	Plastic/Epoxy	2100000	Yes		262500		656			Grid Array	BGA2597,51X51,40			1 mm	100 °C (212 °F)	262500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2597		3.881 mm	52.5 mm					656	52.5 mm
1SM21BHU2F53E2VG	Intel	FPGA	Other	Ball	2597	BGA	Square	Plastic/Epoxy	2100000	Yes		262500		656			Grid Array	BGA2597,51X51,40			1 mm	100 °C (212 °F)	262500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2597		3.881 mm	52.5 mm					656	52.5 mm
5AGXBA1D4F27C5N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	75000	Yes	1.13 V	2830		416	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	2830 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.7 mm	27 mm	No		e1	622 MHz	416	27 mm
5AGXBA1D6F31C6N	Intel	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	75000	Yes	1.13 V	2830		416	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	2830 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.7 mm	31 mm	No		e1		416	31 mm
5AGXFB1H4F40C5G	Intel	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	11321 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					704	40 mm
5AGXFB3H4F40C4N	Intel	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688		704	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA1517,39X39,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	13688 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	3	2.7 mm	40 mm	No		e1		704	40 mm
5AGXMA1D4F27C5N	Intel	FPGA	Other	Ball	672	HBGA	Square	Plastic/Epoxy	75000	Yes	1.13 V	2830		416	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	2830 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.7 mm	27 mm	No		e1		416	27 mm
5AGXMA5G4F31C4G	Intel	FPGA	Other	Ball	896	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544	1.1		Grid Array, Heat Sink/Slug	BGA896,30X30,40		1.07 V	1 mm	85 °C (185 °F)	7170 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B896		2.7 mm	31 mm					544	31 mm
5AGXMA7G4F31C4N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	242000	Yes	1.13 V	9168		544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	9168 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2.7 mm	31 mm	No		e1	670 MHz	544	31 mm
5AGXMB3G6F40C6G	Intel	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	13688 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					704	40 mm
5CEBA4F17C7N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	49000	Yes	1.13 V		CMOS	128	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No				128	17 mm
5CEBA4U19C7N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	49000	Yes	1.13 V		CMOS	224	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No				224	19 mm
5CEBA7F27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	150000	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm	No				336	27 mm
5CEBA7F31C8N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	150000	Yes	1.13 V		CMOS	480	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm	No				480	31 mm
5CEFA5M13C8N	Intel	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	175	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No				175	13 mm
5CEFA7F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No				240	23 mm
5CEFA7F27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm	No				336	27 mm
5CEFA7U19C6N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	230	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No				230	19 mm
5CEFA7U19C8N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	230	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No				230	19 mm
5CEFA7U19C8NES	Altera	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.13 V	56415					Grid Array, Fine Pitch			1.07 V	.8 mm	85 °C (185 °F)	56415 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.9 mm	19 mm			e1			19 mm
5CEFA9F31C7N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	488	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm	No				488	31 mm
5CEFA9F31C8N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	488	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B896		2 mm	31 mm	No				488	31 mm
5CGTFD5C5U19C7N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	76500	Yes	1.13 V		CMOS	240	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No				240	19 mm
5CGXBC4C6F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	336	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1		336	27 mm
5CGXBC9E7F35C8N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V	11356	CMOS	560	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)	11356 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.4 mm	35 mm	No				560	35 mm
5CGXFC3B6F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	31000	Yes	1.13 V		CMOS	224	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No				224	23 mm
5CGXFC4C7U19C8N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS	224	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No				224	19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.