Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP3SE80F780C4LG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V	3200			.9			Grid Array	BGA780,28X28,40		.86 V	1 mm	85 °C (185 °F)		3200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.2 mm	29 mm		Also Operates at 1.1 V VCC nominal						29 mm
EP3SL340F1517C3NES	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.94 V	13500			.9			Grid Array			.86 V	1 mm	85 °C (185 °F)		13500 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.7 mm	40 mm	No	It can also operate from 1.05 to 1.15 V supply	e1	717 MHz				40 mm
EP3SL340F1760C2	Intel	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	337500	Yes	.94 V		CMOS	1120	.9		1.2/3.3 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1760		3.9 mm	42.5 mm	No	It can also operate from 1.05 to 1.15 V supply		800 MHz		1120		42.5 mm
EP3SL50F780C4	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V		CMOS	488	.9		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B780		3.5 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply		717 MHz		488		29 mm
EP4CE10E22C8	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	10320	Yes	1.25 V	645		91	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e0	472.5 MHz		91		20 mm
EP4CE115F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	114480	Yes	1.25 V	7155		283	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		7155 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		283		23 mm
EP4CE115F29C7	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	114480	Yes	1.25 V	7155		531	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		7155 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e0	472.5 MHz		531		29 mm
EP4CE22F17C6	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	22320	Yes	1.25 V	1395		153	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1395 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		153		17 mm
EP4CE22F17C9LN	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	22320	Yes	1.03 V	1395		153	1		1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		1395 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	265 MHz		153		17 mm
EP4CE30F23C9L	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	28848	Yes	1.03 V	1803		331	1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		1803 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	265 MHz		331		23 mm
EP4CE40F23C8L	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.03 V	2475		331	1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	362 MHz		331		23 mm
EP4CE40F23C8LN	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.03 V	2475		331	1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	362 MHz		331		23 mm
EP4CE6E22C6	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.25 V	392		91	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e0	472.5 MHz		91		20 mm
EP4CE75F23C6	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	75408	Yes	1.25 V	4713		295	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		4713 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		295		23 mm
EP4CGX110DF27C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	109424	Yes	1.24 V	6839		393	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		6839 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.4 mm	27 mm	No		e1	472.5 MHz		393		27 mm
EP4CGX110DF31C7	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	109424	Yes	1.24 V	6839		475	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		6839 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B896	3	2.4 mm	31 mm	No		e0	472.5 MHz		475		31 mm
EP4CGX150DF27C8N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	149760	Yes	1.24 V	9360		393	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		9360 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.4 mm	27 mm	No		e1	472.5 MHz		393		27 mm
EP4CGX22BF14C8	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	21280	Yes	1.24 V	1330		72	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1330 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e0	472.5 MHz		72		14 mm
EP4SE530H40C2N	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	531200	Yes		212480	CMOS	976			0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		212480 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.8 mm	42.5 mm	No					976		42.5 mm
EP4SGX360FF35C4	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144	CMOS	564	.9		0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		14144 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		3.4 mm	35 mm	No		e0	717 MHz		564		35 mm
EP4SGX530HH35C4NES	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V	21248			.9			Grid Array			.87 V	1 mm	85 °C (185 °F)		21248 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B		3.8 mm	42.5 mm	No		e1	717 MHz				42.5 mm
EP4SGX530KH40C2N	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	531200	Yes		212480	CMOS	744			0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		212480 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.8 mm	42.5 mm	No					744		42.5 mm
LCMXO2-1200UHC-5FTG256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1280	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1	133 MHz	30 s	206	260 °C (500 °F)	17 mm
LCMXO2-1200ZE-2MG132C	Lattice Semiconductor	FPGA	Other	Ball	132	BGA	Square	Plastic/Epoxy	1280	Yes	1.26 V			104	1.2	Tray	1.2 V	Grid Array	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	133 MHz	30 s	104	250 °C (482 °F)	8 mm
LCMXO2-4000HC-6FTG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			206	2.5	Tray	2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	17 mm
LCMXO2-7000HC-4BG332C	Lattice Semiconductor	FPGA	Other	Ball	332	FBGA	Square	Plastic/Epoxy	6864	Yes	3.465 V			278	2.5	Tray	2.5/3.3 V	Grid Array, Fine Pitch	BGA332,20X20,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B332	3	2 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	278	260 °C (500 °F)	17 mm
LCMXO2280C-4TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		73	1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		40 s	73	260 °C (500 °F)	14 mm
LCMXO256C-3MN100C	Lattice Semiconductor	FPGA	Other	Ball	100	LFBGA	Square	Plastic/Epoxy	256	Yes	3.465 V	32		78	1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA100,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B100	3	1.35 mm	8 mm	No		e1		30 s	78	260 °C (500 °F)	8 mm
LCMXO256C-4TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	256	Yes	3.465 V	32		78	1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		32 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3		40 s	78	260 °C (500 °F)	14 mm
LCMXO3D-9400HC-6BG484C	Lattice Semiconductor	FPGA	Other	Ball	484	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		383	2.5			Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32		2.375 V	.8 mm	85 °C (185 °F)	6.7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		1.7 mm	19 mm		Also Operates at 3.3 V nominal supply				383		19 mm
LCMXO3D-9400ZC-2SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		9400	Yes	3.465 V	1175		58	2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		2.375 V	.5 mm	85 °C (185 °F)	7 ns	1175 CLBS	0 °C (32 °F)		Quad	S-XQCC-N72		.9 mm	10 mm		Also Operates at 3.3 V nominal supply				58		10 mm
LCMXO3L-1300E-5UWG36CTR1K	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160			1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm								2.541 mm
LCMXO3L-2100C-5BG324C	Lattice Semiconductor	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	264			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.7 mm	15 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	15 mm
LCMXO3L-4300C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	540			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-9400C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	1175			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-9400C-5BG484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	3.465 V	1175			2.5			Grid Array			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484			19 mm		Also Operates at 3.3 V nominal supply						19 mm
LCMXO3LF-2100C-6BG324C	Lattice Semiconductor	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	264			2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B324	3	1.7 mm	15 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	15 mm
LCMXO640C-3FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80		159	1.8		1.8/2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	159	260 °C (500 °F)	17 mm
LCMXO640C-5FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80		159	1.8		1.8/2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	159	260 °C (500 °F)	17 mm
LFE2-12SE-5QN208C	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12000	Yes	1.26 V	1500		131	1.2		1.2 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	311 MHz	40 s	131	245 °C (473 °F)	28 mm
LFE2-20SE-7FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2625		193	1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	420 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE2-20SE-7FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2625		402	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	420 MHz	30 s	402	250 °C (482 °F)	27 mm
LFE2-35E-6FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	35000	Yes	1.26 V	4000		331	1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	357 MHz		331	250 °C (482 °F)	23 mm
LFE2-70E-5FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	70000	Yes	1.26 V	8500		500	1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	311 MHz	30 s	500	250 °C (482 °F)	27 mm
LFE2M20E-6FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2375		304	1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.331 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	357 MHz		304	250 °C (482 °F)	23 mm
LFE2M20SE-5FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2375		140	1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	140	250 °C (482 °F)	17 mm
LFE3-17EA-7FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17000	Yes	1.26 V			133	1.2		1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.335 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	420 MHz	30 s	133	260 °C (500 °F)	17 mm
LFE3-17EA-8FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	17000	Yes	1.26 V			133	1.2		1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.281 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	500 MHz	30 s	133	260 °C (500 °F)	17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.