Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCVU160-H1FLGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	.979 V	115800		702		0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		115800 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm		Also Operates at 1 V nominal supply				702		47.5 mm
XC5206-6PG191C	Xilinx	FPGA	Other	Pin/Peg	191	HPGA	Square	Ceramic, Metal-Sealed Cofired	784	No	5.25 V	196	CMOS	148	6000	5	5 V	Grid Array, Heat Sink/Slug	PGA191M,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	5.6 ns	196 CLBS, 6000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P191		4.318 mm	47.244 mm	No	MAX available 10000 Logic gates		83 MHz		148		47.244 mm
XC2S600E-6FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	514	210000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	3456 CLBS, 210000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 600000	e0	357 MHz	30 s	514	225 °C (437 °F)	23 mm
XC4020XL-1PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS	224	13000	3.3	3.3 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.3 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 20000 Logic gates	e0	200 MHz	30 s	224	225 °C (437 °F)	28 mm
XC4005XL-2PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS	112	3000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.5 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 5000 Logic gates	e0	179 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC6SLX150-L1FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.05 V	11519	CMOS	338		1	1,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.46 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0		30 s	338	225 °C (437 °F)	23 mm
XC6SLX100T-N3FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	376		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	806 MHz	30 s	376	225 °C (437 °F)	27 mm
XC4013XLA-08PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	192	10000	3.3	3.3 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Can also use 30000 gates	e0	263 MHz	30 s	192	225 °C (437 °F)	28 mm
XC4010D-4PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	8000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4 ns	400 CLBS, 8000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	3.92 mm	28 mm	No	1120 flip-flops; typical gates = 8000-10000	e0	133.3 MHz	30 s	160	225 °C (437 °F)	28 mm
XC4005E-3PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS	112	3000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 5000 Logic gates	e0	125 MHz	30 s	112	225 °C (437 °F)	20 mm
XC3042-70PP132CSPC0107	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Plastic/Epoxy		No	5.25 V	144	CMOS		2000	5		Grid Array			4.75 V	2.54 mm	85 °C (185 °F)	9 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132		3.7338 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000		70 MHz				37.084 mm
XC5215-4BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS	244	15000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	3.8 ns	484 CLBS, 15000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	MAX available 23000 Logic gates	e0	83 MHz	30 s	244	225 °C (437 °F)	35 mm
XC4044XLA-07HQ208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS	320	27000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	0.9 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 80000 gates	e0	294 MHz	30 s	320	225 °C (437 °F)	28 mm
XC4052XLA-8BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	263 MHz				42.5 mm
XC5210-6PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS	196	10000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	5.6 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	32 mm
XCKU085-3FLVF1924E	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676		1	1 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	676	245 °C (473 °F)	45 mm
XCE7K410T-1FBV676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	HKMG	400		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	31775 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B676		2.54 mm	27 mm						400		27 mm
XC7A100T-L1CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	101440	Yes	.98 V	7925		300		0.95		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC4010XL-2PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS	160	7000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.5 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 10000 Logic gates	e0	179 MHz	30 s	160	225 °C (437 °F)	28 mm
XC6VSX315T-2FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XC3064A-7PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	70	3500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.1 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 4500 Logic gates	e0	113 MHz	30 s	70	225 °C (437 °F)	29.3116 mm
XCE7VX690T-2FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy		Yes	1.03 V	54150				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	54150 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm			e1		30 s		245 °C (473 °F)	45 mm
XC4062XL-3BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS		40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.6 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 62000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	40 mm
XC6VCX195T-2FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS	600		1	1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC3S1000L-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes		1920	CMOS	221	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0		30 s	221	225 °C (437 °F)	19 mm
XC5VFX100T-1FFG1738C	Xilinx	FPGA	Other	Ball	1738	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	CMOS	680		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	8000 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e1		30 s	680	245 °C (473 °F)	42.5 mm
XC4044XLA-7HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	0.9 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	294 MHz	30 s		225 °C (437 °F)	32 mm
XC3195A1PG175C	Xilinx	FPGA	Other	Pin/Peg	175	HPGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.25 V	484	CMOS	144	6500	5	5 V	Grid Array, Heat Sink/Slug	PGA175,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.75 ns	484 CLBS, 6500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175		4.318 mm	42.164 mm	No	Max usable 7500 Logic gates		323 MHz		144		42.164 mm
XC6SLX45-1LFGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	500 MHz	30 s		250 °C (482 °F)	23 mm
XC2V6000-6BFG957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	684	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e1	820 MHz	30 s	684	245 °C (473 °F)	40 mm
XCE7VX415T-1FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	600		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	32200 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm			e1		30 s	600	245 °C (473 °F)	45 mm
XCVU11P-3FLGF1924E	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	2835000	Yes	.927 V	162000		624		0.9		Grid Array	BGA1924,44X44,40		.873 V	1 mm	100 °C (212 °F)		162000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1924		4.24 mm	45 mm						624		45 mm
XC6VLX130T-1LFFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V	10000	CMOS	400		0.9		Grid Array	BGA784,28X28,40		.87 V	1 mm	85 °C (185 °F)	0.85 ns	10000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	2.86 mm	29 mm			e1			400		29 mm
XCV400-4BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	2400	CMOS		468252	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	2400 CLBS, 468252 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	40 mm
XC2V10000-6FFG1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	15360	CMOS		10000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		15360 CLBS, 10000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1		30 s		245 °C (473 °F)	35 mm
XCS40XL-4CS280C	Xilinx	FPGA	Other	Ball	280	TFBGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS	224	13000	3.3	3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA280,19X19,32	Field Programmable Gate Arrays	3 V	.8 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B280	3	1.2 mm	16 mm	No	Maximum usable gates 40000	e0	217 MHz	30 s	224	240 °C (464 °F)	16 mm
XC5206-5TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	196	CMOS		6000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	4.6 ns	196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAX available 10000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	20 mm
XC3S1200E-4FG400CS1	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	304	1200000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	572 MHz	30 s	232	225 °C (437 °F)	21 mm
XC5VLX110-2FFV1153C	Xilinx	FPGA	Other	Ball	1153	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800		1		Grid Array	BGA1153,34X34,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	8640 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1153		3.4 mm	35 mm						800		35 mm
XC3042A-6VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS		2000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm		Max usable 3000 Logic gates	e3	135 MHz	30 s		260 °C (500 °F)	14 mm
XC4010XL-1PQG160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS		7000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)	1.3 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 10000 Logic gates	e3	200 MHz	30 s		245 °C (473 °F)	28 mm
XC5215-6HQ208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS	244	15000	5	5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	5.6 ns	484 CLBS, 15000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	MAX available 23000 Logic gates	e0	83 MHz	30 s	244	225 °C (437 °F)	28 mm
XC4020XLA-08BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS	224	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 40000 gates	e0	263 MHz	30 s	224	225 °C (437 °F)	27 mm
XC4044XLA-9HQG160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	1.1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160		4.1 mm	28 mm	No		e3	227 MHz				28 mm
XC7A15T-2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	250	245 °C (473 °F)	35 mm
XC4010E-2PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	7000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	1.6 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 10000 Logic gates	e0	125 MHz	30 s	160	225 °C (437 °F)	28 mm
XCV50E-6FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS	176	20736	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	384 CLBS, 20736 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	357 MHz	30 s	176	225 °C (437 °F)	17 mm
XC4013XL-3HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS		10000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	166 MHz	30 s		225 °C (437 °F)	32 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.