Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VHX380T-2FF1154C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	320		1	1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No		e0	1286 MHz		320		35 mm
XC3S4000-5FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0		30 s		225 °C (437 °F)	19 mm
XC5204-3TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	120	CMOS		4000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	3 ns	120 CLBS, 4000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAX available 6000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	20 mm
XC7A75T-1CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC4002XL-1VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	64	Yes	3.6 V	64	CMOS	64	1000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.3 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Max usable 1600 Logic gates	e0	200 MHz	30 s	64	240 °C (464 °F)	14 mm
XC2018-100TQ100C	Xilinx	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	74	1000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	8 ns	100 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.7 mm	14 mm	No	174 flip-flops; typical gates = 1000-1500	e0	100 MHz	30 s	74	225 °C (437 °F)	14 mm
XC3130A-1PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.75 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	323 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC5215-5BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS	244	15000	5	5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.6 ns	484 CLBS, 15000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	MAX available 23000 Logic gates	e0	83 MHz	30 s	244	225 °C (437 °F)	35 mm
XCV1000E-6FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No		e0	357 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XC4013-4PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS	192	10000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	3.75 mm	32 mm	No	1536 flip-flops; typical gates = 10000-13000	e0	133.3 MHz	30 s	192	225 °C (437 °F)	32 mm
XC6SLX4-N3CSG225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V	300				1.2		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	300 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm			e1		30 s		260 °C (500 °F)	13 mm
XC4006E-3PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	256	Yes	5.25 V	256	CMOS	128	4000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2 ns	256 CLBS, 4000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 6000 Logic gates	e0	125 MHz	30 s	128	225 °C (437 °F)	28 mm
XC4003E-1PQ100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	80	2000	5	5 V	Flatpack	QFP100,.7X.9	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	1.3 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	Max usable 3000 Logic gates	e0	166 MHz	30 s	80	225 °C (437 °F)	20 mm
XCV200E-8CS144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	94	63504	1.8	1.2/3.6,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.71 V	.8 mm	85 °C (185 °F)	0.4 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	416 MHz	30 s	94	240 °C (464 °F)	12 mm
XC3190A-4PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	144	5000	5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3.3 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 6000 Logic gates	e0	227 MHz	30 s	144	225 °C (437 °F)	28 mm
XCV100E-7FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	176	32400	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	400 MHz	30 s	176	225 °C (437 °F)	17 mm
XC4005XL-2PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS	112	3000	3.3	3.3 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.5 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 5000 Logic gates	e0	179 MHz	30 s	112	225 °C (437 °F)	28 mm
XC4036XLA-8BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS		22000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	263 MHz				35 mm
XCVU160-3FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2026500	Yes	1.03 V	1560		702		1		Grid Array	BGA2104,46X46,40		.97 V	1 mm	100 °C (212 °F)		1560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm			e1			702		47.5 mm
XC3S200A-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	248	200000	1.2	1.2,2.5/3.3 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0	667 MHz	30 s	192	225 °C (437 °F)	19 mm
XC7A75T-2CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300		1		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.95 V	.5 mm	85 °C (185 °F)	1.05 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1286 MHz		300		10 mm
XC5215-6PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	484	Yes	5.25 V	484	CMOS	244	15000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	5.6 ns	484 CLBS, 15000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	MAX available 23000 Logic gates	e0	83 MHz	30 s	244	225 °C (437 °F)	28 mm
XC3S2000-5VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e4					14 mm
XC3190A-2TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS		5000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	2.2 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm		Max usable 6000 Logic gates	e3	323 MHz	30 s		260 °C (500 °F)	20 mm
XC3S1500-4VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0					14 mm
XC3S4000-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1		30 s		250 °C (482 °F)	23 mm
XC7A35T-2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	250	245 °C (473 °F)	35 mm
XC4010XL-2TQG176C	Xilinx	FPGA	Other	Gull Wing	176	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS		7000	3.3		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.5 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G176	3	1.6 mm	24 mm	No	Max usable 10000 Logic gates	e3	179 MHz	30 s		260 °C (500 °F)	24 mm
XCV300-5BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	6912	Yes	2.625 V	1536	CMOS	260	322970	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	2.375 V	1.27 mm	85 °C (185 °F)	0.7 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	294 MHz	30 s	260	225 °C (437 °F)	35 mm
XC4028XL-09BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS		18000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Typical gates = 18000-50000	e1	217 MHz	30 s		250 °C (482 °F)	27 mm
XC6VSX315T-1FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS	720		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1098 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XCS30XL-5PQG240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS	192	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Maximum usable gates 30000	e3	250 MHz	30 s	192	245 °C (473 °F)	32 mm
XC4005E-3PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	196	CMOS		3000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 5000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	29.3116 mm
XCS40-4PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	784	Yes	5.25 V	784	CMOS	205	13000	5	5 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.2 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Maximum usable gates 40000	e0	166 MHz	30 s	205	225 °C (437 °F)	32 mm
XC7A15T-L1FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	16640	Yes	.98 V	1300		250		0.95		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40		.92 V	1 mm	85 °C (185 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	17 mm
XC7A15T-L1CPG236C	Xilinx	FPGA	Other	Ball	236	LFBGA	Square	Plastic/Epoxy	16640	Yes	.98 V	1300		250		0.95		Grid Array, Low Profile, Fine Pitch	BGA236,19X19,20		.92 V	.5 mm	85 °C (185 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B236	3	1.38 mm	10 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	10 mm
XC4013E-4PQG160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	5.25 V	576	CMOS		10000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	2.7 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 13000 Logic gates	e3	111 MHz	30 s		245 °C (473 °F)	28 mm
XCV50E-7CS144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS	94	20736	1.8	1.2/3.6,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.71 V	.8 mm	85 °C (185 °F)	0.42 ns	384 CLBS, 20736 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	400 MHz	30 s	94	240 °C (464 °F)	12 mm
XC7K160T-1FFG676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy		Yes	1.03 V					1		Grid Array	BGA676,26X26,40		.97 V	1 mm	100 °C (212 °F)	0.74 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1		30 s		250 °C (482 °F)	27 mm
XC4025E-4HQG240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		15000	5		Flatpack, Heat Sink/Slug, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	2.7 ns	1024 CLBS, 15000 Gates	0 °C (32 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Max usable 25000 Logic gates		111 MHz				32 mm
XC7A100T-L1CPG238C	Xilinx	FPGA	Other	Ball	238	LFBGA	Square	Plastic/Epoxy	101440	Yes	.98 V	7925		300		0.95		Grid Array, Low Profile, Fine Pitch	BGA238,19X19,20		.92 V	.5 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B238		1.38 mm	10 mm			e1	1098 MHz		300		10 mm
XC3195A-3PG223C	Xilinx	FPGA	Other	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.25 V	484	CMOS	176	6500	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2.7 ns	484 CLBS, 6500 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P223	1	4.318 mm	47.244 mm	No	Typical gates = 6500-7500		270 MHz		176		47.244 mm
XC2VP40-6FFG1517C	Xilinx	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	4848	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)	0.33 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1200 MHz	30 s		245 °C (473 °F)	40 mm
XC3190A-1TQ176C	Xilinx	FPGA	Other	Gull Wing	176	LFQFP	Square	Plastic/Epoxy	320	Yes	5.25 V	320	CMOS	144	5000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.75 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G176	3	1.6 mm	24 mm	No	Max usable 6000 Logic gates	e0	323 MHz	30 s	144	225 °C (437 °F)	24 mm
XC4036XLA-09BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1296	CMOS		22000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)		1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 65000 gates	e1					27 mm
XC40250XV-08BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	8464	Yes	2.7 V	8464	CMOS	448	180000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1.1 ns	8464 CLBS, 180000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 500000 gates	e0	258 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XC4062XLA-09BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS		40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 130000 gates	e1	227 MHz	30 s		260 °C (500 °F)	35 mm
XC5VFX30T-2FFG665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	32768	Yes	1.05 V	2560	CMOS	360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	2560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e1		30 s	360	250 °C (482 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.