Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4052XLA-08BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS	352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 100000 gates	e0	263 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4028XL-09HQG304C	Xilinx	FPGA	Other	Gull Wing	352	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS		18000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.2 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)		Quad	S-PQFP-G352		4.5 mm	40 mm	No	Typical gates = 18000-50000		217 MHz				40 mm
XC2V500-5FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.575 V	768	CMOS	172	500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.39 ns	768 CLBS, 500000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0	750 MHz	30 s	172	225 °C (437 °F)	17 mm
XC3S4000-4FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS	712	4000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	6912 CLBS, 4000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	630 MHz	30 s	712	245 °C (473 °F)	35 mm
XCVU080-H1FFVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	55714		832		0.95		Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		55714 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	3.86 mm	47.5 mm		Also Operates at 1 V nominal supply	e1		30 s	832	245 °C (473 °F)	47.5 mm
XCE7VX980T-1FFG1926C	Xilinx	FPGA	Other	Ball	1926	BGA	Square	Plastic/Epoxy	979200	Yes	1.03 V	76500	HKMG	720		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	76500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm			e1		30 s	720	245 °C (473 °F)	45 mm
XC7A12T-L2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	12800	Yes	.93 V	1000	HKMG	150		0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	245 °C (473 °F)	35 mm
XC4005XL-09PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS	112	3000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Typical gates = 3000-9000	e0	217 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XC2VP40-5FFG1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	43632	Yes	1.575 V	4848	CMOS	692		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.36 ns	4848 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e1	1050 MHz	30 s	692	245 °C (473 °F)	35 mm
XCV1600E-8BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	404	419904	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.4 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e0	416 MHz	30 s	404	225 °C (437 °F)	42.5 mm
XC6VLX365T-1LFF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	.93 V							Grid Array			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0					35 mm
XC4044XL-2BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS	320	27000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.5 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Max usable 44000 Logic gates	e0	179 MHz	30 s	320	225 °C (437 °F)	40 mm
XC6VHX250T-3FF1154C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	251904	Yes	1.05 V		CMOS	320		1	1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No		e0	1412 MHz		320		35 mm
XC2V4000-6FF1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	912	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e0	820 MHz	30 s	912	225 °C (437 °F)	40 mm
XC4052XL-3BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.6 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Max usable 52000 Logic gates	e1	166 MHz	30 s		260 °C (500 °F)	42.5 mm
XC6SLX150-2FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	498		1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	667 MHz	30 s	498	250 °C (482 °F)	27 mm
XC3S2000-4CP132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B132		1.1 mm	8 mm	No							8 mm
XC5VLX50T-2FFV1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	46080	Yes	10.5 V	3600		480		1		Grid Array	BGA1136,34X34,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	3600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm			e1		30 s	480	245 °C (473 °F)	35 mm
XC5VLX330T-2FFV1738C	Xilinx	FPGA	Other	Ball	1738	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920		960		1		Grid Array	BGA1738,42X42,40		.95 V	1 mm	85 °C (185 °F)	0.77 ns	25920 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm					30 s	960	245 °C (473 °F)	42.5 mm
XCS20-4VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	400	CMOS		7000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 20000	e3	166 MHz	30 s		260 °C (500 °F)	14 mm
XC4028XLA-07HQ208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS	256	18000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	0.9 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 50000 gates	e0	294 MHz	30 s	256	225 °C (437 °F)	28 mm
XC6VHX380T-1FF1923C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	720		1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1924		3.85 mm	45 mm	No		e0	1098 MHz		720		45 mm
XCV3200E-8CGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Ceramic, Metal-Sealed Cofired		Yes	1.89 V	16224	CMOS		876096	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.4 ns	16224 CLBS, 876096 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-CBGA-B1156		3.11 mm	35 mm	No		e1	416 MHz				35 mm
XC6SLX100-2FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	326		1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	326	225 °C (437 °F)	23 mm
XCV200E-6BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	260	63504	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.47 ns	1176 CLBS, 63504 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	357 MHz	30 s	260	225 °C (437 °F)	35 mm
XC4062XLA-07BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	5472	Yes	3.6 V	2304	CMOS	289	40000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	0.9 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 130000 gates	e0	294 MHz	30 s	289	225 °C (437 °F)	35 mm
XC5VLX30T-3FFG665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400	CMOS	360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)		2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e1	1412 MHz	30 s	360	250 °C (482 °F)	27 mm
XC7K160T-2FBV484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.03 V	12675				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	12675 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2.54 mm	23 mm			e1					23 mm
XC6VLX550T-L1FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	.93 V		CMOS	840		.9	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e1	1098 MHz	30 s	840	245 °C (473 °F)	42.5 mm
XC6VLX365T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VLX365T-1FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC4052XL-1HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS	352	33000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.3 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Max usable 52000 Logic gates	e0	200 MHz	30 s	352	225 °C (437 °F)	32 mm
XC5VLX50T-1FF1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	46080	Yes	10.5 V	3600		480		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	3600 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e0		30 s	480	225 °C (437 °F)	35 mm
XC5VTX150T-1FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	148480	Yes	1.05 V	11600	CMOS	680		1	1,2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	11600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e1		30 s	680	245 °C (473 °F)	42.5 mm
XC3042-70PG132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Ceramic, Metal-Sealed Cofired	144	No	5.25 V	144	CMOS	96	2000	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	9 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P132		3.9116 mm	37.084 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA		70 MHz		96		37.084 mm
XC3030A-6PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	58	1500	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	3	5.08 mm	24.2316 mm	No	Max usable 2000 Logic gates	e0	135 MHz		58		24.2316 mm
XC3S400A-5FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	195	400000	1.2	1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	770 MHz	30 s	160	225 °C (437 °F)	17 mm
XC3S250E-4CPG132CS1	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	92	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XCV600E-7FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS	444	186624	1.8	1.2/3.6,1.8 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	3456 CLBS, 186624 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	400 MHz	30 s	444	250 °C (482 °F)	27 mm
XC2S200E-6PQG208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	289	71000	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	1176 CLBS, 71000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 200000	e3	357 MHz	30 s	289	245 °C (473 °F)	28 mm
XCV300-4FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e0					17 mm
XC6VLX75T-1LFFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	.93 V	5820	CMOS	240		0.9		Grid Array	BGA484,22X22,40		.87 V	1 mm	85 °C (185 °F)	0.85 ns	5820 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	4	2.86 mm	23 mm			e1		30 s	240	250 °C (482 °F)	23 mm
XC3020-70PC84CSPC0107	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	9 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	256 flip-flops; typical gates = 1000-1500	e0	70 MHz				29.3116 mm
XC7A12T-L2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	12800	Yes	.93 V	1000	HKMG	150		0.9		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.87 V	.8 mm	85 °C (185 °F)	1.51 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A15T-1CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	250	260 °C (500 °F)	15 mm
XC4028XL-1HQ208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS	256	18000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.3 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 28000 Logic gates	e0	200 MHz	30 s	256	225 °C (437 °F)	28 mm
XC3042A-6PQG100C	Xilinx	FPGA	Other	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy		Yes	5.25 V	144	CMOS		2000	5		Flatpack			4.75 V	.65 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm		Max usable 3000 Logic gates	e3	135 MHz	30 s		245 °C (473 °F)	20 mm
XC4020XLA-09BGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS		13000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 40000 gates	e1	227 MHz	30 s		250 °C (482 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.