Other Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCV400-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	10800	Yes	2.625 V	2400	CMOS	404	468252	2.5	1.2/3.6,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.8 ns	2400 CLBS, 468252 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	250 MHz	30 s	404	225 °C (437 °F)	27 mm
XCV600-5FG680C	Xilinx	FPGA	Other	Ball	680	LBGA	Square	Plastic/Epoxy	15552	Yes	2.625 V	3456	CMOS	512	661111	2.5	1.2/3.6,2.5 V	Grid Array, Low Profile	BGA680,39X39,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No		e0	294 MHz	30 s	512	225 °C (437 °F)	40 mm
XCKU11P-1FFVD900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512		0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	512	245 °C (473 °F)	31 mm
XCV150-6FGG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	2.625 V	864	CMOS		164674	2.5		Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.6 ns	864 CLBS, 164674 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	333 MHz				17 mm
XC5202-4VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	3.8 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	14 mm
XC3030A-7PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS	34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	113 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC6SLX45T-3NFGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz				23 mm
XC4010E-2BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	7000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	1.6 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	125 MHz	30 s	160	225 °C (437 °F)	27 mm
XC3S2000-4FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0		30 s		225 °C (437 °F)	19 mm
XCV1000E-8HQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	158	331776	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.4 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	416 MHz	30 s	158	225 °C (437 °F)	32 mm
XC4010XL-09PQG160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS		7000	3.3		Flatpack			3 V	.65 mm	85 °C (185 °F)	1.2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Typical gates = 7000-20000	e3	217 MHz	30 s		245 °C (473 °F)	28 mm
XCE7VX415T-2FFV1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy	412160	Yes	1.03 V	32200	HKMG	600		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	32200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1927		3.65 mm	45 mm						600		45 mm
XCS40XL-4BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS	205	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e0	217 MHz	30 s	205	225 °C (437 °F)	27 mm
XC7A25T-L2CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	.93 V	1825	HKMG	150		0.9		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.87 V	.8 mm	85 °C (185 °F)	1.51 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XCE7VX550T-2FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy		Yes	1.03 V	43300				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	43300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm			e1		30 s		245 °C (473 °F)	45 mm
XC3020-70PG84CSPC0107	Xilinx	FPGA	Other	Pin/Peg	84	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	64	CMOS		1000	5		Grid Array			4.75 V	2.54 mm	85 °C (185 °F)	9 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Matte Tin	Perpendicular	S-CPGA-P84		4.318 mm	27.94 mm	No	256 flip-flops; typical gates = 1000-1500	e3	70 MHz				27.94 mm
XC4025E-2HQG304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	5.25 V	1024	CMOS		15000	5		Flatpack, Heat Sink/Slug, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	1024 CLBS, 15000 Gates	0 °C (32 °F)		Quad	S-PQFP-G304		4.5 mm	40 mm	No	Max usable 25000 Logic gates		125 MHz				40 mm
XC7A25T-L1CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825	HKMG	150		0.95		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.92 V	.8 mm	85 °C (185 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1098 MHz	30 s	150	260 °C (500 °F)	15 mm
XC3S2000-5VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3		30 s		260 °C (500 °F)	14 mm
XC3190A-4PGG175C	Xilinx	FPGA	Other	Pin/Peg	175	HPGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	320	CMOS		5000	5		Grid Array, Heat Sink/Slug			4.75 V	2.54 mm	85 °C (185 °F)	3.3 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P175			42.164 mm		Max usable 6000 Logic gates		227 MHz				42.164 mm
XCV100E-8PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	158	32400	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.4 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	416 MHz	30 s	158	225 °C (437 °F)	32 mm
XCV100E-7BG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	196	32400	1.8	1.2/3.6,1.8 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	1.71 V	1.27 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e0	400 MHz	30 s	196	225 °C (437 °F)	35 mm
XC3S1400AN-5FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy		Yes	1.26 V	2816	CMOS		1400000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)	4.36 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	770 MHz	30 s		225 °C (437 °F)	21 mm
XCS30XL-3PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	196	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)		576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0		30 s	196	225 °C (437 °F)	32 mm
XCV1000-6BGG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	6144	CMOS		1124022	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.6 ns	6144 CLBS, 1124022 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No		e1	333 MHz	30 s		260 °C (500 °F)	42.5 mm
XC4044XL-3HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS	320	27000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.6 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Max usable 44000 Logic gates	e0	166 MHz	30 s	320	225 °C (437 °F)	32 mm
XC3042-125PC84CSPC0107	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	5.5 ns	144 CLBS, 2000 Gates	0 °C (32 °F)		Quad	S-PQCC-J84		5.08 mm	29.3116 mm	No	480 flip-flops; typical gates = 2000-3000		125 MHz				29.3116 mm
XC3195A-5PG223C	Xilinx	FPGA	Other	Pin/Peg	223	PGA	Square	Ceramic, Metal-Sealed Cofired	484	No	5.25 V	484	CMOS	176	6500	5	5 V	Grid Array	PGA223,18X18	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	4.1 ns	484 CLBS, 6500 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P223	1	4.318 mm	47.244 mm	No	Typical gates = 6500-7500	e0	188 MHz		176		47.244 mm
XC3164A-3PP132C	Xilinx	FPGA	Other	Pin/Peg	132	PGA	Square	Plastic/Epoxy	224	No	5.25 V	224	CMOS	110	3500	5	5 V	Grid Array	PGA132,14X14	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2.7 ns	224 CLBS, 3500 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P132	1	4.191 mm	37.084 mm	No	Typical gates = 3500-4500		270 MHz		110		37.084 mm
XC4028XLA-08HQG160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS		18000	3.3		Flatpack, Heat Sink/Slug			3 V	.65 mm	85 °C (185 °F)	1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)		Quad	S-PQFP-G160		4.1 mm	28 mm	No	Can also use 50000 gates		263 MHz				28 mm
XCV600-4FGG680C	Xilinx	FPGA	Other	Ball	680	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	3456	CMOS		661111	2.5		Grid Array, Low Profile			2.375 V	1 mm	85 °C (185 °F)	0.8 ns	3456 CLBS, 661111 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B680	3	1.7 mm	40 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	40 mm
XCV100-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	2.625 V	600	CMOS		108904	2.5		Flatpack, Low Profile, Fine Pitch			2.375 V	.5 mm	85 °C (185 °F)	0.8 ns	600 CLBS, 108904 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	250 MHz	30 s		260 °C (500 °F)	20 mm
XC6VSX475T-1LFF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	476160	Yes	.93 V	37200	CMOS	840		0.9		Grid Array	BGA1759,42X42,40		.87 V	1 mm	85 °C (185 °F)	0.85 ns	37200 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759		3.5 mm	42.5 mm			e0			840		42.5 mm
XCS30-4BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS	196	10000	5	5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 30000	e0	166 MHz	30 s	196	225 °C (437 °F)	27 mm
XC6SLX100T-2FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	498		1.2	1.2,2.5/3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	7911 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0	667 MHz	30 s	498	225 °C (437 °F)	31 mm
XC5215-4HQG208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	5.25 V	484	CMOS		15000	5		Flatpack, Heat Sink/Slug, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	3.8 ns	484 CLBS, 15000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	MAX available 23000 Logic gates	e3	83 MHz	30 s		245 °C (473 °F)	28 mm
XC6VLX550T-1FFG1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	549888	Yes	1.05 V		CMOS	840		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e1	1098 MHz	30 s	840	245 °C (473 °F)	42.5 mm
XC4085XLA-09HQ304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS	256	55000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP304,1.7SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No	Can also use 180000 gates	e0	227 MHz	30 s	256	225 °C (437 °F)	40 mm
XC4020XLA-9PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS		13000	3.3		Flatpack, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0	227 MHz				28 mm
XCS10XL-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS	112	3000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAXIMUM usable gates 10000	e0	250 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XCV50-4HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	2.625 V	384			57906	2.5		Flatpack, Heat Sink/Slug, Fine Pitch			2.375 V	.5 mm	85 °C (185 °F)	0.8 ns	384 CLBS, 57906 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	250 MHz	30 s		225 °C (437 °F)	32 mm
XC5VLX30-2FF676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		400		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	2400 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e0		30 s	400	225 °C (437 °F)	27 mm
XC6SLX150-N3FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	498		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	806 MHz	30 s	498	225 °C (437 °F)	27 mm
XC4013E-2HQG208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	5.25 V	576	CMOS		10000	5		Flatpack, Heat Sink/Slug, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 13000 Logic gates	e3	125 MHz	30 s		245 °C (473 °F)	28 mm
XC3S400-4CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B132		1.1 mm	8 mm	No							8 mm
XC3064A-7TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	224	CMOS		3500	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	5.1 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm		Max usable 4500 Logic gates	e3	113 MHz	30 s		260 °C (500 °F)	20 mm
XC2S200E-6FTG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	289	71000	1.8	1.2/3.6,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	1176 CLBS, 71000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 200000	e1	357 MHz	30 s	289	260 °C (500 °F)	17 mm
XC7A25T-3CSG325C	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	85 °C (185 °F)	0.94 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1412 MHz	30 s	150	260 °C (500 °F)	15 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.