Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5204-4VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	120	CMOS		4000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	3.8 ns	120 CLBS, 4000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAX available 6000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	14 mm
XC4044XL-2HQ304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS	320	27000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP304,1.7SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.5 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No	Max usable 44000 Logic gates	e0	179 MHz	30 s	320	225 °C (437 °F)	40 mm
XC4044XL-2HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS	320	27000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.5 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Max usable 44000 Logic gates	e0	179 MHz	30 s	320	225 °C (437 °F)	32 mm
XC4010E-1HQG208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	5.25 V	400	CMOS		7000	5		Flatpack, Heat Sink/Slug, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.3 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 10000 Logic gates	e3	166 MHz	30 s		245 °C (473 °F)	28 mm
XC3142A-1PCG84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS		2000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	1.75 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm		Max usable 3000 Logic gates	e3	323 MHz	30 s		245 °C (473 °F)	29.3116 mm
XC3190A-1PP175C	Xilinx	FPGA	Other	Pin/Peg	175	HPGA	Square	Plastic/Epoxy	320	No	5.25 V	320	CMOS	144	5000	5	5 V	Grid Array, Heat Sink/Slug	PGA175,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.75 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Perpendicular	S-PPGA-P175		4.191 mm	42.164 mm	No	Max usable 6000 Logic gates		323 MHz		144		42.164 mm
XC5VLX30-2FF324C	Xilinx	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		220		1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.77 ns	2400 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No		e0		30 s	220	225 °C (437 °F)	19 mm
XC4013E-2PQ160C	Xilinx	FPGA	Other	Gull Wing	160	QFP	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS	192	10000	5	5 V	Flatpack	QFP160,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 13000 Logic gates	e0	125 MHz	30 s	192	225 °C (437 °F)	28 mm
XC4044XLA-08HQG240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1600	CMOS		27000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1 ns	1600 CLBS, 27000 Gates	0 °C (32 °F)		Quad	S-PQFP-G240		4.1 mm	32 mm	No	Can also use 80000 gates		263 MHz				32 mm
XCS05-4VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	100	CMOS		2000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.2 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 5000	e3	166 MHz	30 s		260 °C (500 °F)	14 mm
XC2VP20-8FF1152C	Xilinx	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	2320	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1 mm	85 °C (185 °F)		2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No		e0		30 s		225 °C (437 °F)	35 mm
XCKU13P-3FFVE900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	746550	Yes	.927 V	42660		304		0.9		Grid Array	BGA900,30X30,40		.873 V	1 mm	100 °C (212 °F)		42660 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XCV400-4HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	10800	Yes	2.625 V	2400	CMOS	166	468252	2.5	1.2/3.6,2.5 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.8 ns	2400 CLBS, 468252 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	250 MHz	30 s	166	225 °C (437 °F)	32 mm
XC5VLX110T-3FF1738C	Xilinx	FPGA	Other	Ball	1738	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		680		1	1,2.5 V	Grid Array	BGA1738,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	8640 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1738	4	3.25 mm	42.5 mm	No		e0		30 s	680	225 °C (437 °F)	42.5 mm
XC5VLX50-1FFV1153C	Xilinx	FPGA	Other	Ball	1153	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600		560		1		Grid Array	BGA1153,34X34,40		.95 V	1 mm	85 °C (185 °F)	0.9 ns	3600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm			e1		30 s	560	245 °C (473 °F)	35 mm
XC3S1000-5FG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B900	3	2.6 mm	31 mm	No		e0					31 mm
XC4VFX140-11FFG1760C	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS	896		1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		15792 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1	1205 MHz	30 s	896	225 °C (437 °F)	42.5 mm
XC7A25T-2CSG325E	Xilinx	FPGA	Other	Ball	325	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150		1		Grid Array, Low Profile, Fine Pitch	BGA325,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.5 mm	15 mm			e1	1286 MHz	30 s	150	260 °C (500 °F)	15 mm
XC7A25T-3FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	0.94 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1412 MHz	30 s	150	245 °C (473 °F)	35 mm
XC5VLX110-1FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	8640 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e1		30 s	440	250 °C (482 °F)	27 mm
XC6SLX75T-2CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	290		1.2	1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	290	260 °C (500 °F)	19 mm
XC4020E-4HQG208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	5.25 V	784	CMOS		13000	5		Flatpack, Heat Sink/Slug, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	2.7 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Max usable 20000 Logic gates	e3	111 MHz	30 s		245 °C (473 °F)	28 mm
XC3090-100PQ208CSPC0107	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS		5000	5		Flatpack, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	7 ns	320 CLBS, 5000 Gates	0 °C (32 °F)		Quad	S-PQFP-G208		3.92 mm	28 mm	No	928 flip-flops; typical gates = 5000-6000		100 MHz				28 mm
XC2V8000-6BFG957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	11648	CMOS		8000000	1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)	0.35 ns	11648 CLBS, 8000000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e1	820 MHz	30 s		245 °C (473 °F)	40 mm
XC4085XLA-08HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy	3136	Yes	3.6 V	3136	CMOS	448	55000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Can also use 180000 gates	e0	263 MHz	30 s	448	225 °C (437 °F)	32 mm
XC2VP50-6BF957C	Xilinx	FPGA	Other	Ball	957	HBGA	Square	Plastic/Epoxy		Yes	1.575 V	5648	CMOS			1.5		Grid Array, Heat Sink/Slug			1.425 V	1.27 mm	85 °C (185 °F)		5648 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No		e0		30 s		225 °C (437 °F)	40 mm
XC4062XL-09BGG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS		40000	3.3		Grid Array, Low Profile			3 V	1.27 mm	85 °C (185 °F)	1.2 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Typical gates = 40000-130000	e1	217 MHz	30 s		260 °C (500 °F)	40 mm
XC3S250E-5CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	92	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.66 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	657 MHz	30 s	85	260 °C (500 °F)	8 mm
XCV100E-6PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	158	32400	1.8	1.2/3.6,1.8 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	357 MHz	30 s	158	225 °C (437 °F)	32 mm
XC4013XL-09CHT176C	Xilinx	FPGA	Other	Gull Wing	176	HLFQFP	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS	145	10000	3.3	3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G176	3	1.6 mm	24 mm	No	Max usable 13000 Logic gates	e0	217 MHz		145		24 mm
XC2V1000-4FF896C	Xilinx	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	1280	CMOS	432	1000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.44 ns	1280 CLBS, 1000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No		e0	650 MHz	30 s	432	225 °C (437 °F)	31 mm
XC5215-3PQ299C	Xilinx	FPGA	Other	Pin/Peg	299	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.25 V	484			15000	5		Grid Array			4.75 V	2.54 mm	85 °C (185 °F)	3 ns	484 CLBS, 15000 Gates	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P299		4.2418 mm	52.324 mm	No	23000 Logic gates can also be used	e0	52 MHz				52.324 mm
XC4028XLA-9BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS		18000	3.3		Grid Array			3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 50000 gates	e0	227 MHz				27 mm
XC3142A-3VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS		2000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	2.7 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm		Max usable 3000 Logic gates	e3	270 MHz	30 s		260 °C (500 °F)	14 mm
XC5VFX70T-1FFV665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	71680	Yes	1.05 V	5600	CMOS	360		1		Grid Array	BGA665,26X26,40		.95 V	1 mm	85 °C (185 °F)	0.9 ns	5600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm			e1		30 s	360	250 °C (482 °F)	27 mm
XCE7K325T-2FBV900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B900		2.54 mm	31 mm								31 mm
XC40150XV-07BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	5184	Yes	2.7 V	5184	CMOS	448	100000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 300000 gates	e0	296 MHz	30 s	448	225 °C (437 °F)	40 mm
XC4028XLA-9HQ240C	Xilinx	FPGA	Other	Gull Wing	240	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1024	CMOS		18000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0	227 MHz	30 s		225 °C (437 °F)	32 mm
XC3020A-6PCG68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		1000	5		Chip Carrier			4.75 V	1.27 mm	85 °C (185 °F)	4.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)		Quad	S-PQCC-J68		5.08 mm	24.2316 mm		Max usable 1500 Logic gates		135 MHz				24.2316 mm
XCV150-4BGG352C	Xilinx	FPGA	Other	Ball	352	LBGA	Square	Plastic/Epoxy		Yes	2.625 V	864	CMOS		164674	2.5		Grid Array, Low Profile			2.375 V	1.27 mm	85 °C (185 °F)	0.8 ns	864 CLBS, 164674 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	35 mm
XC3042-70PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS	74	2000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	9 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	480 flip-flops; typical gates = 2000-3000; power-down supplier current = 120 µA	e0	70 MHz	30 s	74	225 °C (437 °F)	29.3116 mm
XC5202-6VQG64C	Xilinx	FPGA	Other	Gull Wing	64	TFQFP	Square	Plastic/Epoxy		Yes	5.25 V	64	CMOS		2000	5		Flatpack, Thin Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	5.6 ns	64 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	MAX available 3000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	10 mm
XC4052XL-3HQG304C	Xilinx	FPGA	Other	Gull Wing	304	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	1936	CMOS		33000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.6 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)		Quad	S-PQFP-G304		4.5 mm	40 mm	No	Max usable 52000 Logic gates		166 MHz				40 mm
XC3S700A-5FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	311	700000	1.2	1.2,2.5/3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No		e0	770 MHz	30 s	248	225 °C (437 °F)	21 mm
XC5VLX85T-3FFG1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480		480		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	6480 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	480	245 °C (473 °F)	35 mm
XC4VFX140-11FFG1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	142128	Yes	1.26 V	15792	CMOS	768		1.2		Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		15792 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	1181 MHz	30 s	768	245 °C (473 °F)	40 mm
XC4062XLA-07HQG208C	Xilinx	FPGA	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy		Yes	3.6 V	2304	CMOS		40000	3.3		Flatpack, Heat Sink/Slug, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	0.9 ns	2304 CLBS, 40000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Can also use 130000 gates	e3	294 MHz	30 s		245 °C (473 °F)	28 mm
XC4013XLA-08BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	192	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Can also use 30000 gates	e0	263 MHz	30 s	192	225 °C (437 °F)	27 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.