Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3S250E-4VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	66	250000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	572 MHz	30 s	59	260 °C (500 °F)	14 mm
XC5VFX30T-1FFG665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	32768	Yes	1.05 V	2560	CMOS	360		1		1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	2560 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No		e1		30 s	360	250 °C (482 °F)	27 mm
XC7S100-1FGGA676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	102400	Yes	1.05 V	8000	HKMG	400		1			Grid Array	BGA676,26X26,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	8000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676		2.44 mm	27 mm			e1	1098 MHz		400		27 mm
XCV200-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1176	CMOS		236666	2.5			Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.8 ns	1176 CLBS, 236666 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	250 MHz	30 s		250 °C (482 °F)	23 mm
10AX048H4F34E3SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V	18359	TSMC	492		0.9		0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18359 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					492		35 mm
5CEBA4U15C8N	Intel	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	49000	Yes	1.13 V		CMOS	176		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm	No					176		15 mm
5CEFA9F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	230		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					230		23 mm
AGLN010V2-QNG48	Microchip Technology	FPGA	Other	No Lead	48	HVQCCN	Square			Yes	1.575 V	260	CMOS		10000	1.2			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.14 V	.4 mm	70 °C (158 °F)		260 CLBS, 10000 Gates	-20 °C (-4 °F)	Matte Tin	Quad	S-XQCC-N48	3	1 mm	6 mm	No		e3		30 s		260 °C (500 °F)	6 mm
EP2C15AF256C8N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	14448	Yes	1.25 V	903	CMOS	152		1.2		1.2,1.5/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		903 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also requires 3.3 V supply	e1	402.5 MHz		144		17 mm
EP2S30F672C5N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	33880	Yes	1.25 V	13552	CMOS	500		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1.27 mm	85 °C (185 °F)	5.962 ns	13552 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	35 mm	No		e1	640 MHz		492		35 mm
EP3C25F324C7	Intel	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	215		1.2			Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	3	1.9 mm	19 mm	No		e0	472.5 MHz		215		19 mm
EP3SL50F780C4N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V	1900		488		0.9		1.2/3.3 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		1900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780		3.2 mm	29 mm	No	It can also operate from 1.05 to 1.15 V supply	e1			488		29 mm
EP4CE15F23C8LN	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		346		1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	362 MHz		346		23 mm
EP4CE55F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491		327		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		327		23 mm
EP4CE6E22C8L	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	6272	Yes	1.03 V	392		91		1		1,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.97 V	.5 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e0	362 MHz		91		20 mm
EP4CGX22CF19C8N	Intel	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	21280	Yes	1.24 V	1330		150		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1330 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No		e1	472.5 MHz		150		19 mm
LCMXO3L-2100E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	264				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1				260 °C (500 °F)	6 mm
LCMXO3L-6900C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858				2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LFXP6C-5TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	720	Yes	3.465 V	720	CMOS	100		1.8		1.8/2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.44 ns	720 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	375 MHz	40 s	100	260 °C (500 °F)	20 mm
XC7A100T-1FTG256C	Xilinx	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	1098 MHz	30 s	300	260 °C (500 °F)	17 mm
XCKU035-1SFVA784C	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520		0.95		0.95 V	Grid Array, Fine Pitch	BGA784,28X28,32	Field Programmable Gate Arrays	.922 V	.8 mm	85 °C (185 °F)		25391 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm	No		e1			520		23 mm
XCKU035-2FBVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700		520		.95		0.95 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	2.71 mm	27 mm	No		e1		30 s	520	250 °C (482 °F)	27 mm
XCKU115-2FLVB1760E	Xilinx	FPGA	Other	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832		.95		0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No		e1		30 s	832	245 °C (473 °F)	42.5 mm
10AX066H4F34E3SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V	25168	TSMC	492		0.9		0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		25168 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					492		35 mm
10M40SAE144C8G	Intel	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	40000	Yes	3.15 V	2500		500		3			Flatpack	HQFP144,.87SQ,20		2.85 V	.5 mm	85 °C (185 °F)		2500 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				500		20 mm
5CEFA4F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	48000	Yes	1.13 V		CMOS	304		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					304		23 mm
5CGXFC7C6F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS	240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1		30 s	240	260 °C (500 °F)	23 mm
EP1C12F256C6N	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		185		1.5		1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1206 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e1	405 MHz		185		17 mm
EP2SGX90FF1508C5N	Intel	FPGA	Other	Ball	1508	BGA	Square	Plastic/Epoxy	90960	Yes	1.25 V	90960	CMOS	650		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.962 ns	90960 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No		e1	640 MHz		650		40 mm
EP4CE22E22C7N	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	22320	Yes	1.25 V	1395		79		1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		1395 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		79		20 mm
EP4CE6F17C8LN	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.03 V	392		179		1		1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	362 MHz		179		17 mm
EP4CGX15BN11C8N	Altera	FPGA	Other	Butt	148	HVBCC	Square		14400	Yes	1.24 V	900		72		1.2		1.2,1.2/3.3,2.5 V	Chip Carrier, Heat Sink/Slug, Very Thin Profile	LGA148,22X22,20	Field Programmable Gate Arrays	1.16 V	.5 mm	85 °C (185 °F)		900 CLBS	0 °C (32 °F)	Gold Over Nickel	Bottom	S-XBCC-B148	3	.8 mm	11 mm	No		e4	472.5 MHz		72		11 mm
EP4CGX22BF14C8N	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	21280	Yes	1.24 V	1330		72		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1330 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz		72		14 mm
LCMXO2-7000HC-4FG484C	Lattice Semiconductor	FPGA	Other	Ball	484	HBGA	Square	Plastic/Epoxy	6864	Yes	3.465 V			334		2.5	Tray	2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	334	250 °C (482 °F)	23 mm
LCMXO3L-4300E-5UWG81CTR	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm			e1				260 °C (500 °F)	3.797 mm
LCMXO3LF-2100E-5UWG49CTR50	Lattice Semiconductor	FPGA	Other	Ball	49	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	264				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm			e1				260 °C (500 °F)	3.185 mm
LFE2-6E-6TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	6000	Yes	1.26 V	750		90		1.2		1.2 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.331 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	357 MHz	40 s	90	260 °C (500 °F)	20 mm
LIFCL-17-8UWG72C	Lattice Semiconductor	FPGA	Other	Ball	72	VFBGA	Rectangular	Plastic/Epoxy	17000	Yes	1.05 V			24		1			Grid Array, Very Thin Profile, Fine Pitch	BGA72,8X9,16		.95 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	R-PBGA-B72	1	.608 mm	3.8074 mm					30 s	24	260 °C (500 °F)	4.1251 mm
XC3S1000-5FG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS	221	1000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e0	725 MHz	30 s	221	225 °C (437 °F)	19 mm
XC3S4000-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS	489	4000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	6912 CLBS, 4000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	630 MHz	30 s	489	260 °C (500 °F)	27 mm
XC6SLX45-2CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	310		1.2		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	310	260 °C (500 °F)	19 mm
XC6SLX9-2FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	186		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	715 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	667 MHz	30 s	186	225 °C (437 °F)	17 mm
XC7A75T-1CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm
XC7K325T-1FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	400		1		1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1	1098 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7K325T-1FFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	500		1		1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm	No		e1	1098 MHz	30 s	500	245 °C (473 °F)	31 mm
XC7K325T-2FBG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	CMOS	500		1		1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	25475 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	2.54 mm	31 mm	No		e1	1818 MHz	30 s	500	245 °C (473 °F)	31 mm
10AX048E4F29E3SG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V	18359	TSMC	360		0.9		0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		18359 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No					360		29 mm
10CL016YU484C6G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	963				1.2			Grid Array, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm								19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.