Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LFXP2-17E-5QN208C8W	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	17000	Yes	1.26 V		CMOS	146		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	311 MHz		146	245 °C (473 °F)	28 mm
LFXP2-40E-7F484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.26 V		CMOS	363		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	435 MHz	30 s	363	225 °C (437 °F)	23 mm
LFXP3C-3T144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	384	Yes	3.465 V	384	CMOS	100		1.8		1.8/2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.63 ns	384 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	375 MHz		100	225 °C (437 °F)	20 mm
LFXP3C-4TN100C	Lattice Semiconductor	FPGA	Other	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	384	Yes	3.465 V	384	CMOS	62		1.8		1.8/2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.53 ns	384 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	375 MHz	40 s	62	260 °C (500 °F)	14 mm
LFXP3C-5TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	384	Yes	3.465 V	384	CMOS	100		1.8		1.8/2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.44 ns	384 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	375 MHz	40 s	100	260 °C (500 °F)	20 mm
M2GL060T-1FGG484	Microchip Technology	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array			1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm
XC2S30-6CSG144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	972	Yes	2.625 V	216		92	30000	2.5		1.5/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)	0.6 ns	216 CLBS, 30000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No	Maximum usable gates 30000	e1	263 MHz	30 s	92	260 °C (500 °F)	12 mm
XC3S1600E-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	33192	Yes	1.26 V	3688	CMOS	250	1600000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	3688 CLBS, 1600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	572 MHz	30 s	194	260 °C (500 °F)	19 mm
XC3S400-4PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	141	400000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.61 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	630 MHz		141		28 mm
XC40150XV-09PG559C	Xilinx	FPGA	Other	Pin/Peg	559	HIPGA	Square	Ceramic, Metal-Sealed Cofired	5184	No	2.7 V	5184	CMOS	448	100000	2.5		2.5,3.3 V	Grid Array, Heat Sink/Slug, Interstitial Pitch	HSPGA559,43X43	Field Programmable Gate Arrays	2.3 V	2.54 mm	85 °C (185 °F)	1.3 ns	5184 CLBS, 100000 Gates	0 °C (32 °F)		Perpendicular	S-CPGA-P559		5.969 mm	57.404 mm	No	Can also use 300000 gates		225 MHz		448		57.404 mm
XC6SLX45T-3FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	296		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	3411 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	862 MHz	30 s	296	225 °C (437 °F)	23 mm
XC6VLX130T-1FFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	240		1		1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC7A50T-3CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.94 ns	4075 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XCKU5P-2FFVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304		0.85			Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
XCV300-6FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5			Grid Array			2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	333 MHz	30 s		250 °C (482 °F)	23 mm
XCVU9P-3FSGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.927 V	147780		832		0.9			Grid Array	BGA2104,46X46,40		.873 V	1 mm	100 °C (212 °F)		147780 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.59 mm	47.5 mm						832		47.5 mm
10AX016E3F27E1SG	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	160000	Yes	.93 V	6151		288		0.9		0.9 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		6151 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672		3.35 mm	27 mm	No	Also Operates at 0.95 V nominal supply				288		27 mm
10AX027E3F29E2SG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	TSMC	360		0.9		0.9 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10162 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3.35 mm	29 mm	No	Also Operates at 0.95 V nominal supply				360		29 mm
10AX032H3F34E2SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes	.93 V	11990	TSMC	384		0.9		0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		11990 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply				384		35 mm
10AX066K4F40E3SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V	25168	TSMC	696		0.9		0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		25168 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm	No					696		40 mm
10M08DAF256C7G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			250		17 mm
10M08DAF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			250		23 mm
10M16DAF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			320		23 mm
10M50DCF484C8G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3125 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			500		23 mm
5CGXBC5C6F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	77000	Yes	1.13 V		CMOS	240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			240		23 mm
5CGXFC9D6F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	336		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1		30 s	336	260 °C (500 °F)	27 mm
A2F500M3G-FGG484	Microchip Technology	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	11520	Yes	1.575 V	11520	CMOS	128	500000	1.5	Tray	1.5,1.8,2.5,3.3 V	Grid Array	BGA484,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		11520 CLBS, 500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	80 MHz	30 s	128	250 °C (482 °F)	23 mm
AGL125V2-FGG144	Microchip Technology	FPGA	Other	Ball	144	LBGA	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS	97	125000	1.2			Grid Array, Low Profile	BGA144,12X12,40		1.14 V	1 mm	85 °C (185 °F)		125000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
AGL600V2-FGG256	Microchip Technology	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS	177	600000	1.2			Grid Array	BGA256,16X16,40		1.14 V	1 mm	85 °C (185 °F)		600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1		30 s	177	250 °C (482 °F)	17 mm
AGL600V5-FGG256	Microchip Technology	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS	177	600000	1.5			Grid Array	BGA256,16X16,40		1.425 V	1 mm	85 °C (185 °F)		600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No		e1		30 s	177	250 °C (482 °F)	17 mm
AGLN060V2-VQG100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS		60000	1.2			Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	70 °C (158 °F)		1536 CLBS, 60000 Gates	-20 °C (-4 °F)	Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3					14 mm
EP2C35F484C8	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	33216	Yes	1.25 V	2076	CMOS	322		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		2076 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e0	402.5 MHz		306		23 mm
EP3C16F256C7N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		168		17 mm
EP3C40F780C6N	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	535		1.2			Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz		535		29 mm
EP3C40F780C7N	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy	39600	Yes	1.25 V	39600	CMOS	535		1.2			Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		39600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B780	3	3.5 mm	29 mm	No		e1	472.5 MHz		535		29 mm
EP4CE10F17C7	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	10320	Yes	1.25 V	645		179		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		179		17 mm
EP4CE15E22C6N	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		81		1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		81		20 mm
EP4CE15E22C8	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		81		1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144		1.65 mm	20 mm	No		e0	472.5 MHz		81		20 mm
EP4CE15E22C8LN	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		81		1		1,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.97 V	.5 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	362 MHz		81		20 mm
EP4CE15F17C6N	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		165		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		165		17 mm
EP4CE15F23C8	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.25 V	963		346		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		346		23 mm
EP4CE15F23C9LN	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		346		1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	265 MHz		346		23 mm
EP4CE55F23C8	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491		327		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		327		23 mm
EP4CE55F23C9LN	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.03 V	3491		327		1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	265 MHz		327		23 mm
EP4CGX30CF23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		290		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		290		23 mm
LCMXO2-1200ZE-1TG100CR1	Lattice Semiconductor	FPGA	Other	Gull Wing	100	QFP	Square	Plastic/Epoxy	1280	Yes	1.26 V			79		1.2	Tray	1.2 V	Flatpack	QFP100,.63SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e3	133 MHz	30 s	79	260 °C (500 °F)	14 mm
LCMXO2-256ZE-2UMG64C	Lattice Semiconductor	FPGA	Other	Ball	64	VFBGA	Square	Plastic/Epoxy	256	Yes	1.26 V			44		1.2	Tray	1.2 V	Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16	Field Programmable Gate Arrays	1.14 V	.4 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B64	3	1 mm	4 mm	No		e1		30 s	44	260 °C (500 °F)	4 mm
LCMXO2-4000HC-6TG144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4320	Yes	3.465 V			114		2.5	Tray	2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Operates at 3.3 V nominal supply	e3		30 s	114	260 °C (500 °F)	20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.