Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
5CGXFC7D6F31C7N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy		Yes	1.13 V					1.1			Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm			e1		30 s		260 °C (500 °F)	31 mm
5SGSMD6N2F45C3N	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	583000	Yes	.88 V	22000	CMOS	840		.85		0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		22000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.9 mm	45 mm	No					840		45 mm
AGL125V5-VQG100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	3072	Yes	1.575 V		CMOS	71	125000	1.5			Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ		1.425 V	.5 mm	85 °C (185 °F)		125000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3		30 s	71	260 °C (500 °F)	14 mm
AGLN020V5-QNG68	Microchip Technology	FPGA	Other	No Lead	68	HVQCCN	Square			Yes	1.575 V	520	CMOS		20000	1.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile			1.425 V	.4 mm	70 °C (158 °F)		520 CLBS, 20000 Gates	-20 °C (-4 °F)		Quad	S-XQCC-N68	3	1 mm	8 mm	No							8 mm
AGLN060V2-VQ100	Microchip Technology	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS		60000	1.2	Tray		Flatpack, Thin Profile, Fine Pitch			1.14 V	.5 mm	70 °C (158 °F)		1536 CLBS, 60000 Gates	-20 °C (-4 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0					14 mm
EP1AGX90EF1152C6N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.25 V	90220		538		1.2		1.2,2.5/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		90220 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No		e1	640 MHz		538		35 mm
EP1C12F256C6	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		185		1.5		1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1206 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e0	405 MHz		185		17 mm
EP1C12F256C7N	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	12060	Yes	1.575 V	1206		185		1.5		1.5,1.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)		1206 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.2 mm	17 mm	No		e1	320 MHz		185		17 mm
EP1C6T144C7	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		98		1.5		1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		598 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	320 MHz		98		20 mm
EP1C6T144C8	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		98		1.5		1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		598 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	275 MHz		98		20 mm
EP2C20F484C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	18752	Yes	1.25 V	1172	CMOS	315		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1172 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	500 MHz	30 s	299	260 °C (500 °F)	23 mm
EP2C50F484C6N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50528	Yes	1.25 V	3158	CMOS	294		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3158 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also requires 3.3 V supply	e1	500 MHz	30 s	278	260 °C (500 °F)	23 mm
EP2S90H484C5	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	90960	Yes	1.25 V	36384	CMOS	308		1.2		1.2,1.5/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		36384 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	3.5 mm	27 mm	No		e0			300		27 mm
EP3C10F256C6N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	182		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		10320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		182		17 mm
EP3C120F780C8NES	Intel	FPGA	Other	Ball	780	BGA	Rectangular	Plastic/Epoxy		Yes	1.25 V	119088				1.2			Grid Array			1.15 V	1 mm	85 °C (185 °F)		119088 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B780		3.5 mm	29 mm	No		e1	472.5 MHz				29 mm
EP3C5M164C7N	Intel	FPGA	Other	Ball	164	BGA	Square	Plastic/Epoxy	5136	Yes	2.625 V	5136	CMOS	106		2.5		1.2/3.3 V	Grid Array	BGA164,15X15,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)		5136 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164				No					106
EP3SE80F1152C3N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V	3200		744		0.9		1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.86 V	1 mm	85 °C (185 °F)		3200 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No	It can also operate from 1.05 to 1.15 V supply				744		35 mm
EP4CE22E22C8	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	22320	Yes	1.25 V	1395		79		1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		1395 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e0	472.5 MHz		79		20 mm
EP4CE22E22C8LN	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	22320	Yes	1.03 V	1395		79		1		1,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	.97 V	.5 mm	85 °C (185 °F)		1395 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	362 MHz		79		20 mm
EP4CE55F23C7	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	55856	Yes	1.25 V	3491		327		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3491 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	472.5 MHz		327		23 mm
EP4CE6F17C8	Intel	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	6272	Yes	1.25 V	392		179		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	472.5 MHz		179		17 mm
EP4CGX150CF23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	149760	Yes	1.24 V	9360		270		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		9360 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e1	472.5 MHz		270		23 mm
EP4CGX15BF14C6N	Intel	FPGA	Other	Ball	169	LBGA	Square	Plastic/Epoxy	14400	Yes	1.24 V	900		72		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA169,13X13,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B169	3	1.55 mm	14 mm	No		e1	472.5 MHz		72		14 mm
EP4CGX30CF19C8N	Intel	FPGA	Other	Ball	324	LBGA	Square	Plastic/Epoxy	29440	Yes	1.24 V	1840		150		1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA324,18X18,40	Field Programmable Gate Arrays	1.16 V	1 mm	85 °C (185 °F)		1840 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.55 mm	19 mm	No		e1	472.5 MHz		150		19 mm
EP4SGX530HH35C3NES	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V	21248				.9			Grid Array			.87 V	1 mm	85 °C (185 °F)		21248 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B		3.8 mm	42.5 mm	No		e1	717 MHz				42.5 mm
LCMXO1200C-3BN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	1200	Yes	3.465 V	150		211		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.71 V	.8 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1			211	260 °C (500 °F)	14 mm
LCMXO1200E-3FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	1200	Yes	1.26 V	150		211		1.2		1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	211	260 °C (500 °F)	17 mm
LCMXO2-1200HC-5TG100CR1	Lattice Semiconductor	FPGA	Other	Gull Wing	100	QFP	Square	Plastic/Epoxy	1280	Yes	3.465 V		CMOS	80		2.5		2.5/3.3 V	Flatpack	QFP100,.63SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3			No		e3	133 MHz		80
LCMXO2-4000HC-4FTG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V			206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	17 mm
LCMXO2-4000HE-6MG184C	Lattice Semiconductor	FPGA	Other	Ball	184	LFBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V			150		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA184,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B184	3	1.5 mm	8 mm	No		e1			150		8 mm
LCMXO2280C-4TN144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		113		1.8		1.8/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s	113	260 °C (500 °F)	20 mm
LCMXO2280C-5MN132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285		101		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		40 s	101	260 °C (500 °F)	8 mm
LCMXO3D-9400ZC-2BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		206		2.5			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		2.375 V	.8 mm	85 °C (185 °F)	7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm		Also Operates at 3.3 V nominal supply				206		14 mm
LCMXO3D-9400ZC-3SG72C	Lattice Semiconductor	FPGA	Other	No Lead	72	HVQCCN	Square		9400	Yes	3.465 V	1175		58		2.5			Chip Carrier, Heat Sink/Slug, Very Thin Profile	LCC72,.40SQ,20		2.375 V	.5 mm	85 °C (185 °F)	6.7 ns	1175 CLBS	0 °C (32 °F)		Quad	S-XQCC-N72		.9 mm	10 mm		Also Operates at 3.3 V nominal supply				58		10 mm
LCMXO3L-640E-5MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	80				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1				260 °C (500 °F)	6 mm
LCMXO3L-6900C-6BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858				2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3LF-1300E-5MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	160				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm			e1				260 °C (500 °F)	9 mm
LCMXO3LF-9400C-6BG484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	3.465 V	1175				2.5			Grid Array			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484			19 mm		Also Operates at 3.3 V nominal supply						19 mm
LCMXO640C-3MN132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80		101		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		40 s	101	260 °C (500 °F)	8 mm
LFD2NX-17-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
LFE2-20E-5FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2625		193		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE3-35EA-6FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	33000	Yes	1.26 V			295		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	375 MHz		295	250 °C (482 °F)	23 mm
LFE3-35EA-6FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	33000	Yes	1.26 V			133		1.2		1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	375 MHz	30 s	133	260 °C (500 °F)	17 mm
LFEC6E-4QN208C	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6100	Yes	1.26 V	768		147		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.48 ns	768 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	420 MHz	40 s	147	245 °C (473 °F)	28 mm
LFXP2-17E-5FTN256C8W	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V		CMOS	201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz		201	260 °C (500 °F)	17 mm
LFXP2-5E-6QN208C	Lattice Semiconductor	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	146		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	435 MHz	40 s	146	245 °C (473 °F)	28 mm
LIFCL-40-7BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74		1			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.7 mm	17 mm					30 s	74	260 °C (500 °F)	17 mm
M2GL010T-VFG400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V			195		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					195		17 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.