Other Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
M2GL025-1VFG256	Microchip Technology	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.56 mm	14 mm								14 mm
M2GL090T-1FG676	Microchip Technology	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS	425		1.2	Tray	1.2 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No					425		27 mm
M2GL090TS-1FCS325	Microchip Technology	FPGA	Other	Ball	325	BGA	Square	Plastic/Epoxy	86316	Yes	1.26 V		CMOS	180		1.2	Tray	1.2 V	Grid Array	BGA325,21X21,20	Field Programmable Gate Arrays	1.14 V		85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B325				No				20 s	180	240 °C (464 °F)
M2S005-VF400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	4956	Yes	1.26 V		CMOS	160		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B400		1.51 mm	17 mm	No		e0		30 s	160	240 °C (464 °F)	17 mm
XC2S200-6PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176		144	200000	2.5		1.5/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 200000	e4	263 MHz		140		28 mm
XC2S30-5VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	972	Yes	2.625 V	216		92	30000	2.5		1.5/3.3,2.5 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	216 CLBS, 30000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 30000	e3	263 MHz	30 s	92	260 °C (500 °F)	14 mm
XC3S1200E-4FTG256CS1	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	19512	Yes	1.26 V	2168	CMOS	190	1200000	1.2		1.2,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.76 ns	2168 CLBS, 1200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	572 MHz	30 s	150	260 °C (500 °F)	17 mm
XC3S250E-4PQG208CS1	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	158	250000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e3	572 MHz	30 s	126	245 °C (473 °F)	28 mm
XC3S250E-5TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	108	250000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.66 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	657 MHz		80		20 mm
XC3S400A-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	251	400000	1.2		1.2,2.5/3.3 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	667 MHz	30 s	192	260 °C (500 °F)	19 mm
XC3S5000-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS	489	5000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	8320 CLBS, 5000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	725 MHz	30 s	489	260 °C (500 °F)	27 mm
XC3S50A-5VQG100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	68	50000	1.2		1.2,1.2/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.62 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e3	770 MHz	30 s	62	260 °C (500 °F)	14 mm
XC3S50AN-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	144	50000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	176 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No			667 MHz		112		17 mm
XC3S50AN-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	144	50000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	176 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B256		1.55 mm	17 mm	No			770 MHz		112		17 mm
XC4VLX200-11FF1513C	Xilinx	FPGA	Other	Ball	1513	BGA	Square	Plastic/Epoxy	200448	Yes	1.26 V	22272	CMOS	960		1.2			Grid Array	BGA1513,39X39,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		22272 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1513	4	3.25 mm	40 mm	No		e0	1205 MHz	30 s	960	225 °C (437 °F)	40 mm
XC6SLX150-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	338		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	338	250 °C (482 °F)	23 mm
XC6SLX45T-2CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	190		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	667 MHz	30 s	190	260 °C (500 °F)	15 mm
XC6SLX45T-2CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	43661	Yes	1.26 V	3411	CMOS	290		1.2		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.26 ns	3411 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	290	260 °C (500 °F)	19 mm
XC6SLX75T-2FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	320		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e0	667 MHz	30 s	320	225 °C (437 °F)	27 mm
XC6SLX75T-3CSG484C	Xilinx	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	290		1.2		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	5831 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	862 MHz	30 s	290	260 °C (500 °F)	19 mm
XC6SLX75T-3FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	268		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	5831 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	862 MHz	30 s	268	225 °C (437 °F)	23 mm
XC6SLX75T-N3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	268		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	806 MHz	30 s	268	250 °C (482 °F)	23 mm
XC6SLX75T-N3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	74637	Yes	1.26 V	5831	CMOS	348		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	806 MHz	30 s	348	250 °C (482 °F)	27 mm
XC6SLX9-3CPG196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	100		1.2		1.2,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.21 ns	715 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8	862 MHz	30 s	100	260 °C (500 °F)	8 mm
XC6SLX9-3CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	200		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.21 ns	715 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	862 MHz	30 s	200	260 °C (500 °F)	15 mm
XC7A35T-3CSG324E	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.94 ns	2600 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1412 MHz	30 s	250	260 °C (500 °F)	15 mm
XC7K70T-2FBG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS	285		1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	5125 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1286 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7VX690T-1FFG1158C	Xilinx	FPGA	Other	Ball	1158	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	350		1		0.9,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1158	4	3.35 mm	35 mm	No		e1	1818 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7VX690T-1FFG1761C	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	850		1		0.9,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761		3.5 mm	42.5 mm	No		e1	1818 MHz		850		42.5 mm
XCKU040-2SFVA784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	530250	Yes	.979 V	30300		520		0.95		0.95 V	Grid Array, Fine Pitch	BGA784,28X28,32	Field Programmable Gate Arrays	.922 V	.8 mm	100 °C (212 °F)		30300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm	No		e1			520		23 mm
XCKU115-1FLVF1924C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832		.95		0.95 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)		5520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1924	4	4.13 mm	45 mm	No		e1		30 s	832	245 °C (473 °F)	45 mm
XCKU11P-2FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512		0.85			Grid Array	BGA1156,34X34,40		.825 V	1 mm	100 °C (212 °F)		37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm			e1			512		35 mm
XCKU15P-L2FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340		668		0.72			Grid Array	BGA1517,39X39,40		.698 V	1 mm	110 °C (230 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 0.85 V nominal supply	e1		30 s	668	245 °C (473 °F)	40 mm
XCKU3P-L2FFVB676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340		304		0.72			Grid Array	BGA676,26X26,40		.698 V	1 mm	110 °C (230 °F)		20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm		Also Operates at 0.85 V nominal supply	e1		30 s	304	250 °C (482 °F)	27 mm
XCKU5P-1FFVA676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304		0.85			Grid Array	BGA676,26X26,40		.825 V	1 mm	100 °C (212 °F)		27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
XCS20XL-4CS144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS	160	7000	3.3		3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	3 V	.8 mm	85 °C (185 °F)	1.1 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No	Maximum usable gates 20000	e0	217 MHz	30 s	160	240 °C (464 °F)	12 mm
XCVU125-H1FLVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1566600	Yes	.979 V	89520		884		0.95			Grid Array	BGA2104,46X46,40		.922 V	1 mm	100 °C (212 °F)		89520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm		Also Operates at 1 V nominal supply	e1		30 s	884	245 °C (473 °F)	47.5 mm
XCVU9P-1FLGA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780		832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.24 mm	47.5 mm						832		47.5 mm
XCVU9P-1FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780		832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm						832		47.5 mm
XCVU9P-2FSGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780		832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.59 mm	47.5 mm			e1			832		47.5 mm
10M50DCF672C7G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3125 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			500		27 mm
10M50DCF672C8G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3125 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			500		27 mm
5CEBA7U19C8N	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	150000	Yes	1.13 V		CMOS	240		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		1.9 mm	19 mm	No					240		19 mm
5CEBA9F23C8N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	224		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		2 mm	23 mm	No					224		23 mm
5CGXBC9E6F31C7N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	480		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm	No		e1			480		31 mm
5CGXFC9E6F31C7N	Intel	FPGA	Other	Ball	896	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V		CMOS	448		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B896	3	2 mm	31 mm	No		e1		30 s	448	260 °C (500 °F)	31 mm
EP1C3T100C6	Intel	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	2910	Yes	1.575 V	291		65		1.5		1.5,1.5/3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	1.425 V	.5 mm	85 °C (185 °F)		291 CLBS	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No		e0	405 MHz		65		14 mm
EP2AGX65DF29C5N	Intel	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		372		.9		0.9,1.2/3.3,1.5,2.5 V	Grid Array, Heat Sink/Slug	BGA780,28X28,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)		2530 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.7 mm	29 mm	No		e1	500 MHz		372		29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.