1152 Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10AX066H4F34I3SP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	492	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm	No					492		35 mm
5AGXBB7G6F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
5AGXFA5K4F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
5AGXFB5G4F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
5AGXMB5H4F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
10AX066K3F35I2LG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No					396		35 mm
5AGXFB7H4F35C5N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy	503500	Yes		504000	CMOS	544	.85	1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)	504000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No	Can Also Operates at 1.1 V and 1.15 V nominal supply	e1			544		35 mm
5AGXBA7D6F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
5SGXMA7H2F35C3	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	552	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	23472 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
5AGXMA5K6F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	622 MHz				35 mm
5AGXMB1G6F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	622 MHz				35 mm
5AGXBA5D6F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	670 MHz				35 mm
5SGXMA4H2F35I2	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	.93 V	15850	CMOS	552	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	15850 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
EP2AGZ225HF35I3N	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		3.5 mm	35 mm			e1	500 MHz				35 mm
EP2AGX190CF35I3	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612		612	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)	7612 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e0			612		35 mm
10AS066H2F34E2SG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	492	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm	No					492		35 mm
10AX027H3F35I2LG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V		CMOS	384	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No					384		35 mm
5AGXMB3D6F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
EP2AGX95FF35I5N	Altera	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e1	500 MHz				35 mm
EP2AGZ350HF35C3	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	348500	Yes	.93 V	13940		554	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)	13940 CLBs	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e0			554		35 mm
5SGXMA4K1F35I2	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes			CMOS	432		0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Bottom	S-PBGA-B1152				No					432
EP2AGX95HF35C6N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm			e1	500 MHz				35 mm
10AS048K4F35E3SG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	480000	Yes	.93 V		CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No					396		35 mm
5SGXEA7H2F35I3	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	622000	Yes	.88 V	23472	CMOS	552	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)	23472 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
5AGZME5H3F35I4N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	400000	Yes	.88 V	15096		534	0.85		Grid Array	BGA1152,34X34,40		.82 V	1 mm	100 °C (212 °F)	15096 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	4	3.5 mm	35 mm			e1		30 s	534	245 °C (473 °F)	35 mm
5AGXBA7H4F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	500 MHz				35 mm
10AS057H1F34E1SP	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
5AGXBA5G4F35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	500 MHz				35 mm
10AX090H1F34E1LG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm								35 mm
5SGXMA5H3F35C4N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	552	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
5AGXMB5D6F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm				Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	622 MHz				35 mm
5ASXMB5G4F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	500 MHz				35 mm
5ASXFB5E6F35C4	Altera	FPGA	Other	No Lead	1152	BGA	Square	Plastic/Epoxy	462000	Yes	1.13 V	17434	TSMC	385	1.1		Grid Array	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	17434 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						385		35 mm
EP4SE360F35I4	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	141440	CMOS	744	.9	0.9,1.2/3,1.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm		141440 CLBS		Tin Lead	Bottom	S-PBGA-B1152	4	3.6 mm	35 mm	No		e0	717 MHz	20 s	744	220 °C (428 °F)	35 mm
5SGXMA4H1F35C2LN	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	.88 V	15850	CMOS	552	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)	15850 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					552		35 mm
5ASXBB3G6F35C4N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	540	1.1		Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						540		35 mm
5ASXFB3G6F35C4N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	540	1.1		Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)	13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						540		35 mm
5AGXBB7H4F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
10AX066K4F36E3SG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	432	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No					432		35 mm
5SGXMA4K1F35I2N	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	.93 V	15850	CMOS	432	.9	0.9,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	15850 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No					432		35 mm
5AGXMB1K6F35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	500 MHz				35 mm
5ASXMB3G4F35C6N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e1	500 MHz				35 mm
5AGZME1E2F35I3LN	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	220000	Yes	1.18 V	8302	TSMC	414	1.15		Grid Array	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)	8302 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm						414		35 mm
5AGXBA7K6F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm
5AGXBB1G4F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	622 MHz				35 mm
10AS066K2F35I2LG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No					396		35 mm
10AX032H2F35I1SG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm								35 mm
5AGXBA7H6F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm				Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm			e0	670 MHz				35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.