1152 Field Programmable Gate Arrays (FPGA) 2,400+

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

10AX066K2F35E2LP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

660000

Yes

.93 V

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

396

35 mm

5AGXBB1G6F35C5N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

5ASXBB3H4F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

10AX032H1F34E1SP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

5ASXBB3E4F35C6N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

500 MHz

35 mm

EP1AGX90EF1152I6N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.25 V

90220

538

1.2

1.2,2.5/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.15 V

1 mm

100 °C (212 °F)

90220 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

3

3.5 mm

35 mm

No

e1

640 MHz

30 s

538

245 °C (473 °F)

35 mm

EP4SGX70HF35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

72600

Yes

.93 V

29040

CMOS

488

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

29040 CLBS

Tin Lead

Bottom

S-PBGA-B1152

3

3.6 mm

35 mm

No

e0

717 MHz

20 s

488

220 °C (428 °F)

35 mm

EP4SGX230FF35I4N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

228000

Yes

.93 V

9120

CMOS

564

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

9120 CLBS

Tin Silver Copper

Bottom

S-PBGA-B1152

3

3.6 mm

35 mm

No

e1

717 MHz

30 s

564

245 °C (473 °F)

35 mm

10AS048H5F34I3SG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

492

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

No

492

35 mm

10AS057H1F34I1LP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

5ASXFB3D6F35I3

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

350000

Yes

1.18 V

13207

TSMC

385

1.15

Grid Array

BGA1152,34X34,40

1.12 V

1 mm

100 °C (212 °F)

13207 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

5AGTMC7G3F35I3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

EP1AGX60CF1152I6N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.25 V

60100

1.2

Grid Array

1.15 V

1 mm

100 °C (212 °F)

60100 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

2.44 mm

35 mm

No

35 mm

5AGXMA5D6F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

EP2AGX260FF35C6

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

244188

Yes

CMOS

612

0.9,1.2/3.3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B1152

3

No

e0

20 s

612

220 °C (428 °F)

10AX115K3F36I2LP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

1150000

Yes

.93 V

CMOS

432

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

432

35 mm

10AX057K5F36I3SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

CMOS

432

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

432

35 mm

10AX032H1F35E1MP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

10AS057K4F35I3LG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

396

35 mm

5ASXBB5H4F35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

EP2AGX125FF35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

118143

Yes

.93 V

4964

452

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

85 °C (185 °F)

4964 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e0

452

35 mm

5ASXMB5D6F35I3

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

462000

Yes

1.18 V

17434

TSMC

385

1.15

Grid Array

BGA1152,34X34,40

1.12 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

EP4SGX110HF35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

105600

Yes

.93 V

42240

CMOS

488

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

42240 CLBS

Tin Lead

Bottom

S-PBGA-B1152

3

3.6 mm

35 mm

No

e0

717 MHz

20 s

488

220 °C (428 °F)

35 mm

10AS057K5F35I3SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

21708

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

21708 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.35 mm

35 mm

No

396

35 mm

5SGXMA3K2F35I2LN

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

340000

Yes

.88 V

12830

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

12830 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

10AS057H1F34I1SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

EP4SGX360FF35M3N

Altera

FPGA

Military

Ball

1152

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

564

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

125 °C (257 °F)

14144 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1152

3.4 mm

35 mm

564

35 mm

10AX027H1F34I1LG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

10AS032H2F34I1LG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

5AGXMA7H4F35C6N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

500 MHz

35 mm

10AS027H5F35E3SP

Altera

FPGA

Ball

1152

BGA

Square

Plastic

270000

Yes

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

384

10AX048K2F35E2SG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

396

35 mm

EP2AGX260HF35I5

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

244188

Yes

.93 V

10260

612

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

100 °C (212 °F)

10260 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e0

612

35 mm

EP4SGX230FF35C4NES

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

9120

.9

Grid Array

.87 V

1 mm

85 °C (185 °F)

9120 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B

3

3.6 mm

35 mm

No

e1

717 MHz

35 mm

EP4SGX360FF35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

CMOS

564

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

14144 CLBS

Tin Lead

Bottom

S-PBGA-B1152

3

3.4 mm

35 mm

No

e0

717 MHz

20 s

564

220 °C (428 °F)

35 mm

10AS032H4F34E3SP

Altera

FPGA

Ball

1152

BGA

Square

Plastic

320000

Yes

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

384

5AGXBB1D4F35C5N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

300000

Yes

1.13 V

CMOS

544

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

3

2.7 mm

35 mm

No

e1

622 MHz

544

35 mm

5AGTFD3E3F35C6N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

362730

Yes

CMOS

544

1.1,1.2/3.3,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

544

EP2AGX95HF35I3

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

89178

Yes

.93 V

3747

452

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

100 °C (212 °F)

3747 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e0

452

35 mm

10AS066K1F35I1SG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5ASXMB3E6F35C4

Altera

FPGA

Other

No Lead

1152

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

13207 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

5AGXFB1G4F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5ASXMB3E4F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5ASXMB3E4F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5SGXEA7H3F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

622000

Yes

.88 V

23472

CMOS

552

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

23472 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

10AX057K2F35E1SG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

396

35 mm

5AGXMB3G6F35C6

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

500 MHz

35 mm

EP3SL110F1152C3

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

107500

Yes

.94 V

CMOS

744

.9

1.2/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

3

3.9 mm

35 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

717 MHz

20 s

744

220 °C (428 °F)

35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.