1152 Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5AGZME1E3F35I3LN

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

220000

Yes

1.18 V

8302

TSMC

414

1.15

Grid Array

BGA1152,34X34,40

1.12 V

1 mm

100 °C (212 °F)

8302 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

414

35 mm

5ASXFB5G6F35C4N

Altera

FPGA

Other

Ball

1152

HBGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

540

1.1

Grid Array, Heat Sink/Slug

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

2.7 mm

35 mm

540

35 mm

10AS048H2F34I2SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

18359

CMOS

492

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

18359 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.35 mm

35 mm

No

492

35 mm

10AX066K1F36E1LG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5AGXFB7H4F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

503500

Yes

1.13 V

CMOS

544

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

3

2.7 mm

35 mm

No

e1

622 MHz

544

35 mm

5AGXBA7D4F35I3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5SGXMA5H2F35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

490000

Yes

CMOS

552

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

552

5AGXMA5K6F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

EP2AGZ300FF35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

298000

Yes

.93 V

11920

554

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

85 °C (185 °F)

11920 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

3.5 mm

35 mm

e0

500 MHz

554

35 mm

5AGZME1K3F35I3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5SGSMD5H1F35C2

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

457000

Yes

.93 V

17260

CMOS

552

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

17260 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

10AX048H2F34E1SG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

492

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

No

492

35 mm

5SGXEA5H1F35C2

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

490000

Yes

.93 V

18500

CMOS

552

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

18500 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

5AGXFA7G4F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

5ASXBB3E6F35C6

Altera

FPGA

Other

No Lead

1152

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

TSMC

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

13207 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

10AX115H4F34I3LG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

1150000

Yes

.93 V

CMOS

504

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

No

504

35 mm

10AX057K1F36I1SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

EP4SGX360FF35C2X

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

CMOS

564

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

14144 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

3

3.4 mm

35 mm

No

e0

800 MHz

20 s

564

220 °C (428 °F)

35 mm

10AX090K3F36E2LG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

900000

Yes

.93 V

CMOS

432

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

432

35 mm

5AGXFA7H6F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

5AGXBB5G6F35C6N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

500 MHz

35 mm

10AS057H2F34I1SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

10AX027H4F35I3LG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

384

35 mm

5AGTFD3H3F35I3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

362000

Yes

1.18 V

CMOS

544

1.15

1.15,1.2/3.3,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

3

2.7 mm

35 mm

No

e1

670 MHz

544

35 mm

5AGZME7E2F35I3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5SGXMA7K3F35C3

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

622000

Yes

.88 V

23472

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

23472 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

10AX115H4F34I3SGE2

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

42720

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

42720 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.35 mm

35 mm

35 mm

5AGXBB7G6F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5SGXEA7H3F35I3L

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

622000

Yes

.88 V

23472

CMOS

552

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

23472 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

5ASXBB3D6F35C6

Altera

FPGA

Other

Ball

1152

HBGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

385

1.1

Grid Array, Heat Sink/Slug

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

13207 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

2.7 mm

35 mm

385

35 mm

5AGXMA5K6F35I3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5SGXMA4K2F35C2LN

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

420000

Yes

.88 V

15850

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

15850 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

5AGXBA7D6F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

EP4SGX230FF35C3ES

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

9120

.9

Grid Array

.87 V

1 mm

85 °C (185 °F)

9120 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B

3

3.6 mm

35 mm

No

e0

717 MHz

35 mm

10AX032H2F34I2LG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

No

384

35 mm

5AGXFB5D6F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5ASXBB3H6F35I5

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

TSMC

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

100 °C (212 °F)

13207 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

10AS027H2F34I1SG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

5AGXFB3H6F35I5

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5AGXFB3K6F35C5N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

10AX066K2F35I1MP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

EP4SGX360FF35C3N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

353600

Yes

.93 V

14144

CMOS

564

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

14144 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

3

3.4 mm

35 mm

No

e1

717 MHz

30 s

564

245 °C (473 °F)

35 mm

5ASXFB3E4F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5SGXEA4H2F35C2L

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

420000

Yes

.88 V

15850

CMOS

552

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

15850 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

5ASXMB5E6F35I5N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

2.7 mm

35 mm

385

35 mm

10AX115K3F36E2LP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

1150000

Yes

.93 V

CMOS

432

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

432

35 mm

5ASXBB3D6F35I3N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

350000

Yes

1.18 V

13207

TSMC

385

1.15

Grid Array

BGA1152,34X34,40

1.12 V

1 mm

100 °C (212 °F)

13207 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

2.7 mm

35 mm

385

35 mm

EP3SL150F1152C3L

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

142500

Yes

CMOS

744

1.2/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B1152

1

No

e0

100 MHz

744

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.