1152 Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

5AGZME3H3F35I3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5SGXEA5K2F35C3

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

490000

Yes

.88 V

18500

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

18500 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

10AS057K4F35I3LP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

21708

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

21708 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.35 mm

35 mm

No

396

35 mm

EP4SGX230FF35I2XN

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

228000

Yes

.93 V

9120

564

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

100 °C (212 °F)

9120 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.4 mm

35 mm

564

35 mm

5AGXFA5G4F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

10AS048K2F35E2LG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

396

35 mm

10AX032H1F34E1LP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

5SGXMA4H2F35I3N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

420000

Yes

.88 V

15850

CMOS

552

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

15850 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

5ASXMB5D4F35I3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5AGXBB7D4F35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

EP4SE530H35C2N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

531200

Yes

212480

CMOS

744

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

85 °C (185 °F)

212480 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

4

3.7 mm

42.5 mm

No

e1

30 s

744

245 °C (473 °F)

42.5 mm

5SGXEA3H3F35I3

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

340000

Yes

.88 V

12830

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

12830 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

EP1AGX60EF1152I6N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.25 V

60100

514

1.2

1.2,2.5/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.15 V

1 mm

100 °C (212 °F)

60100 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

3

3.5 mm

35 mm

No

e1

640 MHz

30 s

514

245 °C (473 °F)

35 mm

5SGXMA3K1F35C1N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

340000

Yes

.93 V

12830

CMOS

432

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

12830 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

EP4SGX70HF35I4N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

72600

Yes

.93 V

29040

CMOS

488

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

29040 CLBS

Tin Silver Copper

Bottom

S-PBGA-B1152

3

3.6 mm

35 mm

No

e1

717 MHz

30 s

488

245 °C (473 °F)

35 mm

10AS066K2F35I2LP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

660000

Yes

.93 V

25168

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

25168 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.35 mm

35 mm

No

396

35 mm

5AGXBB1D6F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

5AGXBB7G4F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5AGXMB5G4F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

420000

Yes

1.13 V

CMOS

544

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

3

2.7 mm

35 mm

No

e1

622 MHz

544

35 mm

5AGXBA5G6F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

10AS066H2F34E2LG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

660000

Yes

.93 V

CMOS

492

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

No

492

35 mm

EP4SGX230HF35I4N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

228000

Yes

.93 V

91200

CMOS

564

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

91200 CLBS

Tin Silver Copper

Bottom

S-PBGA-B1152

4

3.6 mm

35 mm

No

e1

717 MHz

30 s

564

245 °C (473 °F)

35 mm

10AX115H1F34E1LP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

5SGXMA3K3F35

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

Grid Array

1 mm

Bottom

S-PBGA-B1152

3.6 mm

35 mm

12.5 MHz

35 mm

5ASXMB3H4F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5SGXEA7K2F35I3L

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

622000

Yes

.88 V

23472

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

23472 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

10AX057H2F34E2LG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

CMOS

492

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

No

492

35 mm

5AGXFA5D4F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

EP4SGX180FF35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

175750

Yes

.93 V

7030

CMOS

564

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

7030 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

3

3.4 mm

35 mm

No

e1

717 MHz

30 s

564

245 °C (473 °F)

35 mm

5AGXMB7K6F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

5SGXMA7K2F35I2LN

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

622000

Yes

.88 V

23472

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

23472 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

5SGXEA4H2F35I3LN

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

420000

Yes

.88 V

15850

CMOS

552

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

15850 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

10AS057K3F35E2SP

Altera

FPGA

Ball

1152

BGA

Square

Plastic

570000

Yes

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

396

10AS066H1F34I1SG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

5AGXFA5D4F35C6

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

500 MHz

35 mm

10AX032H2F34I1LG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

EP3SE260F1152C2LN

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

255000

Yes

CMOS

744

1.2/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

No

e1

100 MHz

744

10AX027H1F34I1LP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

5ASXBB3H6F35C5N

Altera

FPGA

Commercial Extended

Ball

1152

BGA

Square

Plastic/Epoxy

350000

Yes

1.13 V

13207

TSMC

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

13207 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

2.7 mm

35 mm

385

35 mm

5AGXMB1K6F35I5

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

10AS027H3F34I2SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

270000

Yes

.93 V

10162

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

10162 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.35 mm

35 mm

No

384

35 mm

5ASXFB5H6F35C4

Altera

FPGA

Other

No Lead

1152

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

EP4SGX530HH35C2ES

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

21248

.9

Grid Array

.87 V

1 mm

85 °C (185 °F)

21248 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B

3.8 mm

42.5 mm

No

e0

800 MHz

42.5 mm

10AS048H2F34I1SG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

35 mm

10AX027H2F35I1MG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5SGXMA3H3F35C2LN

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

340000

Yes

.88 V

12830

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

12830 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

5ASXBB5E6F35C5

Altera

FPGA

Other

No Lead

1152

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

5SGXEA7H1F35C2L

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

622000

Yes

.88 V

23472

CMOS

552

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

23472 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.