1152 Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

10AX090K1F36I1SG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5SGXMA5K1F35

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

Grid Array

1 mm

Bottom

S-PBGA-B1152

3.6 mm

35 mm

12.5 MHz

35 mm

10AX048K5F35E3SP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

480000

Yes

.93 V

CMOS

396

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

396

35 mm

EP4SGX230HF35I2

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

91200

Grid Array

1 mm

91200 CLBS

Bottom

S-PBGA-B1152

3.6 mm

35 mm

35 mm

5AGXBB1K4F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5AGXBB3G6F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5AGXFB3K4F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5AGXFA5K4F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

10AX090H5F34E3SG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

900000

Yes

.93 V

CMOS

504

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

No

504

35 mm

10AS032H1F35I1LP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5AGXMB7K4F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5AGXFB5D4F35I5

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

10AX057K4F36I3LP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

570000

Yes

.93 V

21708

CMOS

432

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

21708 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

No

432

5AGXMB7G6F35C6

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

500 MHz

35 mm

5AGXBB7H4F35C6

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

500 MHz

35 mm

5SGXEA4K1F35I2N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

420000

Yes

.93 V

15850

CMOS

432

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

15850 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

EP3SE110F1152C2N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

107500

Yes

.94 V

CMOS

744

.9

1.2/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

3

3.9 mm

35 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

800 MHz

30 s

744

245 °C (473 °F)

35 mm

10AX066K4F36I3LG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

660000

Yes

.93 V

25168

CMOS

432

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

25168 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

No

432

5SGXEA7H3F35C2N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

622000

Yes

.93 V

23472

CMOS

552

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

23472 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

5SGXMA4H1F35C2N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

420000

Yes

.93 V

15850

CMOS

552

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

15850 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

5AGXFA5D4F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5AGXFA7H4F35C6N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

242950

Yes

1.13 V

CMOS

544

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

No

e1

500 MHz

544

35 mm

5AGXBB1H6F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5SGSMD4H3F35C2N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

360000

Yes

.93 V

13584

CMOS

432

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

13584 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

4

3.6 mm

35 mm

No

e1

432

35 mm

EP3SL110F1152C4LN

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

107500

Yes

.94 V

CMOS

744

.9

1.2/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

3

3.9 mm

35 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

717 MHz

30 s

744

245 °C (473 °F)

35 mm

5AGXMB7D4F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

10AS032H5F35I3SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

11990

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

11990 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.35 mm

35 mm

No

384

35 mm

EP3SL340H1152I3LN

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

337500

Yes

CMOS

744

1.2/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

No

e1

100 MHz

744

EP3SE110F1152I4N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

107500

Yes

.94 V

CMOS

744

.9

1.2/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.86 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

3

3.9 mm

35 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

717 MHz

30 s

744

245 °C (473 °F)

35 mm

5ASXMB5H6F35C6N

Altera

FPGA

Commercial Extended

Ball

1152

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

TSMC

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

2.7 mm

35 mm

385

35 mm

5SGXEA3K1F35I2N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

340000

Yes

.93 V

12830

CMOS

432

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

12830 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

EP2SGX90EF1152C5N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

90960

Yes

1.25 V

90960

CMOS

558

1.2

1.2,1.2/3.3,3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.15 V

1 mm

85 °C (185 °F)

5.962 ns

90960 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

3

3.5 mm

35 mm

No

e1

640 MHz

558

35 mm

5AGXBA5H6F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

5AGXFA5G4F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5SGXMA4H2F35

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

Grid Array

1 mm

Bottom

S-PBGA-B1152

3.6 mm

35 mm

12.5 MHz

35 mm

10AS057H3F34E2LP

Altera

FPGA

Ball

1152

BGA

Square

Plastic

570000

Yes

CMOS

492

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

492

5AGXFB1H4F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

300000

Yes

1.13 V

CMOS

544

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

No

e0

622 MHz

544

35 mm

10AS032H2F34E2LP

Altera

FPGA

Ball

1152

BGA

Square

Plastic

320000

Yes

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

384

5AGTFD7E3F35C4

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

504140

Yes

CMOS

544

1.1,1.2/3.3,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

544

5ASXBB5D4F35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5AGXFB3H4F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

362730

Yes

1.13 V

CMOS

544

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

3

2.7 mm

35 mm

No

e1

670 MHz

544

35 mm

10AX090K2F36I1MP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5SGXMA4K2F35I2N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

420000

Yes

.93 V

15850

CMOS

432

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

15850 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

5AGZME7E3F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5AGXFB1D4F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5AGTMD3D3F35I5

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5AGXMB7D6F35I3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5SGXEA7H2F35I3N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

622000

Yes

.88 V

23472

CMOS

552

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

23472 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.