1152 Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
5ASXBB5G4F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz		35 mm
10AX057K2F36I1LG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm					35 mm
10AX090H2F34I2LP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V		CMOS	504	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm	No			504	35 mm
EP2AGX260EF35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	244188	Yes	.93 V	10260		612	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)		10260 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.6 mm	35 mm		e0		612	35 mm
5AGTFD3H3F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz		35 mm
5AGXMB3H4F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	622 MHz		35 mm
10AS048K2F35I1MP	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm					35 mm
5AGXBB1D6F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz		35 mm
5AGXBB3H6F35C5N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	622 MHz		35 mm
5ASXMB3H6F35I3N	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	350000	Yes	1.18 V	13207	TSMC	385	1.15		Grid Array	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)		13207 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm				385	35 mm
EP3SL340F1152C2N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	337500	Yes			CMOS	744		1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B1152				No	e1	100 MHz	736
5SGXEA3K3F35C3N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	340000	Yes	.88 V	12830	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		12830 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No			432	35 mm
5AGXBB5D6F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	622 MHz		35 mm
5ASXFB3E4F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz		35 mm
5ASXMB3G6F35I3N	Altera	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	350000	Yes	1.18 V	13207	TSMC	540	1.15		Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)		13207 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm				540	35 mm
5SGXEA5K2F35I3LN	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	100 °C (212 °F)		18500 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No			432	35 mm
5ASXBB3G4F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz		35 mm
10AX057K3F35E2LP	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V		CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No			396	35 mm
5AGXMA5D4F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	670 MHz		35 mm
EP3SE260F1152I2LN	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	255000	Yes			CMOS	744		1.2/3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152				No	e1	100 MHz	744
5AGXBA7K6F35C6	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	500 MHz		35 mm
EP4SGX180HF35I2N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes		70300					Grid Array				1 mm			70300 CLBS			Bottom	S-PBGA-B1152		3.6 mm	35 mm					35 mm
EP2SGX90EF1152I4	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	90960	Yes	1.25 V	90960	CMOS	558	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.117 ns	90960 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No	e0	717 MHz	558	35 mm
EP2AGX190DF35C5N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array, Heat Sink/Slug			.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.6 mm	35 mm		e1	500 MHz		35 mm
5SGXEA5H3F35C4N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	552	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No			552	35 mm
5AGXBB7D6F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	670 MHz		35 mm
5SGXMA5K3F35C2LN	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	490000	Yes	.88 V	18500	CMOS	432	.85	0.85,1.5,2.5,2.5/3,1.2/3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.82 V	1 mm	85 °C (185 °F)		18500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.6 mm	35 mm	No			432	35 mm
5AGTMC7H3F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	622 MHz		35 mm
EP2AGZ225HF35I4	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	224000	Yes	.93 V	8960		554	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	100 °C (212 °F)		8960 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1152		3.4 mm	35 mm		e0		554	35 mm
EP4SGX290FF35M3	Altera	FPGA	Military	Ball	1152	BGA	Square	Plastic/Epoxy	291200	Yes	.93 V	11648		564	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	125 °C (257 °F)		11648 CLBS	-55 °C (-67 °F)		Bottom	S-PBGA-B1152		3.4 mm	35 mm				564	35 mm
EP2SGX60EF1152C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	60440	Yes	1.25 V	60440	CMOS	534	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)	5.962 ns	60440 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152	3	3.5 mm	35 mm	No	e0	640 MHz	534	35 mm
10AS066K3F35I2LG	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V		CMOS	396	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No			396	35 mm
5AGXFB5K4F35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz		35 mm
5AGXFA5K4F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz		35 mm
5AGZME5E3F35I3N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	670 MHz		35 mm
5AGZME7E2F35I3LN	Altera	FPGA	Industrial	No Lead	1152	BGA	Square	Plastic/Epoxy	450000	Yes	1.18 V	16980	TSMC	534	1.15		Grid Array	BGA1152,34X34,40		1.12 V	1 mm	100 °C (212 °F)		16980 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm				534	35 mm
5AGXFB5H4F35C5N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	420000	Yes	1.13 V		CMOS	544	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No	e1	622 MHz	544	35 mm
10AX115H1F34I1SGES	Altera	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.65 mm	35 mm					35 mm
5AGXFB5D6F35I3	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.18 V				1.15		Grid Array			1.12 V	1 mm					Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	670 MHz		35 mm
10AX027H3F35E2LG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V		CMOS	384	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No			384	35 mm
5AGXFB1H6F35C4N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	670 MHz		35 mm
5AGXBA7G4F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	622 MHz		35 mm
EP2AGZ300HF35C4	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	298000	Yes	.93 V	11920		554	0.9		Grid Array	BGA1152,34X34,40		.87 V	1 mm	85 °C (185 °F)		11920 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.6 mm	35 mm		e0		554	35 mm
5AGXMB1D4F35I5N	Altera	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm					Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	622 MHz		35 mm
5AGXFB7D6F35C5	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e0	622 MHz		35 mm
5AGXBA5K6F35C4N	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	1.13 V				1.1		Grid Array			1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152		2.7 mm	35 mm		e1	670 MHz		35 mm
5ASXBB3G6F35C6N	Altera	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy	350000	Yes	1.13 V	13207	TSMC	540	1.1		Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.07 V	1 mm	85 °C (185 °F)		13207 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm				540	35 mm
10AX090K2F36E2LG	Altera	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V		CMOS	432	.9	0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.5 mm	35 mm	No			432	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.