1152 Field Programmable Gate Arrays (FPGA) 2,400+

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

10AX032H3F35E2SG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

384

35 mm

10AX027H1F35I1SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5SGXEA3K2F35C1

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

340000

Yes

.93 V

12830

CMOS

432

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

12830 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

5SGSMD4H2F35C1

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

360000

Yes

.93 V

13584

CMOS

432

.9

0.9,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

13584 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

EP3SE260F1152C3

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

255000

Yes

.94 V

CMOS

744

.9

1.2/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

4

3.9 mm

35 mm

No

It can also operate from 1.05 to 1.15 V supply

e0

717 MHz

20 s

744

220 °C (428 °F)

35 mm

5AGXMB1K4F35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5AGXFB1D6F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

10AX032H2F35I1MP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5AGXMB7H4F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

EP2AGZ300CF35C3

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

298000

Yes

.93 V

11920

554

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

85 °C (185 °F)

11920 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e0

554

35 mm

5AGXFA5G4F35I5N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

622 MHz

35 mm

5AGTMD3G3F35I3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5AGXMB5D4F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

10AX090H5F34I3SP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

900000

Yes

.93 V

CMOS

504

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.65 mm

35 mm

No

504

35 mm

10AS032H2F35E1SP

Altera

FPGA

Ball

1152

BGA

Square

Plastic

320000

Yes

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1 mm

Bottom

S-PBGA-B1152

No

384

EP2AGX260HF35C6

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

244188

Yes

.93 V

10260

612

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

85 °C (185 °F)

10260 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e0

612

35 mm

5SGXEA4H1F35C2N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

420000

Yes

.93 V

15850

CMOS

552

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

15850 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

5SGXEA5K3F35C2

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

490000

Yes

.93 V

18500

CMOS

432

.9

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

18500 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

5SGXEA7H2F35I2LN

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

622000

Yes

.88 V

23472

CMOS

552

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

23472 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

EP2AGZ300EF35I4

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

298000

Yes

.93 V

11920

554

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

100 °C (212 °F)

11920 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e0

554

35 mm

EP4SGX110HF35C2N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

105600

Yes

.93 V

42240

CMOS

488

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

42240 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

3

3.6 mm

35 mm

No

e1

800 MHz

30 s

488

245 °C (473 °F)

35 mm

10AS048K1F35I1LP

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5AGTFC7H3F35I3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

242000

Yes

1.18 V

CMOS

544

1.15

1.15,1.2/3.3,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

3

2.7 mm

35 mm

No

e1

670 MHz

544

35 mm

EP2AGZ300CF35C4

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

298000

Yes

.93 V

11920

554

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

85 °C (185 °F)

11920 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e0

554

35 mm

5SGXMA7H3F35I4N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

622000

Yes

.88 V

23472

CMOS

552

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

23472 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

10AX066K1F36I1LG

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

10AX066K3F35I2SGES

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5AGXFA7K6F35C6

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

500 MHz

35 mm

5AGXFB3K4F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

5SGSMD5H2F35I3

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

457000

Yes

.88 V

17260

CMOS

552

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

17260 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

552

35 mm

5AGXFB3K6F35C4N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

EP2AGX95FF35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

89178

Yes

.93 V

3747

452

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

85 °C (185 °F)

3747 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.6 mm

35 mm

e0

452

35 mm

5ASXBB5H4F35C6

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

500 MHz

35 mm

10AS032H2F35E1SG

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

320000

Yes

.93 V

CMOS

384

.9

0.9 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

No

384

35 mm

5ASXFB3D4F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

5SGSMD4H3F35I3N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

360000

Yes

.88 V

13584

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

13584 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

5AGXMA5G4F35C5N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

190000

Yes

1.13 V

CMOS

544

1.1

1.1,1.2/3.3,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

3

2.7 mm

35 mm

No

e1

622 MHz

544

35 mm

10AS057K1F35E1LP

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

.93 V

.9

Grid Array

.87 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

35 mm

5SGSMD3H3F35C3N

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

236000

Yes

.88 V

8900

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

85 °C (185 °F)

8900 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

EP3SE260F1152C4LN

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

255000

Yes

.94 V

CMOS

744

.9

1.2/3.3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.86 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1152

4

3.9 mm

35 mm

No

It can also operate from 1.05 to 1.15 V supply

e1

717 MHz

30 s

744

245 °C (473 °F)

35 mm

5ASXBB5D6F35I5

Altera

FPGA

Industrial

No Lead

1152

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

100 °C (212 °F)

17434 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

5AGXBB7K4F35I3N

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e1

670 MHz

35 mm

EP4SGX110FF35M3N

Altera

FPGA

Military

Ball

1152

BGA

Square

Plastic/Epoxy

105600

Yes

.93 V

4224

488

0.9

Grid Array

BGA1152,34X34,40

.87 V

1 mm

125 °C (257 °F)

4224 CLBS

-55 °C (-67 °F)

Bottom

S-PBGA-B1152

3.4 mm

35 mm

488

35 mm

5AGXFA7K4F35C5

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.13 V

1.1

Grid Array

1.07 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

622 MHz

35 mm

EP4SE820H35C3

Altera

FPGA

Other

Ball

1152

BGA

Square

Plastic/Epoxy

813050

Yes

.93 V

325220

CMOS

744

.9

0.9,1.2/3,1.5,2.5 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

325220 CLBS

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1152

4

3.7 mm

42.5 mm

No

e0

717 MHz

20 s

744

220 °C (428 °F)

42.5 mm

5SGXEA3H3F35I4N

Altera

FPGA

Industrial

Ball

1152

BGA

Square

Plastic/Epoxy

340000

Yes

.88 V

12830

CMOS

432

.85

0.85,1.5,2.5,2.5/3,1.2/3 V

Grid Array

BGA1152,34X34,40

Field Programmable Gate Arrays

.82 V

1 mm

100 °C (212 °F)

12830 CLBS

-40 °C (-40 °F)

Bottom

S-PBGA-B1152

3.6 mm

35 mm

No

432

35 mm

5AGXBB7H6F35I3

Altera

FPGA

Ball

1152

BGA

Square

Plastic/Epoxy

Yes

1.18 V

1.15

Grid Array

1.12 V

1 mm

Tin Lead

Bottom

S-PBGA-B1152

2.7 mm

35 mm

e0

670 MHz

35 mm

5ASXBB5D6F35C4

Altera

FPGA

Other

No Lead

1152

BGA

Square

Plastic/Epoxy

462000

Yes

1.13 V

17434

385

1.1

Grid Array

BGA1152,34X34,40

1.07 V

1 mm

85 °C (185 °F)

17434 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1152

3.5 mm

35 mm

385

35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.