1156 Field Programmable Gate Arrays (FPGA) 788

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VHX380T-2FF1154E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS		320		1		1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm					Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No	e0	1286 MHz		320		35 mm
XQ6VSX475T-2FFG1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	37200	CMOS				1			Grid Array			.95 V	1 mm		0.67 ns	37200 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XQKU095-2RFA1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes		67200					.95			Grid Array				1 mm			67200 CLBS		Tin Lead	Bottom	S-PBGA-B1156		3.72 mm	35 mm		e0					35 mm
XC7VX415T-1FF1157C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	412160	Yes			CMOS		600				0.9,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156	4			No	e0	1818 MHz		600
XCV2000E-7FGG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS		804	518400	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	9600 CLBS, 518400 Gates		Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e1	400 MHz		804		35 mm
XC6VHX255T-1FF1155I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	253440	Yes	1.05 V		CMOS		440		1		1,1.2/2.5 V	Grid Array	BGA1155,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No	e0	1098 MHz		440		35 mm
XC7K420T-2FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	CMOS		350		1		1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	32575 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm	No	e1	1286 MHz	30 s	350	245 °C (473 °F)	35 mm
XC7A200T-1FFV1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	16825					1			Grid Array			.95 V	1 mm	85 °C (185 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156		3.1 mm	35 mm		e1					35 mm
XC6VLX195T-2FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS		600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XQKU15P-2FFRA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		MIL-PRF-38535	564		0.85			Grid Array	BGA1156,34X34,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.71 mm	35 mm		e0		20 s	564	225 °C (437 °F)	35 mm
XC7A15T-L1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	16640	Yes	.98 V	1300			250		0.95			Grid Array	BGA1156,34X34,40		.92 V	1 mm	85 °C (185 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XCV1000E-7FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS		660	331776	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e1	400 MHz		660		35 mm
XCKU025-1LFFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	1152	CMOS		312		0.95	Tray		Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		1152 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm		e1			312		35 mm
XQ6VSX475T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	37200	CMOS				1			Grid Array			.95 V	1 mm	85 °C (185 °F)	0.67 ns	37200 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XQ6VSX315T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	24600	CMOS				1			Grid Array			.95 V	1 mm	85 °C (185 °F)	0.79 ns	24600 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XCV3200E-7FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	73008	Yes	1.89 V	16224	CMOS		804	876096	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	16224 CLBS, 876096 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156	1	2.6 mm	35 mm	No		400 MHz		804		35 mm
XC7VX485T-2FF1158I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS		350		1		1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1818 MHz		350
XQV2000E-6FG1156N	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	38535Q/M;38534H;883B	804	2541952	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	125 °C (257 °F)		9600 CLBS, 2541952 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e0	357.2 MHz	30 s	804	225 °C (437 °F)	35 mm
XC7VX550T-1FF1158I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	554240	Yes			CMOS		350				1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1818 MHz		350
XC3S200-4FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156		2.6 mm	35 mm	No						35 mm
XC5VTX150T-1FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	148480	Yes	1.05 V	11600	CMOS		360		1		1,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	11600 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0		30 s	360	225 °C (437 °F)	35 mm
XCE7K480T-1FFV1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	HKMG		400		1			Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	37325 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s	400	245 °C (473 °F)	35 mm
XQV2000E-6FGG1156N	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.89 V	9600	CMOS			2541952	1.8			Grid Array			1.71 V	1 mm	125 °C (257 °F)		9600 CLBS, 2541952 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e1	357.2 MHz				35 mm
XC7K480T-3FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.03 V						1			Grid Array	BGA1156,34X34,40		.97 V	1 mm	85 °C (185 °F)	0.58 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm	No	e1		30 s		250 °C (482 °F)	35 mm
XQ6VLX130T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	10000	CMOS				1			Grid Array			.95 V	1 mm	85 °C (185 °F)	0.79 ns	10000 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XC6VHX380T-2FF1154I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS		320		1		1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No	e0	1286 MHz		320		35 mm
XCV2000E-8FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS		804	518400	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e1	416 MHz		804		35 mm
XC3S1500-5FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156		2.6 mm	35 mm	No						35 mm
XCV2600E-7FG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	57132	Yes	1.89 V	12696	CMOS		804	685584	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	12696 CLBS, 685584 Gates			Bottom	S-PBGA-B1156	1	2.6 mm	35 mm	No		400 MHz		804		35 mm
XCV2600E-7FGG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	57132	Yes	1.89 V	14283	CMOS		804		1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1156			35 mm	No				804		35 mm
XC7A25T-3FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	0.94 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1412 MHz	30 s	150	245 °C (473 °F)	35 mm
XC7VX415T-2FF1158I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	412160	Yes			CMOS		350				1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1818 MHz		350
XC7A75T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	300	245 °C (473 °F)	35 mm
XQ6VLX130T-L1RF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	128000	Yes			CMOS		600		.9		0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1098 MHz		600
XC3S2000-4FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156		2.6 mm	35 mm	No						35 mm
XCV2000E-6FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS		804	518400	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e1	357 MHz		804		35 mm
XQKU095-1RFA1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy		Yes		67200					.95			Grid Array				1 mm	125 °C (257 °F)		67200 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.72 mm	35 mm		e0					35 mm
XC7VX690T-3FF1157E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS		600				1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156	4			No	e0	1818 MHz		600
XC6VHX250T-2FF1154C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	251904	Yes	1.05 V		CMOS		320		1		1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No	e0	1286 MHz		320		35 mm
XC3S200-4FGG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2			Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates			Bottom	S-PBGA-B1156		2.6 mm	35 mm	No						35 mm
XC7V585T-3FF1157E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	582720	Yes			CMOS		600				1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156	4			No	e0	1818 MHz		600
XC7A35T-L1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600			250		0.95			Grid Array	BGA1156,34X34,40		.92 V	1 mm	85 °C (185 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XQ6VSX315T-1LFFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes		24600	CMOS		600					Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	24600 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm		e1		30 s	600	245 °C (473 °F)	35 mm
XC7A25T-3FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1412 MHz	30 s	150	245 °C (473 °F)	35 mm
XC7VX415T-2FF1157C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	412160	Yes			CMOS		600				1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156	4			No	e0	1818 MHz		600
XC7V585T-L2FF1157E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	582720	Yes			CMOS		600				1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156	4			No	e0	1818 MHz		600
XQ6VSX475T-L1FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	476000	Yes			CMOS		600		.9		0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4			No	e1	1098 MHz	30 s	600	245 °C (473 °F)
XC6VSX315T-3FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS		600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1412 MHz	30 s	600	225 °C (437 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.