1156 Field Programmable Gate Arrays (FPGA) 788

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VLX130T-1LFFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	.97 V	10000	CMOS	600					Grid Array	BGA1156,34X34,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	10000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm		e1		30 s	600	245 °C (473 °F)	35 mm
XCE7K480T-L2FFG1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes	.93 V	37325	HKMG	400		.9			Grid Array			.87 V	1 mm	100 °C (212 °F)	0.91 ns	37325 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s	400	245 °C (473 °F)	35 mm
XC7A15T-L1FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	16640	Yes	.98 V	1300		250		0.95			Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC7K420T-2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.03 V					1			Grid Array	BGA1156,34X34,40		.97 V	1 mm	100 °C (212 °F)	0.61 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm	No	e1		30 s		250 °C (482 °F)	35 mm
XQ6VSX315T-1LFFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	.93 V	24600	CMOS	600		0.9			Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	0.85 ns	24600 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm		e1		30 s	600	245 °C (473 °F)	35 mm
XC6VLX240T-2FF1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm					Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VSX475T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XCV1600E-7FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	724	419904	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No	e0	400 MHz		724		35 mm
XCKU035-1LFFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700	CMOS	520		0.95	Tray		Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		1700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm		e1			520		35 mm
XC7K420T-1FFV1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.03 V	32575				1			Grid Array			.97 V	1 mm		0.74 ns	32575 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1156		3.35 mm	35 mm		e1					35 mm
XCE7K480T-3FFG1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	HKMG	400		1			Grid Array			.97 V	1 mm	100 °C (212 °F)	0.58 ns	37325 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s	400	245 °C (473 °F)	35 mm
XC7K420T-3FF1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes			CMOS	400				1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1818 MHz		400
XC7K420T-1LFFG1156I	Xilinx	FPGA		Ball	1156			Plastic/Epoxy		Yes									Grid Array									Tin Silver Copper	Bottom		4			No	e1		30 s		250 °C (482 °F)
XC6VSX475T-L1FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	.93 V		CMOS	600		.9		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XCV1000E-6FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e1	357 MHz		660		35 mm
XC6VSX475T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	.93 V		CMOS	600		.9		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC3S1500-4FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156		2.6 mm	35 mm	No						35 mm
XC7A35T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XQ6VSX315T-1LRFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	.93 V	24600	CMOS	600		0.9			Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	0.85 ns	24600 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm		e0			600		35 mm
XC7A50T-1FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC3S2000-4FGG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2			Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates			Bottom	S-PBGA-B1156		2.6 mm	35 mm	No						35 mm
XC6VHX380T-2FF1155I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	440		1		1,1.2/2.5 V	Grid Array	BGA1155,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No	e0	1286 MHz		440		35 mm
XQ6VSX475T-1RFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V	37200	CMOS	600		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.79 ns	37200 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm		e0			600		35 mm
XCZU27DR-2FSVE1156I5070	Xilinx	FPGA SOC	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	930300	Yes	.876 V	53160		394		0.85			Grid Array	BGA1156,34X34,40		.825 V	1 mm	100 °C (212 °F)		53160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.86 mm	35 mm		e1		30 s	366	240 °C (464 °F)	35 mm
XC7A25T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG	150		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1286 MHz	30 s	150	245 °C (473 °F)	35 mm
XC6VSX315T-3FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes			CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B	4	3.5 mm	35 mm	No	e1	1412 MHz	30 s	600	245 °C (473 °F)	35 mm
XCV1600E-6FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	724	419904	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e1	357 MHz		724		35 mm
XCZU9EG-1LFFVB1156I	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes		34260				0.85			Grid Array				1 mm	100 °C (212 °F)		34260 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm		e1		30 s		245 °C (473 °F)	3.42 mm
XCKU075-L1FFVA1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	756000	Yes	.927 V	2592		520		.9			Grid Array			.873 V	1 mm	100 °C (212 °F)		2592 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm		e1		30 s	520	245 °C (473 °F)	35 mm
XC7A15T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1286 MHz	30 s	250	245 °C (473 °F)	35 mm
XCE7K420T-1FFV1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG	400		1			Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	32575 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s	400	245 °C (473 °F)	35 mm
XC7K420T-1FF1156C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes			CMOS	400				1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1818 MHz		400
XC3S50-4FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156		2.6 mm	35 mm	No						35 mm
XC7K480T-L2FFV1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	.97 V	37325				.95			Grid Array			.93 V	1 mm		0.61 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1156		3.35 mm	35 mm		e1					35 mm
XC7VX690T-1FF1157I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	600				1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156	4			No	e0	1818 MHz		600
XC7A12T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000	HKMG	150		0.95			Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	150	245 °C (473 °F)	35 mm
XQZU9EG-1FFRB1156I	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260				0.85			Grid Array			.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1157	4	3.62 mm	35 mm		e0		40 s		245 °C (473 °F)	35 mm
XCV2600E-6FG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	57132	Yes	1.89 V	12696	CMOS	804	685584	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	12696 CLBS, 685584 Gates			Bottom	S-PBGA-B1156	1	2.6 mm	35 mm	No		357 MHz		804		35 mm
XC7A350T-2FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	348480	Yes	1.05 V		CMOS	600		1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4		35 mm	No	e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7A200T-3FFV1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		500		1			Grid Array			.95 V	1 mm	100 °C (212 °F)	0.94 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1		30 s	500	245 °C (473 °F)	35 mm
XC6VSX475T-2FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XCV2600E-7FGG1156C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	57132	Yes	1.89 V	14283	CMOS	804		1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1156			35 mm	No				804		35 mm
XC7K480T-3FF1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes			CMOS	400				1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1818 MHz		400
XC7VX415T-1FF1158I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	412160	Yes			CMOS	350				1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1818 MHz		350
XCKU095-3FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200		702		1			Grid Array	BGA1156,34X34,40		.97 V	1 mm	100 °C (212 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm		e1			702		35 mm
XCV2000E-6FGG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	804	518400	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	9600 CLBS, 518400 Gates		Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e1	357 MHz		804		35 mm
XCKU025-2FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95			Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm		e1			312		35 mm
XCV2600E-6FGG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	57132	Yes	1.89 V	14283	CMOS	804		1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1156			35 mm	No				804		35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.