1156 Field Programmable Gate Arrays (FPGA) 788

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC6VSX315T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7A350T-1FFG1156C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	348480	Yes	1.05 V		CMOS	600		1	1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.27 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4		35 mm	No	e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC3S5000-4FG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS	784	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	8320 CLBS, 5000000 Gates		Tin Lead	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e0	630 MHz		784	225 °C (437 °F)	35 mm
XCE7K420T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG	400		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	32575 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s	400	245 °C (473 °F)	35 mm
XC7VX690T-2FF1157I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	600			1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1156	4			No	e0	1818 MHz		600
XQ6VSX475T-2RFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V	37200	CMOS	600		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.67 ns	37200 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm		e0			600		35 mm
XQ6VSX315T-2FFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V	24600	CMOS	600		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	125 °C (257 °F)	0.67 ns	24600 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm		e1		30 s	600	245 °C (473 °F)	35 mm
XC6VLX365T-L1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	.93 V		CMOS	600		.9	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XCE7K480T-2FFV1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	HKMG	400		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	37325 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s	400	245 °C (473 °F)	35 mm
XCKU075-3FFVA1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	756000	Yes	1.03 V	2592		520		1		Grid Array			.97 V	1 mm	100 °C (212 °F)		2592 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm		e1		30 s	520	245 °C (473 °F)	35 mm
XC3S50-5FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156		2.6 mm	35 mm	No						35 mm
XC7VX415T-3FF1158E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	412160	Yes			CMOS	350			1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1818 MHz		350
XC3S5000-5FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS	784	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	8320 CLBS, 5000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e0	725 MHz		784	225 °C (437 °F)	35 mm
XC3S5000-4FGG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	74880	Yes	1.26 V	8320	CMOS	784	5000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	8320 CLBS, 5000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e1	630 MHz	30 s	784	245 °C (473 °F)	35 mm
XQ6VLX130T-1LRFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V	10000	CMOS	600		0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	0.85 ns	10000 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm		e0			600		35 mm
XC7VX330T-2FF1157C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	326400	Yes			CMOS	600			1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156	4			No	e0	1818 MHz		600
XCE7K480T-1FFV1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	HKMG	400		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	37325 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s	400	245 °C (473 °F)	35 mm
XCV3200E-8FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	73008	Yes	1.89 V	16224	CMOS	804	876096	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	16224 CLBS, 876096 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156	1	2.6 mm	35 mm	No		416 MHz		804		35 mm
XQ6VLX240T-L1FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	241000	Yes			CMOS	600		.9	0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4			No	e1	1098 MHz	30 s	600	245 °C (473 °F)
XC7A100T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1286 MHz	30 s	300	245 °C (473 °F)	35 mm
XC3S50-5FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156		2.6 mm	35 mm	No						35 mm
XC7A12T-2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1286 MHz	30 s	150	245 °C (473 °F)	35 mm
XC6VLX195T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XQ6VSX475T-1LFFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes		37200	CMOS	600				Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	37200 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm		e1		30 s	600	245 °C (473 °F)	35 mm
XC7VX690T-L2FF1158E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	350			1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1818 MHz		350
XQ6VSX475T-1FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	476000	Yes	1.05 V	37200	CMOS	600		1	1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm		0.79 ns	37200 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm	No	e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XQKU095-1RFA1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes		67200				.95		Grid Array				1 mm			67200 CLBS		Tin Lead	Bottom	S-PBGA-B1156		3.72 mm	35 mm		e0					35 mm
XC7K480T-1FF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes			CMOS	400			1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1818 MHz		400
XCKU11P-1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512		0.85		Grid Array	BGA1156,34X34,40		.825 V	1 mm	100 °C (212 °F)		37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm		e1			512		35 mm
XC7A12T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000	HKMG	150		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	150	245 °C (473 °F)	35 mm
XC7K420T-L2FF1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes			CMOS	400			0.9,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1286 MHz		400
XC7A35T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1286 MHz	30 s	250	245 °C (473 °F)	35 mm
XC7K480T-3FFV1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.03 V	37325				1		Grid Array			.97 V	1 mm		0.58 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s		245 °C (473 °F)	35 mm
XC3S2000-5FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156		2.6 mm	35 mm	No						35 mm
XCV2000E-6FG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	804	518400	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	9600 CLBS, 518400 Gates		Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No	e0	357 MHz		804		35 mm
XC6VSX475T-1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC7A100T-3FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1412 MHz	30 s	300	245 °C (473 °F)	35 mm
XC3S5000-5FG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	74880	Yes			CMOS	784			1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1156	3			No	e0			784	225 °C (437 °F)
XCV3200E-7CG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Ceramic, Metal-Sealed Cofired	73008	Yes	1.89 V	16224	CMOS	804	876096	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	16224 CLBS, 876096 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-CBGA-B1156		3.11 mm	35 mm	No	e0	400 MHz		804		35 mm
XC6VLX240T-3FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1412 MHz	30 s	600	225 °C (437 °F)	35 mm
XCV3200E-7CGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Ceramic, Metal-Sealed Cofired		Yes	1.89 V	16224	CMOS		876096	1.8		Grid Array			1.71 V	1 mm	85 °C (185 °F)	0.42 ns	16224 CLBS, 876096 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-CBGA-B1156		3.11 mm	35 mm	No	e1	400 MHz				35 mm
XC3S4000-5FG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	62208	Yes			CMOS	712			1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1156	3			No	e0			712	225 °C (437 °F)
XCE7K420T-2FFV1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG	400		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	32575 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s	400	245 °C (473 °F)	35 mm
XCE7K420T-L2FFV1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	.93 V	32575	HKMG	400		.9		Grid Array			.87 V	1 mm	100 °C (212 °F)	0.91 ns	32575 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s	400	245 °C (473 °F)	35 mm
XCV1600E-6FGG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	724	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	7776 CLBS, 419904 Gates		Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e1	357 MHz		724		35 mm
XC7A50T-3FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	0.94 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1412 MHz	30 s	250	245 °C (473 °F)	35 mm
XQ6VSX315T-1LRF1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes		24600	CMOS	600				Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	24600 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm		e0			600		35 mm
XC6VCX130T-2FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS	600		1	1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.91 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.