1156 Field Programmable Gate Arrays (FPGA) 788

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XQ6VLX130T-1LRF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	.97 V	10000	CMOS		600					Grid Array	BGA1156,34X34,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	10000 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XC7A15T-L2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	16640	Yes	.93 V	1300			250		0.9			Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC6VLX365T-L1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	.93 V		CMOS		600		.9		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7A25T-2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	150	245 °C (473 °F)	35 mm
XCKU060-1LFFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	2760	CMOS		520		0.95	Tray		Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		2760 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm			e1			520		35 mm
XC6VHX380T-1FF1155C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS		440		1		1,1.2/2.5 V	Grid Array	BGA1155,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No		e0	1098 MHz		440		35 mm
XC7A350T-2FFG1156C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	348480	Yes	1.05 V		CMOS		600		1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	1.05 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4		35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7A200T-L2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	.93 V	16825			500		0.9			Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	16825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	500	245 °C (473 °F)	35 mm
XC7Z100-L1FFG1156I	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	444000	Yes	1.05 V	34675			530	6600000	1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	34675 CLBS, 6600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156		3.35 mm	35 mm		PL block operates in 0.97V to 1.03V supply				530		35 mm
XC7A25T-L2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	23360	Yes	.93 V	1825	HKMG		150		0.9			Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	245 °C (473 °F)	35 mm
XC7K480T-2FFV1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.03 V	37325					1			Grid Array			.97 V	1 mm	85 °C (185 °F)	0.61 ns	37325 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156		3.35 mm	35 mm			e1					35 mm
XC7A75T-3FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			300		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1412 MHz	30 s	300	245 °C (473 °F)	35 mm
XCV3200E-6CG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Ceramic, Metal-Sealed Cofired	73008	Yes	1.89 V	16224	CMOS		804	876096	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	16224 CLBS, 876096 Gates		Tin Lead	Bottom	S-CBGA-B1156		3.11 mm	35 mm	No		e0	357.2 MHz		804		35 mm
XCV1000E-8FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS		660	331776	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	416 MHz		660		35 mm
XC6VLX130T-L1FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V		CMOS		600		.9		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VCX195T-2FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS		600		1		1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.91 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7A200T-L2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	.93 V	16825			500		0.9		0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	1.51 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm	No	Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	500	245 °C (473 °F)	35 mm
XCV2000E-7FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS		804	518400	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	9600 CLBS, 518400 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	400 MHz		804		35 mm
XC7VX485T-1FF1158C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	485760	Yes	.93 V		CMOS		350		0.9		0.9,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1818 MHz		350
XC7A35T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600			250		0.95			Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC3S1500-5FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156		2.6 mm	35 mm	No							35 mm
XC7A50T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075			250		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	250	245 °C (473 °F)	35 mm
XC7A100T-3FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925			300		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1412 MHz	30 s	300	245 °C (473 °F)	35 mm
XC7VX550T-3FF1158E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	554240	Yes			CMOS		350				1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1818 MHz		350
XC7A25T-3FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825	HKMG		150		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1412 MHz	30 s	150	245 °C (473 °F)	35 mm
XQ6VSX475T-1RF1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V	37200	CMOS		600		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	125 °C (257 °F)	0.79 ns	37200 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XQ6VLX240T-1FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	241000	Yes	1.05 V	18840	CMOS		600		1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm		0.79 ns	18840 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC3S400-4FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156		2.6 mm	35 mm	No							35 mm
XQ6VLX130T-2RF1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS		600					Grid Array	BGA1156,34X34,40		.95 V	1 mm	125 °C (257 °F)	0.67 ns	10000 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm			e0	1286 MHz		600		35 mm
XC6VHX380T-3FF1155C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS		440		1		1,1.2/2.5 V	Grid Array	BGA1155,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No		e0	1412 MHz		440		35 mm
XC7K480T-1FFV1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.03 V	37325					1			Grid Array			.97 V	1 mm		0.74 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1156		3.35 mm	35 mm			e1					35 mm
XCKU095-1FFVA1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200			702		0.95			Grid Array	BGA1156,34X34,40		.922 V	1 mm	85 °C (185 °F)		67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1			702		35 mm
XCV1600E-7FGG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS		724	419904	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	7776 CLBS, 419904 Gates		Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	400 MHz		724		35 mm
XCV1000E-7FGG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS		660	331776	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	6144 CLBS, 331776 Gates		Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	400 MHz		660		35 mm
XC7Z100-3FFG1156E	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	444000	Yes	1.05 V	34675			530	6600000	1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	34675 CLBS, 6600000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		PL block operates in 0.97V to 1.03V supply				530		35 mm
XC3S200-4FG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192				50000	1.2			Grid Array			1.14 V	1 mm			192 CLBS, 50000 Gates			Bottom	S-PBGA-B1156		2.6 mm	35 mm	No							35 mm
XC5VTX150T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	148480	Yes	1.05 V	11600	CMOS		360		1		1,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	11600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1		30 s	360	245 °C (473 °F)	35 mm
XQKU15P-1FFRA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		MIL-PRF-38535	564		0.85			Grid Array	BGA1156,34X34,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.71 mm	35 mm			e0		20 s	564	225 °C (437 °F)	35 mm
XC6VLX240T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	.93 V		CMOS		600		.9		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XCKU035-1FFVA1156E	Xilinx	FPGA	Commercial Extended	Ball	1156	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391			520		0.95			Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		25391 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1			520		35 mm
XCE7K480T-L2FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes	.97 V	37325	HKMG		400		.95			Grid Array			.93 V	1 mm	100 °C (212 °F)	0.61 ns	37325 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm			e1		30 s	400	245 °C (473 °F)	35 mm
XQ6VSX315T-1FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	315000	Yes	1.05 V	24600	CMOS		600		1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm		0.79 ns	24600 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7VX415T-2FF1158C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	412160	Yes			CMOS		350				1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1818 MHz		350
XC7K420T-1FF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes			CMOS		400				1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B1156				No		e0	1818 MHz		400
XC6VLX365T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V		CMOS		600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7A25T-L2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	23360	Yes	.93 V	1825	HKMG		150		0.9			Grid Array	BGA1156,34X34,40		.87 V	1 mm	85 °C (185 °F)	1.51 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	150	245 °C (473 °F)	35 mm
XC6VLX130T-2FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS		600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XC7A15T-3FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300			250		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1412 MHz	30 s	250	245 °C (473 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.