1156 Field Programmable Gate Arrays (FPGA) 788

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LFE3-150EA-7FN1156I	Lattice Semiconductor	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	149000	Yes	1.26 V			586		1.2		1.2 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.335 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	420 MHz	30 s	586	250 °C (482 °F)	35 mm
XC6VLX130T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V		CMOS	600		.9		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VLX240T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7A200T-2FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	16825				1			Grid Array			.95 V	1 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.1 mm	35 mm			e0					35 mm
XC6VLX130T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VLX240T-2FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VSX475T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7K480T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	CMOS	400		1		1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	37325 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm	No		e1	1098 MHz	30 s	400	245 °C (473 °F)	35 mm
XC7K480T-2FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	CMOS	400		1		1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm	No		e1	1286 MHz	30 s	400	245 °C (473 °F)	35 mm
XC7V585T-1FF1157I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	582720	Yes			CMOS	600				1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156	4			No		e0	1818 MHz		600
XC7VX415T-2FF1157I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	412160	Yes			CMOS	600				1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156	4			No		e0	1818 MHz		600
XCKU035-2FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	444343	Yes	.979 V	1700		520		.95		0.95 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		1700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm	No		e1			520		35 mm
XQ7VX690T-2RF1158I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	693120	Yes	1.03 V	54150	HKMG	350		1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B1156				No			1818 MHz		350
XQKU060-1RFA1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes		41460		520		.95			Grid Array				1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.72 mm	35 mm			e0			520		35 mm
XQKU060-2RFA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes		41460		520		.95			Grid Array				1 mm	100 °C (212 °F)		41460 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.72 mm	35 mm			e0			520		35 mm
XQZU9EG-1FFRB1156M	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260				0.85			Grid Array			.825 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin/Lead	Bottom	S-PBGA-B1157	4	3.62 mm	35 mm			e0		40 s		245 °C (473 °F)	35 mm
XC6VLX195T-1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC7A25T-L1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825	HKMG	150		0.95			Grid Array	BGA1156,34X34,40		.92 V	1 mm	85 °C (185 °F)	1.27 ns	1825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	150	245 °C (473 °F)	35 mm
XQ6VSX315T-3FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	24600	CMOS			1			Grid Array			.95 V	1 mm	85 °C (185 °F)	0.59 ns	24600 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm			e1		30 s		245 °C (473 °F)	35 mm
XC7A100T-3FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	0.94 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1412 MHz	30 s	300	245 °C (473 °F)	35 mm
XC6VLX365T-1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VLX130T-1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	5.08 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XQKU040-2RFA1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes		30300				.95			Grid Array				1 mm			30300 CLBS		Tin Lead	Bottom	S-PBGA-B1156		3.62 mm	35 mm			e0					35 mm
XC7VX485T-3FF1158E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS	350		1		1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1818 MHz		350
XC7A50T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075		250		0.95			Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC6VLX130T-1FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VLX365T-2FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XC7A50T-L1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075		250		0.95			Grid Array	BGA1156,34X34,40		.92 V	1 mm	85 °C (185 °F)	1.27 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XQ6VLX240T-2FFG1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	18840	CMOS			1			Grid Array			.95 V	1 mm		0.67 ns	18840 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm			e1		30 s		245 °C (473 °F)	35 mm
XC7A75T-L2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	75520	Yes	.93 V	5900		300		0.9			Grid Array	BGA1156,34X34,40		.87 V	1 mm	85 °C (185 °F)	1.51 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	300	245 °C (473 °F)	35 mm
XC7A75T-2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	300	245 °C (473 °F)	35 mm
XCKU060-L1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes	.927 V	2760		624		.9		0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)		2760 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	624	245 °C (473 °F)	35 mm
XC7A100T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	300	245 °C (473 °F)	35 mm
XQ7VX690T-1RF1158I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	693120	Yes	1.03 V	54150	HKMG	350		1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns		-40 °C (-40 °F)		Bottom	S-PBGA-B1156				No			1818 MHz		350
XQ6VSX475T-L1RF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	476000	Yes			CMOS	600		.9		0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1098 MHz		600
XC6VLX365T-3FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1412 MHz	30 s	600	225 °C (437 °F)	35 mm
XQ6VLX240T-1LFFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes		18840	CMOS	600					Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	18840 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XC7K420T-2LFFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	.93 V	32575		400		0.9			Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	0.91 ns	32575 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm			e1		30 s	400	250 °C (482 °F)	35 mm
XC3S4000-4FGG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS	712	4000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	6912 CLBS, 4000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	630 MHz	30 s	712	245 °C (473 °F)	35 mm
XC7A50T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC6VLX240T-2FFG1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes			CMOS	600				1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B1156	4			No		e1	1286 MHz	30 s	600	245 °C (473 °F)
XC7A200T-L1FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	.98 V	16825		500		0.95			Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	500	245 °C (473 °F)	35 mm
XCV1000E-6FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	6144 CLBS, 331776 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No		e0	357 MHz		660		35 mm
XC6VLX195T-1FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XCKU040-1LFFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	530250	Yes	.979 V	1920	CMOS	520		0.95	Tray		Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		1920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm			e1		30 s	520	245 °C (473 °F)	35 mm
XC7K480T-2FF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes			CMOS	400				1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1818 MHz		400
XC3S4000-4FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS	712	4000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	6912 CLBS, 4000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e1	630 MHz	30 s	712	245 °C (473 °F)	35 mm
XQ6VLX240T-2FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	241000	Yes	1.05 V	18840	CMOS	600		1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm		0.67 ns	18840 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.