1156 Field Programmable Gate Arrays (FPGA) 788

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A75T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	75520	Yes	.98 V	5900		300		0.95		Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	300	245 °C (473 °F)	35 mm
XCKU075-1FFVA1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	756000	Yes	.979 V	2592		520		.95		Grid Array			.922 V	1 mm	85 °C (185 °F)		2592 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm		e1			520		35 mm
XCE7K420T-3FFV1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG	400		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.58 ns	32575 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s	400	245 °C (473 °F)	35 mm
XC7K480T-L2FF1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes			CMOS	400			0.9,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1286 MHz		400
XC6VHX380T-2FF1154C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	320		1	1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No	e0	1286 MHz		320		35 mm
XC7A35T-2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	33280	Yes	1.05 V	2600		250		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1286 MHz	30 s	250	245 °C (473 °F)	35 mm
XC7A350T-L2FFG1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	348480	Yes	.93 V		CMOS	600		.9	0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	1.05 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4		35 mm	No	e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XCZU9EG-2LFFVB1156E	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes		34260				0.85		Grid Array				1 mm	110 °C (230 °F)		34260 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm		e1		30 s		245 °C (473 °F)	3.42 mm
XQ6VLX240T-2FFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS	600		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	125 °C (257 °F)	0.67 ns	18840 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm		e1		30 s	600	245 °C (473 °F)	35 mm
XC6VLX240T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	4.29 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7VX550T-1FF1158C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	554240	Yes			CMOS	350			0.9,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1818 MHz		350
XCE7K480T-2FFV1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	477760	Yes	1.03 V	37325	HKMG	400		1		Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	37325 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s	400	245 °C (473 °F)	35 mm
XC6VLX195T-2FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XC7VX485T-1FF1157C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	485760	Yes	.93 V		CMOS	600		0.9	0.9,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1156	4			No	e0	1818 MHz		600
XC6VCX195T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS	600		1	1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7A50T-L1FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	.98 V	4075		250		0.95		Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC6VLX365T-L1FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	.93 V		CMOS	600		.9	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XCE7K420T-1FFV1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG	400		1		Grid Array			.97 V	1 mm	85 °C (185 °F)	0.74 ns	32575 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s	400	245 °C (473 °F)	35 mm
XCV1000E-6FG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	27648	Yes	1.89 V	6144	CMOS	660	331776	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.47 ns	6144 CLBS, 331776 Gates		Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No	e0	357 MHz		660		35 mm
XC7K420T-L2FFV1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	.97 V	32575				.95		Grid Array			.93 V	1 mm		0.61 ns	32575 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1156		3.35 mm	35 mm		e1					35 mm
XC7K420T-1LFFG1156E	Xilinx	FPGA		Ball	1156			Plastic/Epoxy		Yes								Grid Array									Tin Silver Copper	Bottom		4			No	e1		30 s		250 °C (482 °F)
XQ6VSX475T-1LRF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	.97 V	37200	CMOS	600				Grid Array	BGA1156,34X34,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	37200 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm		e0			600		35 mm
XC7K480T-3FFG1156I	Xilinx	FPGA		Ball	1156			Plastic/Epoxy		Yes								Grid Array									Tin Silver Copper	Bottom		4			No	e1		30 s		250 °C (482 °F)
XC6VCX240T-1FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS	600		1	1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.79 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XQ6VLX130T-1FFG1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS	600				Grid Array	BGA1156,34X34,40		.95 V	1 mm	125 °C (257 °F)	0.79 ns	10000 CLBS	-55 °C (-67 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7V585T-2FF1157C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	582720	Yes			CMOS	600			1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156	4			No	e0	1818 MHz		600
XC7VX330T-3FF1157E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	326400	Yes			CMOS	600			1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156	4			No	e0	1818 MHz		600
XC7A200T-2LFFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	215360	Yes	.93 V	16825		500		0.9		Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	16825 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1		30 s	500	245 °C (473 °F)	35 mm
XC7A100T-1FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	300	245 °C (473 °F)	35 mm
XC6VCX195T-2FF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V	15600	CMOS	600		1	1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.91 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VLX130T-2FF1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm					Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XC7A75T-L1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	75520	Yes	.98 V	5900		300		0.95		Grid Array	BGA1156,34X34,40		.92 V	1 mm	85 °C (185 °F)	1.27 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	300	245 °C (473 °F)	35 mm
XC3S1000-4FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156		2.6 mm	35 mm	No						35 mm
XQ6VSX315T-2RF1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	1.05 V	24600	CMOS	600		1		Grid Array	BGA1156,34X34,40		.95 V	1 mm	125 °C (257 °F)	0.67 ns	24600 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm		e0			600		35 mm
XC7VX550T-2FF1158I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	554240	Yes			CMOS	350			1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No	e0	1818 MHz		350
XCV1600E-7FG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	724	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.42 ns	7776 CLBS, 419904 Gates		Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No	e0	400 MHz		724		35 mm
XCV1600E-8FGG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	724	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	7776 CLBS, 419904 Gates		Tin Silver Copper	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No	e1	416 MHz		724		35 mm
XC7VX690T-L2FF1157E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	600			1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156	4			No	e0	1818 MHz		600
XC6VLX240T-2FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XC7A15T-L1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	16640	Yes	.98 V	1300		250		0.95		Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	1300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC7VX330T-1FF1157I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	326400	Yes			CMOS	600			1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156	4			No	e0	1818 MHz		600
XC7K480T-L2FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	.97 V	37325				.95		Grid Array			.93 V	1 mm		0.61 ns	37325 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm		e1		30 s		250 °C (482 °F)	35 mm
XC6VLX240T-1LFF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	.97 V							Grid Array			.91 V	1 mm					Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0					35 mm
XC7K420T-3FFG1156I	Xilinx	FPGA		Ball	1156			Plastic/Epoxy		Yes								Grid Array									Tin Silver Copper	Bottom		4			No	e1		30 s		245 °C (473 °F)
XCV1600E-8FG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	724	419904	1.8	1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.4 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No	e0	416 MHz		724		35 mm
XC6VSX315T-L1FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	314880	Yes	.93 V		CMOS	600		.9	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)	5.87 ns		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VLX365T-3FF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes	1.05 V	28440	CMOS	600				Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.59 ns	28440 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm		e0	1412 MHz		600		35 mm
XQ6VLX130T-L1FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	128000	Yes			CMOS	600		.9	0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4			No	e1	1098 MHz	30 s	600	245 °C (473 °F)

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.