1156 Field Programmable Gate Arrays (FPGA) 788

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7A35T-L1FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	33280	Yes	.98 V	2600		250		0.95			Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	2600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC6VLX195T-3FFG1156C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes			CMOS	600				1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B1156	4			No		e1	1412 MHz	30 s	600	245 °C (473 °F)
XCE7K420T-2FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG	400		1			Grid Array			.97 V	1 mm	100 °C (212 °F)	0.61 ns	32575 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm			e1		30 s	400	245 °C (473 °F)	35 mm
XQ6VSX475T-1LRF1156M	Xilinx	FPGA	Military	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes		37200	CMOS	600					Grid Array	BGA1156,34X34,40			1 mm	125 °C (257 °F)	0.85 ns	37200 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XC6VCX240T-2FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS	600		1		1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.91 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XCE7K420T-1FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	HKMG	400		1			Grid Array			.97 V	1 mm	100 °C (212 °F)	0.74 ns	32575 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm			e1		30 s	400	245 °C (473 °F)	35 mm
XC7A100T-1FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925		300		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	300	245 °C (473 °F)	35 mm
XQZU9EG-2FFRB1156I	Xilinx	FPGA SOC		Ball	1156	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260				0.85			Grid Array			.825 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B1157	4	3.62 mm	35 mm			e0		40 s		245 °C (473 °F)	35 mm
XC7VX485T-L2FF1157E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	485760	Yes	1.03 V		CMOS	600		1		1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)	Tin/Lead	Bottom	S-PBGA-B1156	4			No		e0	1818 MHz		600
XC7A50T-L2FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	.93 V	4075		250		0.9			Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	1.51 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm		Also Operates at 1 V nominal supply	e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC7K420T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes	1.03 V	32575	CMOS	350		1		1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	32575 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.35 mm	35 mm	No		e1	1286 MHz	30 s	350	245 °C (473 °F)	35 mm
XQ6VLX240T-L1RF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic	241000	Yes			CMOS	600		.9		0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1098 MHz		600
XC7A75T-2FFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	1.05 ns	5900 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	300	245 °C (473 °F)	35 mm
XC6VHX380T-3FF1154C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	320		1		1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.5 mm	35 mm	No		e0	1412 MHz		320		35 mm
XC6VSX475T-2FF1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm					Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VSX475T-1LFFG1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	476160	Yes	.93 V	37200	CMOS	600		0.9			Grid Array	BGA1156,34X34,40		.87 V	1 mm	100 °C (212 °F)	0.85 ns	37200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XQ6VLX130T-1FFG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V	10000	CMOS	600		1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm		0.79 ns	10000 CLBS		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XCV2000E-8FG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	43200	Yes	1.89 V	9600	CMOS	804	518400	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm		0.4 ns	9600 CLBS, 518400 Gates		Tin Lead	Bottom	S-PBGA-B1156		2.6 mm	35 mm	No		e0	416 MHz		804		35 mm
XCKU095-1LFFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768	CMOS	520		0.95	Tray		Grid Array	BGA1156,34X34,40		.922 V	1 mm	100 °C (212 °F)		768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm			e1			520		35 mm
XCV3200E-6CG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Ceramic, Metal-Sealed Cofired	73008	Yes	1.89 V	16224	CMOS	804	876096	1.8		1.2/3.6,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	16224 CLBS, 876096 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-CBGA-B1156		3.11 mm	35 mm	No		e0	357.2 MHz		804		35 mm
XQ6VLX240T-1LRF1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	.97 V	18840	CMOS	600					Grid Array	BGA1156,34X34,40		.91 V	1 mm	100 °C (212 °F)	0.85 ns	18840 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B1156		3.53 mm	35 mm			e0			600		35 mm
XCKU035-L1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	444343	Yes	.927 V	1700		520		.9		0.9 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)		1700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm	No	Also Operates at 0.95 V nominal supply	e1			520		35 mm
XQ6VLX130T-3FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	10000	CMOS			1			Grid Array			.95 V	1 mm	85 °C (185 °F)	0.59 ns	10000 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm			e1		30 s		245 °C (473 °F)	35 mm
XCKU035-3FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	444343	Yes	1.03 V	25391		520		1			Grid Array	BGA1156,34X34,40		.97 V	1 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1		30 s	520	245 °C (473 °F)	35 mm
XC6VCX240T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V	18840	CMOS	600		1		1,1.2/2.5,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.91 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VLX365T-1LFF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	.97 V								Grid Array			.91 V	1 mm					Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0		30 s		225 °C (437 °F)	35 mm
XC7A100T-L1FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	101440	Yes	.98 V	7925		300		0.95			Grid Array	BGA1156,34X34,40		.92 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	300	245 °C (473 °F)	35 mm
XC3S2000-4FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156		2.6 mm	35 mm	No							35 mm
XC3S4000-4FG1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	62208	Yes	1.26 V	6912	CMOS	712	4000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	6912 CLBS, 4000000 Gates		Tin Lead	Bottom	S-PBGA-B1156	3	2.6 mm	35 mm	No		e0	630 MHz		712	225 °C (437 °F)	35 mm
XC6VLX195T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7A200T-2FFV1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	16825				1			Grid Array			.95 V	1 mm		1.05 ns	16825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1		30 s		245 °C (473 °F)	35 mm
XC6VLX195T-2FFG1156E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes			CMOS	600				1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B1156	4			No		e1	1286 MHz	30 s	600	245 °C (473 °F)
XC7A50T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XCKU095-3FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1176000	Yes	1.03 V	67200		702		1			Grid Array	BGA1156,34X34,40		.97 V	1 mm	100 °C (212 °F)		67200 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1		30 s	702	245 °C (473 °F)	35 mm
XC7K420T-2FF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	416960	Yes			CMOS	400				1,1.8,3.3 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156				No		e0	1818 MHz		400
XC6VLX365T-3FFG1156C	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	364032	Yes			CMOS	600				1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B1156	4			No		e1	1412 MHz	30 s	600	245 °C (473 °F)
XQ6VLX130T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	10000	CMOS			1			Grid Array			.95 V	1 mm	85 °C (185 °F)	0.67 ns	10000 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm			e1		30 s		245 °C (473 °F)	35 mm
XC6VLX195T-3FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0	1412 MHz	30 s	600	225 °C (437 °F)	35 mm
XC7VX415T-3FF1157E	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy	412160	Yes			CMOS	600				1,1.8 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1156	4			No		e0	1818 MHz		600
XC7A15T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	16640	Yes	1.05 V	1300		250		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	1.27 ns	1300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1098 MHz	30 s	250	245 °C (473 °F)	35 mm
XC6VLX195T-1LFFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	199680	Yes	.93 V	15600	CMOS	600		0.9			Grid Array	BGA1156,34X34,40		.87 V	1 mm	85 °C (185 °F)	0.85 ns	15600 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm			e1		30 s	600	245 °C (473 °F)	35 mm
XC7A75T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900		300		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	85 °C (185 °F)	1.05 ns	5900 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1286 MHz	30 s	300	245 °C (473 °F)	35 mm
XQ6VLX240T-3FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.05 V	18840	CMOS			1			Grid Array			.95 V	1 mm	85 °C (185 °F)	0.59 ns	18840 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1156	4	3.53 mm	35 mm			e1		30 s		245 °C (473 °F)	35 mm
XC3S1500-4FGG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2			Grid Array			1.14 V	1 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B1156		2.6 mm	35 mm	No							35 mm
XC6VLX195T-1LFF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	.97 V								Grid Array			.91 V	1 mm					Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0					35 mm
XC6VSX315T-1LFF1156I	Xilinx	FPGA		Ball	1156	BGA	Square	Plastic/Epoxy		Yes	.97 V								Grid Array			.91 V	1 mm					Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e0					35 mm
XCKU025-3FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	318150	Yes	1.03 V	18180		312		1			Grid Array	BGA1156,34X34,40		.97 V	1 mm	100 °C (212 °F)		18180 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1		30 s	312	245 °C (473 °F)	35 mm
XC7A50T-3FFG1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075		250		1			Grid Array	BGA1156,34X34,40		.95 V	1 mm	100 °C (212 °F)	0.94 ns	4075 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.1 mm	35 mm			e1	1412 MHz	30 s	250	245 °C (473 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.