1156 Field Programmable Gate Arrays (FPGA) 788

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC7K420T-2FFV1156I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

Yes

1.03 V

32575

1

Grid Array

.97 V

1 mm

0.61 ns

32575 CLBS

Tin Silver Copper

Bottom

S-PBGA-B1156

3.35 mm

35 mm

e1

35 mm

XCE7K420T-L2FFG1156I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

416960

Yes

.97 V

32575

HKMG

400

.95

Grid Array

.93 V

1 mm

100 °C (212 °F)

0.61 ns

32575 CLBS

-40 °C (-40 °F)

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Bottom

S-PBGA-B1156

4

3.35 mm

35 mm

e1

30 s

400

245 °C (473 °F)

35 mm

XC7A12T-L2FFG1156C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

12800

Yes

.93 V

1000

HKMG

150

0.9

Grid Array

BGA1156,34X34,40

.87 V

1 mm

85 °C (185 °F)

1.51 ns

1000 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

4

3.1 mm

35 mm

Also Operates at 1 V nominal supply

e1

1098 MHz

30 s

150

245 °C (473 °F)

35 mm

XCV3200E-7FGG1156C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

73008

Yes

1.89 V

18252

CMOS

804

1.8

1.2/3.6,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1.71 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B1156

35 mm

No

400 MHz

804

35 mm

XC7A25T-L1FFG1156I

Xilinx

FPGA

Industrial

Ball

1156

BGA

Square

Plastic/Epoxy

23360

Yes

.98 V

1825

HKMG

150

0.95

Grid Array

BGA1156,34X34,40

.92 V

1 mm

100 °C (212 °F)

1.27 ns

1825 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

4

3.1 mm

35 mm

e1

1098 MHz

30 s

150

245 °C (473 °F)

35 mm

XC6VSX315T-1LFFG1156C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

314880

Yes

.93 V

24600

CMOS

600

0.9

Grid Array

BGA1156,34X34,40

.87 V

1 mm

85 °C (185 °F)

0.85 ns

24600 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

4

3.5 mm

35 mm

e1

30 s

600

245 °C (473 °F)

35 mm

XC7VX415T-1FF1158C

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

412160

Yes

CMOS

350

0.9,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1156

No

e0

1818 MHz

350

XC7K420T-L2FFV1156E

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

Yes

.93 V

32575

.9

Grid Array

.87 V

1 mm

0.91 ns

32575 CLBS

Tin Silver Copper

Bottom

S-PBGA-B1156

3.35 mm

35 mm

e1

35 mm

XQ6VLX240T-1FFG1156M

Xilinx

FPGA

Military

Ball

1156

BGA

Square

Plastic/Epoxy

241152

Yes

18840

CMOS

600

Grid Array

BGA1156,34X34,40

1 mm

125 °C (257 °F)

0.79 ns

18840 CLBS

-55 °C (-67 °F)

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Bottom

S-PBGA-B1156

4

3.5 mm

35 mm

e1

30 s

600

245 °C (473 °F)

35 mm

XC6VSX315T-1FF1156I

Xilinx

FPGA

Industrial

Ball

1156

BGA

Square

Plastic/Epoxy

314880

Yes

1.05 V

CMOS

600

1

1,1.2/2.5 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.95 V

1 mm

100 °C (212 °F)

5.08 ns

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B1156

4

3.5 mm

35 mm

No

e0

1098 MHz

30 s

600

225 °C (437 °F)

35 mm

XC7VX485T-2FF1157C

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

485760

Yes

1.03 V

CMOS

600

1

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Bottom

S-PBGA-B1156

4

No

e0

1818 MHz

600

XC7VX485T-2FF1158C

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

485760

Yes

1.03 V

CMOS

350

1

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Bottom

S-PBGA-B1156

No

e0

1818 MHz

350

XC6VLX365T-2FFG1156E

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

364032

Yes

CMOS

600

1,1.2/2.5 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B1156

4

No

e1

1286 MHz

30 s

600

245 °C (473 °F)

XC6VLX130T-1LFF1156C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

Yes

.93 V

Grid Array

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1156

4

3.5 mm

35 mm

No

e0

35 mm

XCV3200E-8FGG1156I

Xilinx

FPGA

Industrial

Ball

1156

BGA

Square

Plastic/Epoxy

73008

Yes

1.89 V

18252

CMOS

804

1.8

1.2/3.6,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1.71 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B1156

35 mm

No

416 MHz

804

35 mm

XCV2600E-6FG1156C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

57132

Yes

1.89 V

12696

CMOS

804

685584

1.8

1.2/3.6,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1.71 V

1 mm

85 °C (185 °F)

0.47 ns

12696 CLBS, 685584 Gates

0 °C (32 °F)

Bottom

S-PBGA-B1156

1

2.6 mm

35 mm

No

357 MHz

804

35 mm

XCV2000E-7FG1156I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

43200

Yes

1.89 V

9600

CMOS

804

518400

1.8

1.2/3.6,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1.71 V

1 mm

0.42 ns

9600 CLBS, 518400 Gates

Tin Lead

Bottom

S-PBGA-B1156

2.6 mm

35 mm

No

e0

400 MHz

804

35 mm

XC7A350T-1FFG1156I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic

348480

Yes

1.05 V

CMOS

600

1

1 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.95 V

1 mm

100 °C (212 °F)

1.27 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

4

35 mm

No

e1

1098 MHz

30 s

600

245 °C (473 °F)

35 mm

XC7A15T-L2FFG1156C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

16640

Yes

.93 V

1300

250

0.9

Grid Array

BGA1156,34X34,40

.87 V

1 mm

85 °C (185 °F)

1.51 ns

1300 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

4

3.1 mm

35 mm

Also Operates at 1 V nominal supply

e1

1098 MHz

30 s

250

245 °C (473 °F)

35 mm

XC6VLX130T-1LFF1156I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

Yes

.97 V

Grid Array

.91 V

1 mm

Tin Lead

Bottom

S-PBGA-B1156

4

3.5 mm

35 mm

No

e0

35 mm

XQ6VLX130T-1LRF1156M

Xilinx

FPGA

Military

Ball

1156

BGA

Square

Plastic/Epoxy

128000

Yes

10000

CMOS

600

Grid Array

BGA1156,34X34,40

1 mm

125 °C (257 °F)

0.85 ns

10000 CLBS

-55 °C (-67 °F)

Tin Lead

Bottom

S-PBGA-B1156

3.53 mm

35 mm

e0

600

35 mm

XC7VX485T-L2FF1158E

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

485760

Yes

1.03 V

CMOS

350

1

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

100 °C (212 °F)

0 °C (32 °F)

Tin/Lead

Bottom

S-PBGA-B1156

No

e0

1818 MHz

350

XC3S200-5FGG1156C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Grid Array

1.14 V

1 mm

85 °C (185 °F)

192 CLBS, 50000 Gates

0 °C (32 °F)

Bottom

S-PBGA-B1156

2.6 mm

35 mm

No

35 mm

XC6VHX250T-2FF1154I

Xilinx

FPGA

Industrial

Ball

1156

BGA

Square

Plastic/Epoxy

251904

Yes

1.05 V

CMOS

320

1

1,1.2/2.5 V

Grid Array

BGA1154,34X34,40

Field Programmable Gate Arrays

.95 V

1 mm

100 °C (212 °F)

4.29 ns

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B1156

3.5 mm

35 mm

No

e0

1286 MHz

320

35 mm

XCKU15P-3FFVA1156E

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

1143450

Yes

.927 V

65340

668

0.9

Grid Array

BGA1156,34X34,40

.873 V

1 mm

100 °C (212 °F)

65340 CLBs

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

4

3.71 mm

35 mm

e1

668

35 mm

XC3S1000-4FG1156I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Grid Array

1.14 V

1 mm

192 CLBS, 50000 Gates

Bottom

S-PBGA-B1156

2.6 mm

35 mm

No

35 mm

XC7A100T-L1FFG1156C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

101440

Yes

.98 V

7925

300

0.95

Grid Array

BGA1156,34X34,40

.92 V

1 mm

85 °C (185 °F)

1.27 ns

7925 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

4

3.1 mm

35 mm

e1

1098 MHz

30 s

300

245 °C (473 °F)

35 mm

XC6VSX475T-2FF1156I

Xilinx

FPGA

Industrial

Ball

1156

BGA

Square

Plastic/Epoxy

476160

Yes

1.05 V

CMOS

600

1

1,1.2/2.5 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.95 V

1 mm

100 °C (212 °F)

4.29 ns

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B1156

4

3.5 mm

35 mm

No

e0

1286 MHz

30 s

600

225 °C (437 °F)

35 mm

XC6VHX250T-1FF1154C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

251904

Yes

1.05 V

CMOS

320

1

1,1.2/2.5 V

Grid Array

BGA1154,34X34,40

Field Programmable Gate Arrays

.95 V

1 mm

85 °C (185 °F)

5.08 ns

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1156

3.5 mm

35 mm

No

e0

1098 MHz

320

35 mm

XC3S1500-4FGG1156I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Grid Array

1.14 V

1 mm

192 CLBS, 50000 Gates

Bottom

S-PBGA-B1156

2.6 mm

35 mm

No

35 mm

XC6VHX255T-3FF1155C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

253440

Yes

1.05 V

CMOS

440

1

1,1.2/2.5 V

Grid Array

BGA1155,34X34,40

Field Programmable Gate Arrays

.95 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1156

3.5 mm

35 mm

No

e0

1412 MHz

440

35 mm

XQ6VSX315T-1RFG1156I

Xilinx

FPGA

Industrial

Ball

1156

BGA

Square

Plastic/Epoxy

314880

Yes

1.05 V

24600

CMOS

600

1

Grid Array

BGA1156,34X34,40

.95 V

1 mm

100 °C (212 °F)

0.79 ns

24600 CLBS

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B1156

3.53 mm

35 mm

e0

600

35 mm

XC6VLX240T-1FF1156C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

241152

Yes

1.05 V

CMOS

600

1

1,1.2/2.5 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.95 V

1 mm

85 °C (185 °F)

5.08 ns

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1156

4

3.5 mm

35 mm

No

e0

1098 MHz

30 s

600

225 °C (437 °F)

35 mm

XC7VX415T-L2FF1158E

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

412160

Yes

CMOS

350

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1156

No

e0

1818 MHz

350

XC3S50-4FG1156I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Grid Array

1.14 V

1 mm

192 CLBS, 50000 Gates

Bottom

S-PBGA-B1156

2.6 mm

35 mm

No

35 mm

XCE7K420T-1FFG1156C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

416960

Yes

1.03 V

32575

HKMG

400

1

Grid Array

.97 V

1 mm

85 °C (185 °F)

0.74 ns

32575 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

4

3.35 mm

35 mm

e1

30 s

400

245 °C (473 °F)

35 mm

XCV1600E-6FG1156C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

34992

Yes

1.89 V

7776

CMOS

724

419904

1.8

1.2/3.6,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1.71 V

1 mm

85 °C (185 °F)

0.47 ns

7776 CLBS, 419904 Gates

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1156

2.6 mm

35 mm

No

e0

357 MHz

724

35 mm

XC7K420T-1LFFG1156C

Xilinx

FPGA

Ball

1156

Plastic/Epoxy

Yes

Grid Array

Tin Silver Copper

Bottom

4

No

e1

30 s

250 °C (482 °F)

XC6VSX475T-1FF1156C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

476160

Yes

1.05 V

CMOS

600

1

1,1.2/2.5 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.95 V

1 mm

85 °C (185 °F)

5.08 ns

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1156

4

3.5 mm

35 mm

No

e0

1098 MHz

30 s

600

225 °C (437 °F)

35 mm

XCV2000E-8FGG1156I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

43200

Yes

1.89 V

9600

CMOS

804

518400

1.8

1.2/3.6,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1.71 V

1 mm

0.4 ns

9600 CLBS, 518400 Gates

Tin Silver Copper

Bottom

S-PBGA-B1156

3

2.6 mm

35 mm

No

e1

416 MHz

804

35 mm

XC6VHX380T-1FF1154C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

382464

Yes

1.05 V

CMOS

320

1

1,1.2/2.5 V

Grid Array

BGA1154,34X34,40

Field Programmable Gate Arrays

.95 V

1 mm

85 °C (185 °F)

5.08 ns

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1156

3.5 mm

35 mm

No

e0

1098 MHz

320

35 mm

XC7A100T-2FFG1156C

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

101440

Yes

1.05 V

7925

300

1

Grid Array

BGA1156,34X34,40

.95 V

1 mm

85 °C (185 °F)

1.05 ns

7925 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

4

3.1 mm

35 mm

e1

1286 MHz

30 s

300

245 °C (473 °F)

35 mm

XCKU11P-L1FFVA1156I

Xilinx

FPGA

Industrial

Ball

1156

BGA

Square

Plastic/Epoxy

653100

Yes

.742 V

37320

512

0.72

Grid Array

BGA1156,34X34,40

.698 V

1 mm

100 °C (212 °F)

37320 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

4

3.51 mm

35 mm

e1

30 s

512

245 °C (473 °F)

35 mm

XC7A25T-1FFG1156I

Xilinx

FPGA

Industrial

Ball

1156

BGA

Square

Plastic/Epoxy

23360

Yes

1.05 V

1825

HKMG

150

1

Grid Array

BGA1156,34X34,40

.95 V

1 mm

100 °C (212 °F)

1.27 ns

1825 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

4

3.1 mm

35 mm

e1

1098 MHz

30 s

150

245 °C (473 °F)

35 mm

XCV3200E-8CGG1156I

Xilinx

FPGA

Ball

1156

BGA

Square

Ceramic, Metal-Sealed Cofired

Yes

1.89 V

16224

CMOS

876096

1.8

Grid Array

1.71 V

1 mm

0.4 ns

16224 CLBS, 876096 Gates

Tin Silver Copper

Bottom

S-CBGA-B1156

3.11 mm

35 mm

No

e1

416 MHz

35 mm

XCZU9EG-3FFVB1156I

Xilinx

FPGA SOC

Ball

1156

BGA

Square

Plastic/Epoxy

599550

Yes

34260

0.9

Grid Array

1 mm

100 °C (212 °F)

34260 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

4

3.42 mm

35 mm

e1

3.42 mm

XC7A12T-3FFG1156E

Xilinx

FPGA

Other

Ball

1156

BGA

Square

Plastic/Epoxy

12800

Yes

1.05 V

1000

HKMG

150

1

Grid Array

BGA1156,34X34,40

.95 V

1 mm

100 °C (212 °F)

0.94 ns

1000 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

4

3.1 mm

35 mm

e1

1412 MHz

30 s

150

245 °C (473 °F)

35 mm

XC7A75T-3FFG1156I

Xilinx

FPGA

Industrial

Ball

1156

BGA

Square

Plastic/Epoxy

75520

Yes

1.05 V

5900

300

1

Grid Array

BGA1156,34X34,40

.95 V

1 mm

100 °C (212 °F)

0.94 ns

5900 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B1156

4

3.1 mm

35 mm

e1

1412 MHz

30 s

300

245 °C (473 °F)

35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.