144 Field Programmable Gate Arrays (FPGA) 1,421

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP4CE10E22C7N	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	10320	Yes	1.25 V	645		91		1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		91		20 mm
EP4CE22E22C6N	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	22320	Yes	1.25 V	1395		79		1.2		1.2,1.2/3.3,2.5 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		1395 CLBS	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.65 mm	20 mm	No		e3	472.5 MHz		79		20 mm
LFXP2-5E-5TN144I	Lattice Semiconductor	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS	100		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	435 MHz	30 s	100	260 °C (500 °F)	20 mm
EP3C16E144C8N	Intel	FPGA	Other	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	84		1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No		e3	472.5 MHz		84		20 mm
10M08SCE144A7G	Intel	FPGA	Automotive	Gull Wing	144	QFP	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250		3		3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	125 °C (257 °F)		500 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				250		20 mm
M2GL010-TQG144I	Microchip Technology	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm			e3		30 s		260 °C (500 °F)	20 mm
EP1C3T144I7N	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2910	Yes	1.575 V	291		104		1.5		1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	100 °C (212 °F)		291 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	320 MHz		104		20 mm
10M16SAE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320		3			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		2.85 V	.5 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				320		20 mm
10M40SAE144I7G	Intel	FPGA	Industrial	Gull Wing	144	QFP	Square	Plastic/Epoxy	40000	Yes	3.15 V	2500		500		3			Flatpack	HQFP144,.87SQ,20		2.85 V	.5 mm	100 °C (212 °F)		2500 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				500		20 mm
EP3C10E144I7N	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy	10320	Yes	1.25 V	10320	CMOS	94		1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm	100 °C (212 °F)		10320 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G144	3	1.6 mm	20 mm	No		e3	472.5 MHz		94		20 mm
LCMXO2-640UHC-4TG144I	Lattice Semiconductor	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	640	Yes	3.465 V			107		2.5	Tray	2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Operates at 3.3 V nominal supply	e3		30 s	107	260 °C (500 °F)	20 mm
10M50SAE144I7G	Intel	FPGA	Industrial	Gull Wing	144	QFP	Square	Plastic/Epoxy	50000	Yes	3.15 V	3125		500		3			Flatpack	HQFP144,.87SQ,20		2.85 V	.5 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				500		20 mm
10CL025YE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	1539				1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	100 °C (212 °F)		1539 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
10M50SCE144C8G	Intel	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	50000	Yes	3.15 V	3125		500		3		3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	85 °C (185 °F)		3125 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				500		20 mm
A3P1000-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
M2GL005-TQG144	Microchip Technology	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Quad	S-PQFP-G144	3	1.6 mm	20 mm					30 s		260 °C (500 °F)	20 mm
10CL006YE144C8G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	392				1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		392 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
10M02SCE144C7G	Intel	FPGA	Commercial Extended	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246		3		3/3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	85 °C (185 °F)		125 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				246		20 mm
EP2C5T144I8N	Intel	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4608	Yes	1.25 V	288	CMOS	89		1.2		1.2,1.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm			288 CLBS		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also requires 3.3 V supply	e3			81		20 mm
LCMXO2-640UHC-4TG144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	640	Yes	3.465 V			107		2.5	Tray	2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also Operates at 3.3 V nominal supply	e3		30 s	107	260 °C (500 °F)	20 mm
M2GL010-TQG144	Microchip Technology	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Quad	S-PQFP-G144	3	1.6 mm	20 mm					30 s		260 °C (500 °F)	20 mm
LCMXO2-1200ZE-1TG144C	Lattice Semiconductor	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	1280	Yes	1.26 V			107		1.2	Tray	1.2 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	133 MHz	30 s	107	260 °C (500 °F)	20 mm
10M25SAE144C8G	Intel	FPGA	Commercial Extended	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	25000	Yes	3.15 V	1563		360		3			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		2.85 V	.5 mm	85 °C (185 °F)		1563 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				360		20 mm
LCMXO2-1200HC-4TG144IR1	Lattice Semiconductor	FPGA		Gull Wing	144	QFP	Square	Plastic/Epoxy	1280	Yes	3.465 V		CMOS	108		2.5		2.5/3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm					Matte Tin	Quad	S-PQFP-G144	3			No		e3	133 MHz	30 s	108	260 °C (500 °F)
LFXP2-8E-5TN144I	Lattice Semiconductor	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	100		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	435 MHz	40 s	100	260 °C (500 °F)	20 mm
A3P1000-FG144M	Microchip Technology	FPGA	Military	Ball	144	BGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz	20 s	97	235 °C (455 °F)	13 mm
M1A3P1000-FG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz		97		13 mm
M2GL005-TQG144I	Microchip Technology	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm			e3		30 s		260 °C (500 °F)	20 mm
10M16SCE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320		3		3/3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				320		20 mm
A3P1000-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz	20 s		235 °C (455 °F)	13 mm
EP3C25E144C8NES	Intel	FPGA	Other	Gull Wing	144	LFQFP	Rectangular	Plastic/Epoxy		Yes	1.25 V	24624				1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G144		1.6 mm	20 mm	No		e3	472.5 MHz				20 mm
M1AGL250V5-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS	97	250000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
M2S010-TQG144I	Microchip Technology	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12084	Yes	1.26 V			84		1.2			Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	MATTE TIN	Quad	S-PQFP-G144	3	1.6 mm	20 mm					40 s	84	250 °C (482 °F)	20 mm
EP2C8T144I8N	Intel	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8256	Yes	1.25 V	516	CMOS	85		1.2		1.2,1.5/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.15 V	.5 mm			516 CLBS		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Also requires 3.3 V supply	e3	402.5 MHz		77		20 mm
XC3S200-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480	CMOS	97	200000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.61 ns	480 CLBS, 200000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	630 MHz	30 s	97	260 °C (500 °F)	20 mm
10CL006YE144I7G	Intel	FPGA	Industrial	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	392				1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	100 °C (212 °F)		392 CLBS	-40 °C (-40 °F)	Matte Tin - annealed	Quad	S-PQFP-G144	3	1.65 mm	20 mm			e3		30 s		260 °C (500 °F)	20 mm
10M50SAE144C8G	Intel	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	50000	Yes	3.15 V	3125		500		3			Flatpack	HQFP144,.87SQ,20		2.85 V	.5 mm	85 °C (185 °F)		3125 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				500		20 mm
10M16SCE144C8G	Intel	FPGA	Other	Gull Wing	144	QFP	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320		3		3/3.3 V	Flatpack	HQFP144,.87SQ,20	Field Programmable Gate Arrays	2.85 V	.5 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm	No	Also Operates at 3.3 V nominal supply				320		20 mm
10M25SAE144C8GES	Intel	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	25000	Yes	3.15 V	1563		101		3			Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20		2.85 V	.5 mm	85 °C (185 °F)		1563 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm						101		20 mm
EP1C6T144I7N	Intel	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5980	Yes	1.575 V	598		98		1.5		1.5,1.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.425 V	.5 mm	100 °C (212 °F)		598 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	320 MHz		98		20 mm
M1AGL600V2-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS	97	600000	1.2			Grid Array, Low Profile	BGA144,12X12,40		1.14 V	1 mm	100 °C (212 °F)		600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
M1A3P250-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS		250000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s		260 °C (500 °F)	13 mm
M1A3P1000-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
M2GL010-1TQG144I	Microchip Technology	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V					1.2	Tray		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.6 mm	20 mm					30 s		260 °C (500 °F)	20 mm
10CL010YE144C8G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	645				1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
LFXP2-8E-6TN144I	Lattice Semiconductor	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8000	Yes	1.26 V	1000	CMOS	100		1.2		1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	435 MHz	40 s	100	260 °C (500 °F)	20 mm
10CL025YE144C8G	Intel	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	1.25 V	1539				1.2			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		1539 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144		1.65 mm	20 mm								20 mm
10M04SAE144C8G	Intel	FPGA	Commercial Extended	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246		3			Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20		2.85 V	.5 mm	85 °C (185 °F)		250 CLBS	0 °C (32 °F)		Quad	S-PQFP-G144	3	1.65 mm	20 mm		Also Operates at 3.3 V nominal supply				246		20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.