Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
40000 |
Yes |
3.15 V |
2500 |
500 |
3 |
3/3.3 V |
Flatpack |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.85 V |
.5 mm |
85 °C (185 °F) |
2500 CLBS |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
Also Operates at 3.3 V nominal supply |
500 |
20 mm |
||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
Tray |
Flatpack, Low Profile, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
1536 CLBS, 60000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
350 MHz |
20 mm |
|||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2280 |
Yes |
3.465 V |
285 |
113 |
1.8 |
1.8/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
285 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
30 s |
113 |
260 °C (500 °F) |
20 mm |
|||||||||
Efinix |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
19728 |
Yes |
1.25 V |
SMIC |
97 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
1.15 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
97 |
20 mm |
||||||||||||||||||||
Intel |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
22320 |
Yes |
1.03 V |
1395 |
79 |
1 |
1,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
.97 V |
.5 mm |
85 °C (185 °F) |
1395 CLBS |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e0 |
362 MHz |
79 |
20 mm |
|||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
108 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.76 ns |
612 CLBS, 250000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
572 MHz |
30 s |
80 |
260 °C (500 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.26 V |
192 |
CMOS |
97 |
50000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.53 ns |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
725 MHz |
30 s |
97 |
260 °C (500 °F) |
20 mm |
|||||
|
Microchip Technology |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
1.2 |
Tray |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
20 mm |
||||||||||||||||||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
Tray |
Flatpack, Low Profile, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
1536 CLBS, 60000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
350 MHz |
20 mm |
|||||||||||||
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
2304 |
CMOS |
40000 |
3.3 |
Tray |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
2.2 ns |
2304 CLBS, 40000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
Maximum usable gates 50000 |
20 mm |
|||||||||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
1.25 V |
963 |
1.2 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
1.15 V |
.5 mm |
85 °C (185 °F) |
963 CLBS |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
20 mm |
|||||||||||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
Tray |
Flatpack, Low Profile, Fine Pitch |
1.425 V |
.5 mm |
100 °C (212 °F) |
1536 CLBS, 60000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
350 MHz |
20 mm |
|||||||||||||
Microchip Technology |
FPGA |
Industrial |
Ball |
144 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
3072 |
CMOS |
125000 |
1.5 |
Tray |
Grid Array, Low Profile |
1.425 V |
1 mm |
100 °C (212 °F) |
3072 CLBS, 125000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B144 |
3 |
1.55 mm |
13 mm |
No |
e0 |
350 MHz |
20 s |
235 °C (455 °F) |
13 mm |
||||||||||||
Intel |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2910 |
Yes |
1.575 V |
291 |
104 |
1.5 |
1.5,1.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 °C (185 °F) |
291 CLBS |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
275 MHz |
30 s |
104 |
220 °C (428 °F) |
20 mm |
|||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
4608 |
Yes |
1.25 V |
288 |
CMOS |
89 |
1.2 |
1.2,1.5/3.3,3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
288 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Also requires 3.3 V supply |
e3 |
500 MHz |
81 |
20 mm |
||||||||
Intel |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
6272 |
Yes |
1.25 V |
392 |
91 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
392 CLBS |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e0 |
472.5 MHz |
91 |
20 mm |
|||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1200 |
Yes |
3.465 V |
150 |
113 |
1.8 |
1.8/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
150 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
40 s |
113 |
260 °C (500 °F) |
20 mm |
|||||||||
|
Intel |
FPGA |
Industrial |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
6272 |
Yes |
1.03 V |
392 |
176 |
1 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP144,.87SQ,20 |
.97 V |
.5 mm |
100 °C (212 °F) |
392 CLBS |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
-40 to 125 °C range is available as extended industrial |
176 |
20 mm |
||||||||||||||||
|
Intel |
FPGA |
Industrial |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
10320 |
Yes |
1.03 V |
645 |
176 |
1 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP144,.87SQ,20 |
.97 V |
.5 mm |
100 °C (212 °F) |
645 CLBS |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
-40 to 125 °C range is available as extended industrial |
176 |
20 mm |
||||||||||||||||
|
Intel |
FPGA |
Commercial Extended |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
8000 |
Yes |
3.15 V |
500 |
250 |
3 |
3/3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.85 V |
.5 mm |
85 °C (185 °F) |
500 CLBS |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
No |
Also Operates at 3.3 V nominal supply |
250 |
20 mm |
|||||||||||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
Tray |
Flatpack, Low Profile, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
1536 CLBS, 60000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
350 MHz |
20 mm |
|||||||||||||
|
Lattice Semiconductor |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1200 |
Yes |
3.465 V |
150 |
113 |
1.8 |
1.8/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
100 °C (212 °F) |
150 CLBS |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
40 s |
113 |
260 °C (500 °F) |
20 mm |
|||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1200 |
Yes |
3.465 V |
150 |
113 |
1.8 |
1.8/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
150 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
40 s |
113 |
260 °C (500 °F) |
20 mm |
|||||||||
|
Intel |
FPGA |
Commercial Extended |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
4000 |
Yes |
3.15 V |
250 |
246 |
3 |
3/3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.85 V |
.5 mm |
85 °C (185 °F) |
250 CLBS |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
No |
Also Operates at 3.3 V nominal supply |
246 |
20 mm |
|||||||||||||
|
Intel |
FPGA |
Commercial Extended |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
16000 |
Yes |
3.15 V |
1000 |
320 |
3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP144,.87SQ,20 |
2.85 V |
.5 mm |
85 °C (185 °F) |
1000 CLBS |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
Also Operates at 3.3 V nominal supply |
320 |
20 mm |
|||||||||||||||
|
Microchip Technology |
FPGA |
Industrial |
Ball |
144 |
LBGA |
Square |
Plastic/Epoxy |
3072 |
Yes |
1.575 V |
CMOS |
97 |
125000 |
1.2 |
Grid Array, Low Profile |
BGA144,12X12,40 |
1.14 V |
1 mm |
100 °C (212 °F) |
125000 Gates |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.55 mm |
13 mm |
No |
e1 |
30 s |
97 |
260 °C (500 °F) |
13 mm |
||||||||||
Intel |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10320 |
Yes |
1.25 V |
10320 |
CMOS |
94 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.4 mm |
85 °C (185 °F) |
10320 CLBS |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e0 |
472.5 MHz |
94 |
20 mm |
|||||||||||
|
Intel |
FPGA |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
10320 |
Yes |
1.03 V |
645 |
91 |
1 |
1,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
.97 V |
.5 mm |
645 CLBS |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e3 |
362 MHz |
91 |
20 mm |
|||||||||||||
Intel |
FPGA |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
963 |
81 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
963 CLBS |
Tin Lead |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
No |
e0 |
472.5 MHz |
81 |
20 mm |
|||||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2112 |
Yes |
1.26 V |
111 |
1.2 |
Tray |
1.2 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
30 s |
111 |
260 °C (500 °F) |
20 mm |
||||||||||
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
384 |
Yes |
3.465 V |
384 |
CMOS |
100 |
1.8 |
1.8/2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.63 ns |
384 CLBS |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
375 MHz |
100 |
225 °C (437 °F) |
20 mm |
||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
384 |
Yes |
3.465 V |
384 |
CMOS |
100 |
1.8 |
1.8/2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.44 ns |
384 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
375 MHz |
40 s |
100 |
260 °C (500 °F) |
20 mm |
||||||
|
Microchip Technology |
FPGA |
Industrial |
Ball |
144 |
LBGA |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
CMOS |
97 |
1000000 |
1.2 |
Grid Array, Low Profile |
BGA144,12X12,40 |
1.14 V |
1 mm |
100 °C (212 °F) |
1000000 Gates |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.55 mm |
13 mm |
No |
e1 |
30 s |
97 |
260 °C (500 °F) |
13 mm |
||||||||||
|
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
972 |
Yes |
2.625 V |
216 |
92 |
30000 |
2.5 |
1.5/3.3,2.5 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
2.375 V |
.8 mm |
85 °C (185 °F) |
0.6 ns |
216 CLBS, 30000 Gates |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
Maximum usable gates 30000 |
e1 |
263 MHz |
30 s |
92 |
260 °C (500 °F) |
12 mm |
|||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
108 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.76 ns |
612 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
572 MHz |
30 s |
80 |
260 °C (500 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
108 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.76 ns |
612 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
572 MHz |
30 s |
80 |
260 °C (500 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1584 |
Yes |
1.26 V |
176 |
CMOS |
108 |
50000 |
1.2 |
1.2,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.71 ns |
176 CLBS, 50000 Gates |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
667 MHz |
101 |
20 mm |
|||||||
|
Microchip Technology |
FPGA |
Industrial |
Ball |
144 |
LBGA |
Square |
Plastic/Epoxy |
24576 |
Yes |
1.575 V |
24576 |
CMOS |
97 |
1000000 |
1.2 |
Tray |
1.5/3.3 V |
Grid Array, Low Profile |
BGA144,12X12,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 °C (185 °F) |
24576 CLBS, 1000000 Gates |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.55 mm |
13 mm |
No |
e1 |
350 MHz |
30 s |
97 |
260 °C (500 °F) |
13 mm |
|||||
|
Microchip Technology |
FPGA |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
3072 |
CMOS |
125000 |
1.5 |
Tray |
Flatpack, Low Profile, Fine Pitch |
1.425 V |
.5 mm |
85 °C (185 °F) |
3072 CLBS, 125000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
350 MHz |
20 mm |
|||||||||||||
|
Microchip Technology |
FPGA |
Other |
Ball |
144 |
LBGA |
Square |
Plastic/Epoxy |
3072 |
Yes |
1.575 V |
CMOS |
97 |
125000 |
1.2 |
Grid Array, Low Profile |
BGA144,12X12,40 |
1.14 V |
1 mm |
85 °C (185 °F) |
125000 Gates |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.55 mm |
13 mm |
No |
e1 |
30 s |
97 |
260 °C (500 °F) |
13 mm |
||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
963 |
81 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
963 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e3 |
472.5 MHz |
81 |
20 mm |
||||||||||
Intel |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
963 |
81 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 °C (185 °F) |
963 CLBS |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
1.65 mm |
20 mm |
No |
e0 |
472.5 MHz |
81 |
20 mm |
||||||||||||
|
Intel |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
15408 |
Yes |
1.03 V |
963 |
81 |
1 |
1,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
.97 V |
.5 mm |
85 °C (185 °F) |
963 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e3 |
362 MHz |
81 |
20 mm |
||||||||||
|
Intel |
FPGA |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
15408 |
Yes |
1.25 V |
963 |
81 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
963 CLBS |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
No |
e3 |
472.5 MHz |
81 |
20 mm |
|||||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
4320 |
Yes |
3.465 V |
114 |
2.5 |
Tray |
2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Also Operates at 3.3 V nominal supply |
e3 |
30 s |
114 |
260 °C (500 °F) |
20 mm |
|||||||||
|
Lattice Semiconductor |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
6864 |
Yes |
1.26 V |
114 |
1.2 |
Tray |
1.2 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
30 s |
114 |
260 °C (500 °F) |
20 mm |
|||||||||||
|
Lattice Semiconductor |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
384 |
Yes |
3.465 V |
384 |
CMOS |
100 |
1.8 |
1.8/2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.63 ns |
384 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
375 MHz |
40 s |
100 |
260 °C (500 °F) |
20 mm |
||||||
Microchip Technology |
FPGA |
Industrial |
Ball |
144 |
LBGA |
Square |
Plastic/Epoxy |
Yes |
1.575 V |
9216 |
CMOS |
400000 |
1.5 |
Tray |
Grid Array, Low Profile |
1.425 V |
1 mm |
100 °C (212 °F) |
9216 CLBS, 400000 Gates |
-40 °C (-40 °F) |
Tin Lead Silver |
Bottom |
S-PBGA-B144 |
3 |
1.55 mm |
13 mm |
No |
e0 |
13 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.