144 Field Programmable Gate Arrays (FPGA) 1,421

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2S100-6TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2700	Yes	2.625 V	600			96	100000	2.5		1.5/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.6 ns	600 CLBS, 100000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	263 MHz	30 s	92	260 °C (500 °F)	20 mm
XC2S15-5TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	432	Yes	2.625 V	96			90	15000	2.5		1.5/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	96 CLBS, 15000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 15000	e4	263 MHz		86		20 mm
XC2S30-5TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	972	Yes	2.625 V	216			96	30000	2.5		1.5/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)	0.7 ns	216 CLBS, 30000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	263 MHz		92		20 mm
XC2S50-5TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1728	Yes	2.625 V	384			176	50000	2.5		1.5/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	384 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 50000	e3	263 MHz	30 s	176	260 °C (500 °F)	20 mm
XC2S50-6TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1728	Yes	2.625 V	384			176	50000	2.5		1.5/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.6 ns	384 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 50000	e3	263 MHz	30 s	176	260 °C (500 °F)	20 mm
XC3S100E-4TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS		108	100000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	240 CLBS, 100000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	572 MHz	30 s	80	260 °C (500 °F)	20 mm
XC3S200-4TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480	CMOS		97	200000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.61 ns	480 CLBS, 200000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	630 MHz		97		20 mm
XC3S250E-4TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS		108	250000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	572 MHz		80		20 mm
XCS10XL-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	466	Yes	3.6 V	196	CMOS		112	3000	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.1 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAXIMUM usable gates 10000	e3	217 MHz	30 s	112	260 °C (500 °F)	20 mm
XCS20-3TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS		160	7000	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 20000	e0	125 MHz	30 s	160	225 °C (437 °F)	20 mm
XCS30XL-4TQG144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS		113	10000	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm		1.1 ns	576 CLBS, 10000 Gates		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 30000	e3	217 MHz	30 s	113	260 °C (500 °F)	20 mm
XCS30XL-5TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1368	Yes	3.6 V	576	CMOS		113	10000	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 30000	e3	250 MHz	30 s	113	260 °C (500 °F)	20 mm
XCV100-4CS144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS		94	108904	2.5		1.5/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)	0.8 ns	600 CLBS, 108904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	250 MHz	30 s	94	240 °C (464 °F)	12 mm
A3P1000-1FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P125-1FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P600L-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	13824	Yes	1.575 V	13824	CMOS		97	600000	1.2	Tray	1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		13824 CLBS, 600000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz		97		13 mm
AGL600V5-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS		97	600000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		600000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1		30 s	97	260 °C (500 °F)	13 mm
A3P060-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz	20 s		235 °C (455 °F)	13 mm
A3P060-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	1536	CMOS			60000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		1536 CLBS, 60000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P060-FGG144T	Microchip Technology	FPGA	Automotive	Ball	144	LBGA	Square	Plastic/Epoxy	1536	Yes	1.575 V	1536	CMOS	AEC-Q100	96	60000	1.5		1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		1536 CLBS, 60000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	96	260 °C (500 °F)	13 mm
A3P1000-1FG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz		97		13 mm
A3P1000-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P125-1FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz				13 mm
A3P125-2FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz				13 mm
A3P125-FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	3072	CMOS			125000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		3072 CLBS, 125000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P250-2FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A54SX08A-FTQG144	Microchip Technology	FPGA	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	768	Yes	2.75 V	768	CMOS		113	12000	2.5	Tray	2.5,3.3/5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.25 V	.5 mm	70 °C (158 °F)	1.7 ns	768 CLBS, 12000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	8000 typical gates available	e3	172 MHz		113		20 mm
AGL250V2-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS		97	250000	1.2			Grid Array, Low Profile	BGA144,12X12,40		1.14 V	1 mm	100 °C (212 °F)		250000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0		20 s	97	235 °C (455 °F)	13 mm
AGL600V5-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	13824	Yes	1.575 V		CMOS		97	600000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		600000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0			97		13 mm
APA075-TQG144I	Microchip Technology	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	3072	Yes	2.7 V		CMOS		107	75000	2.5		2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.3 V	.5 mm	85 °C (185 °F)		75000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	180 MHz	30 s	107	260 °C (500 °F)	20 mm
APA150-FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	2.7 V		CMOS		100	150000	2.5	Tray	2.5,2.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	2.3 V	1 mm	85 °C (185 °F)		150000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	180 MHz	30 s	100	260 °C (500 °F)	13 mm
M2GL005-1TQG144I	Microchip Technology	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Quad	S-PQFP-G144	3	1.6 mm	20 mm					30 s		260 °C (500 °F)	20 mm
TPC1240VE-144I	Texas Instruments	FPGA	Industrial	Gull Wing	144	QFP	Square	Plastic/Epoxy	684	Yes	5.5 V	684	CMOS		104	4000	5		5 V	Flatpack	QFP144,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)		684 CLBS, 4000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G144		4.07 mm	28 mm	No			55 MHz		104		28 mm
M38510/60608BNX	Texas Instruments	FPGA	Military	Pin/Peg	144	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS			8000	5			Grid Array			4.5 V		125 °C (257 °F)		8000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P144				No
TPC1240VE-144C1	Texas Instruments	FPGA	Commercial	Gull Wing	144	QFP	Square	Plastic/Epoxy	684	Yes	5.25 V	684	CMOS		104	4000	5		5 V	Flatpack	QFP144,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)		684 CLBS, 4000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144		4.07 mm	28 mm	No			75 MHz		104		28 mm
TPC1240VE-144C	Texas Instruments	FPGA	Commercial	Gull Wing	144	QFP	Square	Plastic/Epoxy	684	Yes	5.25 V	684	CMOS		104	4000	5		5 V	Flatpack	QFP144,1.2SQ	Field Programmable Gate Arrays	4.75 V	.65 mm	70 °C (158 °F)	14 ns	684 CLBS, 4000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144		4.07 mm	28 mm	No	MAX 104 I/OS; 565 flip-flops		66 MHz		104		28 mm
TPC1240VE-144I1	Texas Instruments	FPGA	Industrial	Gull Wing	144	QFP	Square	Plastic/Epoxy	684	Yes	5.5 V	684	CMOS		104	4000	5		5 V	Flatpack	QFP144,1.2SQ	Field Programmable Gate Arrays	4.5 V	.65 mm	85 °C (185 °F)		684 CLBS, 4000 Gates	-40 °C (-40 °F)		Quad	S-PQFP-G144		4.07 mm	28 mm	No			66 MHz		104		28 mm
M38510/60611BNX	Texas Instruments	FPGA	Military	Pin/Peg	144	PGA	Square	Ceramic, Metal-Sealed Cofired		No	5.5 V		CMOS			11000	5			Grid Array			4.5 V		125 °C (257 °F)		11000 Gates	-55 °C (-67 °F)		Perpendicular	S-CPGA-P144				No
XC2S600E-7TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8			Flatpack, Low Profile, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 150000	e0	357 MHz				20 mm
XC5206-5TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	196	CMOS			6000	5			Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	4.6 ns	196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAX available 10000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	20 mm
XC5206L-5TQG144C	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS			6000	3.3			Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Typical gates = 6000-10000	e3		30 s		260 °C (500 °F)	20 mm
XC4013XL-1HT144I	Xilinx	FPGA		Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		192	10000	3.3		3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm		1.3 ns	576 CLBS, 10000 Gates		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 13000 Logic gates	e0	200 MHz		192		20 mm
XC2S200E-7TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.89 V	864				52000	1.8			Flatpack, Low Profile, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 150000	e0	357 MHz				20 mm
XC4006E-4TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	256	Yes	5.5 V	256	CMOS		128	4000	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm		2.7 ns	256 CLBS, 4000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 6000 Logic gates	e0	111 MHz	30 s	128	225 °C (437 °F)	20 mm
XC4010XL-1TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm		1.3 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 10000 Logic gates	e0	200 MHz	30 s	160	225 °C (437 °F)	20 mm
XC3S100E-4TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS		108	100000	1.2		1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	240 CLBS, 100000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	572 MHz		80		20 mm
XC3142-3TQ144C	Xilinx	FPGA	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	144	Yes	5.25 V	144	CMOS		96	3000	5		5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	70 °C (158 °F)	2.7 ns	144 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700	e0	270 MHz	30 s	96	225 °C (437 °F)	20 mm
XCV50-4CS144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	1728	Yes	2.625 V	384	CMOS		94	57906	2.5		1.2/3.6,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	2.375 V	.8 mm		0.8 ns	384 CLBS, 57906 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	250 MHz	30 s	94	240 °C (464 °F)	12 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.