Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
224 |
CMOS |
3500 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
2.2 ns |
224 CLBS, 3500 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Max usable 4500 Logic gates |
e3 |
323 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
20 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
196 |
CMOS |
3000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAXIMUM usable gates 10000 |
e3 |
125 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
576 |
CMOS |
10000 |
3.3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
3 V |
.5 mm |
1.6 ns |
576 CLBS, 10000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
Max usable 13000 Logic gates |
e3 |
166 MHz |
20 mm |
||||||||||||||||
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
2700 |
Yes |
1.89 V |
600 |
CMOS |
94 |
32400 |
1.8 |
1.2/3.6,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.71 V |
.8 mm |
85 °C (185 °F) |
0.42 ns |
600 CLBS, 32400 Gates |
0 °C (32 °F) |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
400 MHz |
30 s |
94 |
240 °C (464 °F) |
12 mm |
||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
108 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.76 ns |
612 CLBS, 250000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
572 MHz |
30 s |
80 |
225 °C (437 °F) |
20 mm |
||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
384 |
CMOS |
57906 |
2.5 |
Flatpack, Low Profile, Fine Pitch |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.6 ns |
384 CLBS, 57906 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
333 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
20 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
2.625 V |
384 |
CMOS |
98 |
57906 |
2.5 |
1.2/3.6,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.8 ns |
384 CLBS, 57906 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
250 MHz |
30 s |
98 |
225 °C (437 °F) |
20 mm |
||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
20 mm |
|||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
20 mm |
||||||||||||||||
Xilinx |
FPGA |
Industrial |
G |
144 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1536 |
93000 |
1.8 |
Flatpack, Fine Pitch |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.47 ns |
1536 CLBS, 93000 Gates |
-40 °C (-40 °F) |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
Maximum usable gates = 300000 |
357 MHz |
20 mm |
|||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
2816 |
CMOS |
1400000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
4.88 ns |
2816 CLBS, 1400000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
667 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
448 |
CMOS |
200000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
4.88 ns |
448 CLBS, 200000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
667 MHz |
20 mm |
|||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
196 |
CMOS |
6000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
3 ns |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAX available 10000 Logic gates |
e3 |
83 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2700 |
Yes |
2.625 V |
600 |
CMOS |
98 |
108904 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 °C (185 °F) |
0.8 ns |
600 CLBS, 108904 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
250 MHz |
30 s |
98 |
225 °C (437 °F) |
20 mm |
||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
576 |
CMOS |
10000 |
3.3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
Max usable 13000 Logic gates |
e3 |
166 MHz |
20 mm |
|||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
224 |
Yes |
5.5 V |
224 |
CMOS |
120 |
3500 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
2.2 ns |
224 CLBS, 3500 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 4500 Logic gates |
e0 |
323 MHz |
30 s |
120 |
225 °C (437 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
1152 |
Yes |
1.575 V |
128 |
CMOS |
92 |
80000 |
1.5 |
1.5,1.5/3.3,3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.425 V |
.8 mm |
85 °C (185 °F) |
0.35 ns |
128 CLBS, 80000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
820 MHz |
30 s |
92 |
240 °C (464 °F) |
12 mm |
||||||
|
Xilinx |
FPGA |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
576 |
Yes |
1.575 V |
64 |
CMOS |
88 |
40000 |
1.5 |
1.5,1.5/3.3,3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.425 V |
.8 mm |
0.44 ns |
64 CLBS, 40000 Gates |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
650 MHz |
30 s |
88 |
260 °C (500 °F) |
12 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
1472 |
CMOS |
700000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
4.36 ns |
1472 CLBS, 700000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
770 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.89 V |
384 |
CMOS |
94 |
20736 |
1.8 |
1.2/3.6,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.71 V |
.8 mm |
85 °C (185 °F) |
0.47 ns |
384 CLBS, 20736 Gates |
0 °C (32 °F) |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
357 MHz |
30 s |
94 |
240 °C (464 °F) |
12 mm |
||||||
Xilinx |
FPGA |
Commercial Extended |
G |
144 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
864 |
52000 |
1.8 |
Flatpack, Fine Pitch |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.47 ns |
864 CLBS, 52000 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
Maximum usable gates = 150000 |
357 MHz |
20 mm |
|||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
324 |
CMOS |
10000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
4.6 ns |
324 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAX available 16000 Logic gates |
e3 |
83 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
1368 |
Yes |
3.6 V |
576 |
CMOS |
113 |
10000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 13000 Logic gates |
e0 |
217 MHz |
113 |
20 mm |
|||||||
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
1728 |
Yes |
2.625 V |
384 |
CMOS |
94 |
57906 |
2.5 |
1.2/3.6,2.5 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
2.375 V |
.8 mm |
85 °C (185 °F) |
0.6 ns |
384 CLBS, 57906 Gates |
0 °C (32 °F) |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
333 MHz |
30 s |
94 |
240 °C (464 °F) |
12 mm |
||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
784 |
CMOS |
13000 |
3.3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
3 V |
.5 mm |
1.5 ns |
784 CLBS, 13000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
Max usable 20000 Logic gates |
e3 |
179 MHz |
20 mm |
||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
64 |
CMOS |
2000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
64 CLBS, 2000 Gates |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
Typical gates = 2000-3000 |
20 mm |
|||||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
432 |
Yes |
2.625 V |
96 |
90 |
15000 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 °C (212 °F) |
0.7 ns |
96 CLBS, 15000 Gates |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
263 MHz |
86 |
20 mm |
|||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2160 |
Yes |
1.26 V |
240 |
CMOS |
108 |
100000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.66 ns |
240 CLBS, 100000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
657 MHz |
80 |
20 mm |
|||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.26 V |
192 |
CMOS |
97 |
50000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.53 ns |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
725 MHz |
97 |
20 mm |
|||||||
|
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
384 |
CMOS |
57906 |
2.5 |
Grid Array, Thin Profile, Fine Pitch |
2.375 V |
.8 mm |
85 °C (185 °F) |
0.8 ns |
384 CLBS, 57906 Gates |
0 °C (32 °F) |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
250 MHz |
30 s |
260 °C (500 °F) |
12 mm |
|||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
224 |
13000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Typical gates = 13000-40000 |
e0 |
217 MHz |
224 |
20 mm |
|||||||
|
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
432 |
Yes |
2.625 V |
96 |
CMOS |
90 |
15000 |
2.5 |
1.5/3.3,2.5 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
2.375 V |
.8 mm |
85 °C (185 °F) |
0.6 ns |
96 CLBS, 15000 Gates |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
Maximum usable gates 15000 |
e1 |
263 MHz |
30 s |
86 |
260 °C (500 °F) |
12 mm |
||||
Xilinx |
FPGA |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
784 |
Yes |
3.6 V |
784 |
CMOS |
224 |
13000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.6 ns |
784 CLBS, 13000 Gates |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 20000 Logic gates |
e0 |
166 MHz |
224 |
20 mm |
||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
QFP |
Square |
Plastic |
1728 |
Yes |
CMOS |
102 |
1.2/3.6,1.8 V |
Flatpack |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
.5 mm |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
No |
e0 |
357 MHz |
30 s |
98 |
225 °C (437 °F) |
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|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
8064 |
Yes |
1.26 V |
896 |
CMOS |
97 |
400000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.53 ns |
896 CLBS, 400000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
725 MHz |
97 |
20 mm |
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|
Xilinx |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
3840 |
Yes |
1.05 V |
300 |
CMOS |
100 |
1 |
1,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
.95 V |
.5 mm |
100 °C (212 °F) |
0.46 ns |
300 CLBS |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
100 |
20 mm |
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|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
120 |
CMOS |
4000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
4.6 ns |
120 CLBS, 4000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAX available 6000 Logic gates |
e3 |
83 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2160 |
Yes |
1.26 V |
240 |
CMOS |
108 |
100000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.76 ns |
240 CLBS, 100000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
572 MHz |
30 s |
80 |
260 °C (500 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
324 |
CMOS |
10000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.5 V |
.5 mm |
3.8 ns |
324 CLBS, 10000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Typical gates = 10000-16000 |
e3 |
83 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
224 |
CMOS |
3500 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
3.3 ns |
224 CLBS, 3500 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Max usable 4500 Logic gates |
e3 |
227 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
864 |
52000 |
1.8 |
Flatpack, Low Profile, Fine Pitch |
1.71 V |
.5 mm |
0.47 ns |
864 CLBS, 52000 Gates |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates = 150000 |
e0 |
357 MHz |
20 mm |
|||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
20 mm |
||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
120 |
Yes |
5.25 V |
120 |
CMOS |
124 |
4000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
3 ns |
120 CLBS, 4000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAX available 6000 Logic gates |
e0 |
83 MHz |
30 s |
124 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
10476 |
Yes |
1.26 V |
1164 |
CMOS |
500000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
100 °C (212 °F) |
4.88 ns |
1164 CLBS, 500000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
572 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
20 mm |
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Xilinx |
FPGA |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
3456 |
Yes |
1.575 V |
384 |
CMOS |
92 |
250000 |
1.5 |
1.5,1.5/3.3,3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.425 V |
.8 mm |
0.39 ns |
384 CLBS, 250000 Gates |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
750 MHz |
30 s |
92 |
240 °C (464 °F) |
12 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.