144 Field Programmable Gate Arrays (FPGA) 1,421

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2S50E-7TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS	182	23000	1.8	1.2/3.6,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.42 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 50000	e3	400 MHz	30 s	182	260 °C (500 °F)	20 mm
XCV300-6TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Flatpack, Low Profile, Fine Pitch			2.375 V	.5 mm		0.4 ns	1536 CLBS, 322970 Gates		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0					20 mm
XCV300-6TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Flatpack, Low Profile, Fine Pitch			2.375 V	.5 mm	85 °C (185 °F)	0.4 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3					20 mm
XCV200E-8CSG144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	1176	CMOS	94	63504	1.8	1.2/3.6,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.71 V	.8 mm		0.4 ns	1176 CLBS, 63504 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	416 MHz	30 s	94	260 °C (500 °F)	12 mm
XCS20XL-4TQG144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS		7000	3.3		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	125 °C (257 °F)	1.1 ns	400 CLBS, 7000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 20000	e3	217 MHz	30 s		260 °C (500 °F)	20 mm
XC3S1500-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	192			50000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		192 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3					20 mm
XC2S150E-6TGGQGG144C	Xilinx	FPGA	Commercial Extended	G	144	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)		Quad	S-PQFP-G144		1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz				20 mm
XC3S200AN-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	448	CMOS		200000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)	4.88 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	667 MHz	30 s		260 °C (500 °F)	20 mm
XCS20-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	400	CMOS		7000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 20000	e3	166 MHz	30 s		260 °C (500 °F)	20 mm
XC4006E-3TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	256	Yes	5.25 V	256	CMOS	128	4000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2 ns	256 CLBS, 4000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 6000 Logic gates	e0	125 MHz	30 s	128	225 °C (437 °F)	20 mm
XC2S30-5CS144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	972	Yes	2.625 V	216		96	30000	2.5	1.5/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	2.375 V	.8 mm	100 °C (212 °F)	0.7 ns	216 CLBS, 30000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	263 MHz	30 s	92	240 °C (464 °F)	12 mm
XC3042A-6TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS		2000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	4.1 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm		Max usable 3000 Logic gates	e3	135 MHz	30 s		260 °C (500 °F)	20 mm
XC4005E-4TQG144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.5 V	196	CMOS		3000	5		Flatpack, Low Profile, Fine Pitch			4.5 V	.5 mm		2.7 ns	196 CLBS, 3000 Gates		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 5000 Logic gates	e3	111 MHz	30 s		260 °C (500 °F)	20 mm
XC5206L-3TQ144C	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS		6000	3.3		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Typical gates = 6000-10000	e0					20 mm
XC3064L-8TQ144I	Xilinx	FPGA	Commercial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	224	Yes	3.6 V	224	CMOS	120	3500	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	70 °C (158 °F)	6.7 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 4500 Logic gates	e0	80 MHz	30 s	120	225 °C (437 °F)	20 mm
XC5206L-5TQ144C	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS		6000	3.3		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Typical gates = 6000-10000	e0					20 mm
XCS30XL-3TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	196	10000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)		576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	30000 equivalent gates available	e0		30 s	196	225 °C (437 °F)	20 mm
XC4020XL-1HTG144C	Xilinx	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	3.6 V	784	CMOS		13000	3.3		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.3 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No	Max usable 20000 Logic gates	e3	200 MHz				20 mm
XC2V80-6CS144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS	92	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm		0.35 ns	128 CLBS, 80000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	820 MHz	30 s	92	240 °C (464 °F)	12 mm
XC2V250-5CSG144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS	92	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm	85 °C (185 °F)	0.39 ns	384 CLBS, 250000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	750 MHz	30 s	92	260 °C (500 °F)	12 mm
XC3S250E-5TQ144CS1	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	108	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.66 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	657 MHz		80		20 mm
XC3190A-1TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	320	CMOS		5000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.75 ns	320 CLBS, 5000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm		Max usable 6000 Logic gates	e3	323 MHz	30 s		260 °C (500 °F)	20 mm
XC7S25-L1TQGA144I	Xilinx	FPGA		Ball	144	BGA	Square	Plastic/Epoxy		Yes	.98 V	1825				.95		Grid Array			.92 V			1.27 ns	1825 CLBS			Bottom	S-PBGA-B144
XS2S50-5-TQ144C	Xilinx	FPGA		Gull Wing	144	QFP	Square	Plastic/Epoxy	1728	Yes			CMOS	176			1.5/3.3,2.5 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays		.5 mm	85 °C (185 °F)	0.7 ns		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3		20 mm	No		e0		30 s	176	225 °C (437 °F)	20 mm
XC4305-4TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes			CMOS			5		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G144		1.6 mm	20 mm	No							20 mm
XC3164A-09TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	120	3500	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.5 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 4500 Logic gates	e0	370 MHz	30 s	120	225 °C (437 °F)	20 mm
XCV50-5TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1728	Yes	2.625 V	384	CMOS	98	57906	2.5	1.2/3.6,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.7 ns	384 CLBS, 57906 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	294 MHz	30 s	98	225 °C (437 °F)	20 mm
XC5206-6TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	784	Yes	5.25 V	196	CMOS	117	6000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	5.6 ns	196 CLBS, 6000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAX available 10000 Logic gates	e0	83 MHz	30 s	117	225 °C (437 °F)	20 mm
XC3S250E-5TQG144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	612			250000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm		4.34 ns	612 CLBS, 250000 Gates		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm			e3		30 s		260 °C (500 °F)	20 mm
XC2V80-5CS144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS	92	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm		0.39 ns	128 CLBS, 80000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	750 MHz	30 s	92	240 °C (464 °F)	12 mm
XC2V40-6CS144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	576	Yes	1.575 V	64	CMOS	88	40000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm	85 °C (185 °F)	0.35 ns	64 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	820 MHz	30 s	88	240 °C (464 °F)	12 mm
XC2V250-4CS144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS	92	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm		0.44 ns	384 CLBS, 250000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	650 MHz	30 s	92	240 °C (464 °F)	12 mm
XC3064A-6TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	224	Yes	5.25 V	224	CMOS	120	3500	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	4.1 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 4500 Logic gates	e0	135 MHz	30 s	120	225 °C (437 °F)	20 mm
XC4020XL-09HT144I	Xilinx	FPGA		Gull Wing	144	HLFQFP	Square	Plastic/Epoxy	784	Yes			CMOS	224		3.3	3.3 V	Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch	HQFP144,.87SQ,20	Field Programmable Gate Arrays		.5 mm						Quad	S-PQFP-G144				No			217 MHz		224
XC3S50AN-4TQ144I4100	Xilinx	FPGA		Gull Wing	144	QFP	Square	Plastic/Epoxy	1584	Yes				108			1.2,1.2/3.3,3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays		.5 mm					Nickel Palladium Gold	Quad	S-PQFP-G144	3			No		e4	667 MHz		101
XC6SLX4-N3TQG144I	Xilinx	FPGA	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	300				1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)	0.26 ns	300 CLBS	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm			e3		30 s		260 °C (500 °F)	20 mm
XCV100-5CS144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS	94	108904	2.5	1.5/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	2.375 V	.8 mm		0.7 ns	600 CLBS, 108904 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	294 MHz	30 s	94	240 °C (464 °F)	12 mm
XC3S250E-5TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	108	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.66 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	657 MHz		80		20 mm
XS2S15-5-CS144C	Xilinx	FPGA		Ball	144	FBGA	Square	Plastic/Epoxy	432	Yes			CMOS	86			1.5/3.3,2.5 V	Grid Array, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)	0.7 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3		12 mm	No		e0		30 s	86	240 °C (464 °F)	12 mm
XC2S100-5TQG144Q	Xilinx	FPGA	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	2.625 V	600			100000	2.5		Flatpack, Low Profile, Fine Pitch			2.375 V	.5 mm	125 °C (257 °F)		600 CLBS, 100000 Gates	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3		30 s		260 °C (500 °F)	20 mm
XC2S100E-7TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	202	37000	1.8	1.2/3.6,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 37000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 100000	e3	400 MHz	30 s	202	260 °C (500 °F)	20 mm
XC4006E-4TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	256	Yes	5.25 V	256	CMOS	128	4000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2.7 ns	256 CLBS, 4000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 6000 Logic gates	e0	111 MHz	30 s	128	225 °C (437 °F)	20 mm
XCS30XL-3TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	576			10000	3.3		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	30000 equivalent gates available	e3		30 s		260 °C (500 °F)	20 mm
XC3S1400AN-5TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	2816	CMOS		1400000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)	4.36 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	770 MHz				20 mm
XC3342A-6VQ144C	Xilinx	FPGA		Gull Wing	144	QFP	Rectangular	Plastic/Epoxy		Yes			CMOS			5		Flatpack										Quad	R-PQFP-G144				No
XCV100E-7CSG144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	94	32400	1.8	1.2/3.6,1.8 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.71 V	.8 mm	85 °C (185 °F)	0.42 ns	600 CLBS, 32400 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	400 MHz	30 s	94	260 °C (500 °F)	12 mm
XC3342A-3TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes			CMOS			5		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G144		1.6 mm	20 mm	No							20 mm
XCS30XL-3TQG144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	576			10000	3.3		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm			576 CLBS, 10000 Gates		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3					20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.