144 Field Programmable Gate Arrays (FPGA) 1,421

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XCS30XL-4TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

576

Yes

3.6 V

576

CMOS

196

10000

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

1.1 ns

576 CLBS, 10000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Maximum usable gates 30000

e0

217 MHz

30 s

196

225 °C (437 °F)

20 mm

XC2S30-6TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

972

Yes

2.625 V

216

92

30000

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.6 ns

216 CLBS, 30000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Maximum usable gates 30000

e3

263 MHz

30 s

92

260 °C (500 °F)

20 mm

XCV100-5TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

2.625 V

600

CMOS

108904

2.5

Flatpack, Low Profile, Fine Pitch

2.375 V

.5 mm

85 °C (185 °F)

0.7 ns

600 CLBS, 108904 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

294 MHz

30 s

260 °C (500 °F)

20 mm

XC3090L-8TQ144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

320

Yes

3.6 V

320

CMOS

122

5000

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

6.7 ns

320 CLBS, 5000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Max usable 6000 Logic gates

e0

80 MHz

30 s

122

225 °C (437 °F)

20 mm

XC2S15-5TQG144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

432

Yes

2.625 V

96

86

15000

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0.7 ns

96 CLBS, 15000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

263 MHz

30 s

86

260 °C (500 °F)

20 mm

XC4006E-2TQG144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

5.5 V

256

CMOS

4000

5

Flatpack, Low Profile, Fine Pitch

4.5 V

.5 mm

1.6 ns

256 CLBS, 4000 Gates

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Max usable 6000 Logic gates

e3

125 MHz

30 s

260 °C (500 °F)

20 mm

XCV100-4TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2700

Yes

2.625 V

600

CMOS

98

108904

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

0.8 ns

600 CLBS, 108904 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

250 MHz

30 s

98

225 °C (437 °F)

20 mm

XC3S100E-5TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2160

Yes

1.26 V

240

CMOS

108

100000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.66 ns

240 CLBS, 100000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

657 MHz

80

20 mm

XC3S1000-4TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Flatpack, Low Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

192 CLBS, 50000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

20 mm

XC5402-4TQ144C

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

CMOS

5

Flatpack, Low Profile, Fine Pitch

.5 mm

Quad

S-PQFP-G144

1.6 mm

20 mm

No

20 mm

XCS20XL-3TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

400

20000

3.3

Flatpack, Low Profile, Fine Pitch

3 V

.5 mm

1.1 ns

400 CLBS, 20000 Gates

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

179 MHz

20 mm

XC4013XL-3HT144C

Xilinx

FPGA

Other

Gull Wing

144

HLFQFP

Square

Plastic/Epoxy

576

Yes

3.6 V

576

CMOS

192

10000

3.3

3.3 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HQFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.6 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Max usable 13000 Logic gates

e0

166 MHz

192

20 mm

XC7S25-2TQGA144C

Xilinx

FPGA

Other

Ball

144

BGA

Square

Plastic/Epoxy

Yes

1.05 V

1825

1

Grid Array

.95 V

85 °C (185 °F)

1.05 ns

1825 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B144

XC5206-4TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

784

Yes

5.25 V

196

CMOS

117

6000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

4.75 V

.5 mm

85 °C (185 °F)

3.8 ns

196 CLBS, 6000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

MAX available 10000 Logic gates

e0

83 MHz

30 s

117

225 °C (437 °F)

20 mm

XC5202L-4TQ144C

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

64

CMOS

2000

3.3

Flatpack, Low Profile, Fine Pitch

3 V

.5 mm

64 CLBS, 2000 Gates

Quad

S-PQFP-G144

1.6 mm

20 mm

No

Typical gates = 2000-3000

20 mm

XCV100E-8CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

2700

Yes

1.89 V

600

CMOS

94

32400

1.8

1.2/3.6,1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.71 V

.8 mm

85 °C (185 °F)

0.4 ns

600 CLBS, 32400 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

416 MHz

30 s

94

240 °C (464 °F)

12 mm

XC3S50AN-4TQ144C4100

Xilinx

FPGA

Gull Wing

144

QFP

Square

Plastic/Epoxy

1584

Yes

108

1.2,1.2/3.3,3.3 V

Flatpack

QFP144,.87SQ,20

Field Programmable Gate Arrays

.5 mm

Nickel Palladium Gold

Quad

S-PQFP-G144

3

No

e4

667 MHz

101

XC3342L-8TQ144C

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

.5 mm

Quad

S-PQFP-G144

1.6 mm

20 mm

No

20 mm

XCS20XL-4CSG144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

Yes

3.6 V

400

7000

3.3

Grid Array, Thin Profile, Fine Pitch

3 V

.8 mm

85 °C (185 °F)

1.1 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

Maximum usable gates 20000

e1

217 MHz

30 s

260 °C (500 °F)

12 mm

XC3342L-8VQ144I

Xilinx

FPGA

Gull Wing

144

QFP

Rectangular

Plastic/Epoxy

Yes

CMOS

3.3

Flatpack

Quad

R-PQFP-G144

No

XC3S1400AN-4TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.26 V

2816

CMOS

1400000

1.2

Flatpack, Low Profile, Fine Pitch

1.14 V

.5 mm

4.88 ns

2816 CLBS, 1400000 Gates

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

667 MHz

20 mm

XC3190A-09TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

5.25 V

320

CMOS

5000

5

Flatpack, Low Profile, Fine Pitch

4.75 V

.5 mm

85 °C (185 °F)

1.5 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

Max usable 6000 Logic gates

e3

370 MHz

30 s

260 °C (500 °F)

20 mm

XC2V40-6CSG144I

Xilinx

FPGA

Ball

144

TFBGA

Square

Plastic/Epoxy

576

Yes

1.575 V

64

CMOS

88

40000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

0.35 ns

64 CLBS, 40000 Gates

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

820 MHz

30 s

88

260 °C (500 °F)

12 mm

XC3090A-6TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

320

Yes

5.25 V

320

CMOS

122

5000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

4.75 V

.5 mm

85 °C (185 °F)

4.1 ns

320 CLBS, 5000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Max usable 6000 Logic gates

e0

135 MHz

30 s

122

225 °C (437 °F)

20 mm

XC3064A-7TQ144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

224

Yes

5.5 V

224

CMOS

120

3500

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

4.5 V

.5 mm

85 °C (185 °F)

5.1 ns

224 CLBS, 3500 Gates

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Max usable 4500 Logic gates

e0

113 MHz

30 s

120

225 °C (437 °F)

20 mm

XCV300-4TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

2.625 V

1536

CMOS

322970

2.5

Flatpack, Low Profile, Fine Pitch

2.375 V

.5 mm

85 °C (185 °F)

0.6 ns

1536 CLBS, 322970 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

20 mm

XC2S200E-6TGGQGG144I

Xilinx

FPGA

Industrial

G

144

FQFP

Square

Plastic/Epoxy

Yes

1.89 V

864

52000

1.8

Flatpack, Fine Pitch

1.71 V

.5 mm

85 °C (185 °F)

0.47 ns

864 CLBS, 52000 Gates

-40 °C (-40 °F)

Quad

S-PQFP-G144

1.6 mm

20 mm

No

Maximum usable gates = 150000

357 MHz

20 mm

XC3S1000-5TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Flatpack, Low Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

192 CLBS, 50000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

30 s

260 °C (500 °F)

20 mm

XC3S50A-5TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

1584

Yes

1.26 V

176

CMOS

108

50000

1.2

1.2,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.62 ns

176 CLBS, 50000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

770 MHz

30 s

101

260 °C (500 °F)

20 mm

XS2S15-5-CS144I

Xilinx

FPGA

Ball

144

FBGA

Square

Plastic/Epoxy

432

Yes

CMOS

86

1.5/3.3,2.5 V

Grid Array, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

.8 mm

100 °C (212 °F)

0.7 ns

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B144

3

12 mm

No

e0

30 s

86

240 °C (464 °F)

12 mm

XC4020XL-2HT144I

Xilinx

FPGA

Gull Wing

144

HLFQFP

Square

Plastic/Epoxy

784

Yes

3.6 V

784

CMOS

224

13000

3.3

3.3 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HQFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

1.5 ns

784 CLBS, 13000 Gates

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Max usable 20000 Logic gates

e0

179 MHz

224

20 mm

XCV50-6CS144I

Xilinx

FPGA

Ball

144

TFBGA

Square

Plastic/Epoxy

1728

Yes

2.625 V

384

CMOS

94

57906

2.5

1.2/3.6,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

2.375 V

.8 mm

0.6 ns

384 CLBS, 57906 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

333 MHz

30 s

94

240 °C (464 °F)

12 mm

XCV100-6CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

2700

Yes

2.625 V

600

CMOS

94

108904

2.5

1.5/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

2.375 V

.8 mm

85 °C (185 °F)

0.6 ns

600 CLBS, 108904 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

333 MHz

30 s

94

240 °C (464 °F)

12 mm

XC5202-5TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

64

Yes

5.5 V

64

CMOS

84

2000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

4.5 V

.5 mm

4.6 ns

64 CLBS, 2000 Gates

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

MAX available 3000 Logic gates

e0

83 MHz

30 s

84

225 °C (437 °F)

20 mm

XC2V40-4CS144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

576

Yes

1.575 V

64

CMOS

88

40000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

85 °C (185 °F)

0.44 ns

64 CLBS, 40000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

650 MHz

30 s

88

240 °C (464 °F)

12 mm

XC6SLX9-3NTQG144C

Xilinx

FPGA

Other

Gull Wing

144

HLFQFP

Square

Plastic/Epoxy

Yes

1.26 V

1.2

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

806 MHz

20 mm

XCS20XL-4TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

400

Yes

3.6 V

400

CMOS

160

7000

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.1 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Maximum usable gates 20000

e0

217 MHz

30 s

160

225 °C (437 °F)

20 mm

XC4013XL-2HTG144C

Xilinx

FPGA

Other

Gull Wing

144

HLFQFP

Square

Plastic/Epoxy

Yes

3.6 V

576

CMOS

10000

3.3

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

1.5 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

1.6 mm

20 mm

No

Max usable 13000 Logic gates

e3

179 MHz

20 mm

XCS10XL-5TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

466

Yes

3.6 V

196

CMOS

112

3000

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

MAXIMUM usable gates 10000

e3

250 MHz

30 s

112

260 °C (500 °F)

20 mm

XCS50E-6TQ144C

Xilinx

FPGA

Other

Gull Wing

144

QFP

Square

Plastic/Epoxy

1728

Yes

1.89 V

CMOS

182

1.8

1.8,2.5,3.3 V

Flatpack

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.47 ns

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

20 mm

No

e0

357 MHz

30 s

182

225 °C (437 °F)

20 mm

XC7S15-1TQGA144C

Xilinx

FPGA

Other

Ball

144

BGA

Square

Plastic/Epoxy

Yes

1.05 V

1000

1

Grid Array

.95 V

85 °C (185 °F)

1.27 ns

1000 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B144

XC3190A-4TQG144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

5.5 V

320

CMOS

5000

5

Flatpack, Low Profile, Fine Pitch

4.5 V

.5 mm

3.3 ns

320 CLBS, 5000 Gates

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

Max usable 6000 Logic gates

e3

227 MHz

30 s

260 °C (500 °F)

20 mm

XC6SLX9-L1TQG144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

9152

Yes

1.05 V

715

CMOS

102

1

1,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

.95 V

.5 mm

100 °C (212 °F)

0.46 ns

715 CLBS

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

102

20 mm

XC4005A-4TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

196

Yes

5.25 V

196

CMOS

112

4000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

4.75 V

.5 mm

85 °C (185 °F)

4 ns

196 CLBS, 4000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

616 flip-flops; typical gates = 4000-5000

e0

133.3 MHz

30 s

112

225 °C (437 °F)

20 mm

XC4010XL-3TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

400

Yes

3.6 V

400

CMOS

160

7000

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.6 ns

400 CLBS, 7000 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Max usable 10000 Logic gates

e0

166 MHz

30 s

160

225 °C (437 °F)

20 mm

XC4005E-1TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

196

Yes

5.5 V

196

CMOS

112

3000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

4.5 V

.5 mm

196 CLBS, 3000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

166 MHz

30 s

112

225 °C (437 °F)

20 mm

XC2V40-6CSG144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

576

Yes

1.575 V

64

CMOS

88

40000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

85 °C (185 °F)

0.35 ns

64 CLBS, 40000 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

820 MHz

30 s

88

260 °C (500 °F)

12 mm

XC5210-5TQG144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

5.5 V

324

CMOS

10000

5

Flatpack, Low Profile, Fine Pitch

4.5 V

.5 mm

4.6 ns

324 CLBS, 10000 Gates

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

MAX available 16000 Logic gates

e3

83 MHz

30 s

260 °C (500 °F)

20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.