Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
2.625 V |
384 |
CMOS |
98 |
57906 |
2.5 |
1.2/3.6,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
0.8 ns |
384 CLBS, 57906 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
250 MHz |
30 s |
98 |
225 °C (437 °F) |
20 mm |
|||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
196 |
Yes |
5.25 V |
196 |
CMOS |
112 |
3000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
2.7 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 5000 Logic gates |
e0 |
111 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
20 mm |
|||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
784 |
CMOS |
13000 |
3.3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.5 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
Max usable 20000 Logic gates |
e3 |
179 MHz |
20 mm |
|||||||||||||
|
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
400 |
CMOS |
7000 |
3.3 |
Grid Array, Thin Profile, Fine Pitch |
3 V |
.8 mm |
85 °C (185 °F) |
1.1 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
Maximum usable gates 20000 |
e1 |
217 MHz |
12 mm |
||||||||||||
Xilinx |
FPGA |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
576 |
Yes |
1.575 V |
64 |
CMOS |
88 |
40000 |
1.5 |
1.5,1.5/3.3,3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.425 V |
.8 mm |
0.44 ns |
64 CLBS, 40000 Gates |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
650 MHz |
30 s |
88 |
240 °C (464 °F) |
12 mm |
|||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
192 CLBS, 50000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
20 mm |
||||||||||||||||
|
Xilinx |
FPGA |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.89 V |
384 |
CMOS |
94 |
20736 |
1.8 |
1.2/3.6,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.71 V |
.8 mm |
0.47 ns |
384 CLBS, 20736 Gates |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
357 MHz |
30 s |
94 |
260 °C (500 °F) |
12 mm |
||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
120 |
Yes |
5.25 V |
120 |
CMOS |
124 |
4000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
4.6 ns |
120 CLBS, 4000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAX available 6000 Logic gates |
e0 |
83 MHz |
30 s |
124 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
384 |
CMOS |
57906 |
2.5 |
Grid Array, Thin Profile, Fine Pitch |
2.375 V |
.8 mm |
0.6 ns |
384 CLBS, 57906 Gates |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
333 MHz |
30 s |
260 °C (500 °F) |
12 mm |
||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
600 |
CMOS |
108904 |
2.5 |
Flatpack, Low Profile, Fine Pitch |
2.375 V |
.5 mm |
0.7 ns |
600 CLBS, 108904 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
294 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
120 |
Yes |
5.5 V |
120 |
CMOS |
124 |
4000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
5.6 ns |
120 CLBS, 4000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAX available 6000 Logic gates |
e0 |
83 MHz |
30 s |
124 |
225 °C (437 °F) |
20 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
896 |
CMOS |
400000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
4.88 ns |
896 CLBS, 400000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
667 MHz |
20 mm |
|||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.5 V |
320 |
CMOS |
122 |
5000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
2.2 ns |
320 CLBS, 5000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 6000 Logic gates |
e0 |
323 MHz |
30 s |
122 |
225 °C (437 °F) |
20 mm |
||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
256 |
CMOS |
4000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.5 V |
.5 mm |
2.7 ns |
256 CLBS, 4000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 6000 Logic gates |
e3 |
111 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||||
Xilinx |
FPGA |
Automotive |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.89 V |
384 |
CMOS |
AEC-Q100 |
102 |
1.8 |
1.2/3.6,1.8 V |
Flatpack |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
125 °C (257 °F) |
384 CLBS |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
No |
e0 |
357 MHz |
30 s |
102 |
225 °C (437 °F) |
||||||||||
|
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
1152 |
Yes |
1.575 V |
128 |
CMOS |
92 |
80000 |
1.5 |
1.5,1.5/3.3,3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.425 V |
.8 mm |
85 °C (185 °F) |
0.39 ns |
128 CLBS, 80000 Gates |
0 °C (32 °F) |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
750 MHz |
30 s |
92 |
260 °C (500 °F) |
12 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
400 |
Yes |
3.6 V |
400 |
CMOS |
160 |
7000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.5 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 10000 Logic gates |
e0 |
179 MHz |
30 s |
160 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Commercial Extended |
G |
144 |
FQFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1536 |
93000 |
1.8 |
Flatpack, Fine Pitch |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.47 ns |
1536 CLBS, 93000 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
Maximum usable gates = 300000 |
357 MHz |
20 mm |
|||||||||||||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
3.6 V |
320 |
CMOS |
122 |
5000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
70 °C (158 °F) |
2.2 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Typical gates = 5000-6000 |
e0 |
325 MHz |
30 s |
122 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
2700 |
Yes |
1.89 V |
600 |
CMOS |
94 |
32400 |
1.8 |
1.2/3.6,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.71 V |
.8 mm |
0.4 ns |
600 CLBS, 32400 Gates |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
416 MHz |
30 s |
94 |
260 °C (500 °F) |
12 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
400 |
CMOS |
7000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 10000 Logic gates |
e3 |
217 MHz |
20 mm |
||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
400 |
Yes |
5.5 V |
400 |
CMOS |
160 |
7000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
1.6 ns |
400 CLBS, 7000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates 20000 |
e0 |
125 MHz |
30 s |
160 |
225 °C (437 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
144 |
Yes |
5.25 V |
144 |
CMOS |
96 |
2000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
4.1 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 3000 Logic gates |
e0 |
135 MHz |
30 s |
96 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
144 |
CMOS |
2000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.75 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Max usable 3000 Logic gates |
e3 |
323 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1584 |
Yes |
1.26 V |
176 |
CMOS |
108 |
50000 |
1.2 |
1.2,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.62 ns |
176 CLBS, 50000 Gates |
0 °C (32 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
770 MHz |
101 |
20 mm |
|||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
950 |
Yes |
3.6 V |
400 |
CMOS |
113 |
7000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 10000 Logic gates |
e0 |
217 MHz |
30 s |
113 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
20 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
5 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
20 mm |
|||||||||||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
196 |
Yes |
3.6 V |
196 |
CMOS |
112 |
3000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
1.3 ns |
196 CLBS, 3000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 5000 Logic gates |
e0 |
200 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
576 |
Yes |
1.575 V |
64 |
CMOS |
88 |
40000 |
1.5 |
1.5,1.5/3.3,3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.425 V |
.8 mm |
0.35 ns |
64 CLBS, 40000 Gates |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
820 MHz |
30 s |
88 |
240 °C (464 °F) |
12 mm |
|||||||||
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
972 |
Yes |
2.625 V |
216 |
96 |
30000 |
2.5 |
1.5/3.3,2.5 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
2.375 V |
.8 mm |
85 °C (185 °F) |
0.7 ns |
216 CLBS, 30000 Gates |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
Maximum usable gates 30000 |
e0 |
263 MHz |
30 s |
92 |
240 °C (464 °F) |
12 mm |
||||||
Xilinx |
FPGA |
Commercial Extended |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1536 |
93000 |
1.8 |
Flatpack, Low Profile, Fine Pitch |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.47 ns |
1536 CLBS, 93000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates = 300000 |
e0 |
357 MHz |
20 mm |
||||||||||||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
1.2 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
100 °C (212 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
806 MHz |
20 mm |
||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.25 V |
320 |
CMOS |
122 |
5000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
3.3 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 6000 Logic gates |
e0 |
227 MHz |
30 s |
122 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
300 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.26 ns |
300 CLBS |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
e3 |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
1.2 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
500 MHz |
20 mm |
||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
224 |
Yes |
5.25 V |
224 |
CMOS |
120 |
3500 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
5.1 ns |
224 CLBS, 3500 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 4500 Logic gates |
e0 |
113 MHz |
30 s |
120 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
CMOS |
6000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
196 CLBS, 6000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Typical gates = 6000-10000 |
e3 |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
5.25 V |
576 |
CMOS |
196 |
10000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.6 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates 30000 |
e0 |
125 MHz |
30 s |
196 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
144 |
CMOS |
2000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
3.3 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Max usable 3000 Logic gates |
e3 |
227 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
320 |
Yes |
5.5 V |
320 |
CMOS |
122 |
5000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
2.7 ns |
320 CLBS, 5000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 6000 Logic gates |
e0 |
270 MHz |
30 s |
122 |
225 °C (437 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
3.6 V |
576 |
CMOS |
196 |
10000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.1 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates 30000 |
e0 |
217 MHz |
30 s |
196 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
2700 |
Yes |
1.89 V |
600 |
CMOS |
94 |
32400 |
1.8 |
1.2/3.6,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.71 V |
.8 mm |
0.47 ns |
600 CLBS, 32400 Gates |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
357 MHz |
30 s |
94 |
260 °C (500 °F) |
12 mm |
||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
784 |
CMOS |
13000 |
3.3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
784 CLBS, 13000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
Typical gates = 13000-40000 |
e3 |
217 MHz |
20 mm |
|||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
64 |
Yes |
5.25 V |
64 |
CMOS |
84 |
2000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
4.6 ns |
64 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAX available 3000 Logic gates |
e0 |
83 MHz |
30 s |
84 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2160 |
Yes |
1.26 V |
240 |
CMOS |
108 |
100000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 °C (185 °F) |
0.66 ns |
240 CLBS, 100000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
657 MHz |
30 s |
80 |
260 °C (500 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
144 |
Yes |
5.5 V |
144 |
CMOS |
96 |
2000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
2.7 ns |
144 CLBS, 2000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 3000 Logic gates |
e0 |
270 MHz |
30 s |
96 |
225 °C (437 °F) |
20 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.