144 Field Programmable Gate Arrays (FPGA) 1,421

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC4005E-1TQG144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

5.5 V

196

CMOS

3000

5

Flatpack, Low Profile, Fine Pitch

4.5 V

.5 mm

196 CLBS, 3000 Gates

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

166 MHz

30 s

260 °C (500 °F)

20 mm

XC5206-5TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

784

Yes

5.5 V

196

CMOS

117

6000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

4.5 V

.5 mm

4.6 ns

196 CLBS, 6000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

MAX available 10000 Logic gates

e0

83 MHz

30 s

117

225 °C (437 °F)

20 mm

XCS30-4TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

5.25 V

576

CMOS

10000

5

Flatpack, Low Profile, Fine Pitch

4.75 V

.5 mm

85 °C (185 °F)

1.2 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Maximum usable gates 30000

e3

166 MHz

30 s

260 °C (500 °F)

20 mm

XC6SLX9-N3TQG144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

9152

Yes

1.26 V

715

CMOS

102

1.2

1.2,1.2/3.3,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.26 ns

715 CLBS

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

806 MHz

102

20 mm

XC4005E-3TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

196

Yes

5.5 V

196

CMOS

112

3000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

4.5 V

.5 mm

2 ns

196 CLBS, 3000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Max usable 5000 Logic gates

e0

125 MHz

30 s

112

225 °C (437 °F)

20 mm

XC3142A-4TQG144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

5.5 V

144

CMOS

2000

5

Flatpack, Low Profile, Fine Pitch

4.5 V

.5 mm

3.3 ns

144 CLBS, 2000 Gates

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

Max usable 3000 Logic gates

e3

227 MHz

30 s

260 °C (500 °F)

20 mm

XC3142-5TQ144C

Xilinx

FPGA

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

144

Yes

5.25 V

144

CMOS

96

3000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

4.75 V

.5 mm

70 °C (158 °F)

4.1 ns

144 CLBS, 3000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

e0

190 MHz

30 s

96

225 °C (437 °F)

20 mm

XCV200E-6CSG144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

5292

Yes

1.89 V

1176

CMOS

94

63504

1.8

1.2/3.6,1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.71 V

.8 mm

85 °C (185 °F)

0.47 ns

1176 CLBS, 63504 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

357 MHz

30 s

94

260 °C (500 °F)

12 mm

XC3S1000-4TQG144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Flatpack, Low Profile, Fine Pitch

1.14 V

.5 mm

192 CLBS, 50000 Gates

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

30 s

260 °C (500 °F)

20 mm

XC2S600E-6TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.89 V

864

52000

1.8

Flatpack, Low Profile, Fine Pitch

1.71 V

.5 mm

0.47 ns

864 CLBS, 52000 Gates

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Maximum usable gates = 150000

e0

357 MHz

20 mm

XC2S400E-6TGGQGG144I

Xilinx

FPGA

Industrial

G

144

FQFP

Square

Plastic/Epoxy

Yes

1.89 V

864

52000

1.8

Flatpack, Fine Pitch

1.71 V

.5 mm

85 °C (185 °F)

0.47 ns

864 CLBS, 52000 Gates

-40 °C (-40 °F)

Quad

S-PQFP-G144

1.6 mm

20 mm

No

Maximum usable gates = 150000

357 MHz

20 mm

XC3S100E-4TQ144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2160

Yes

1.26 V

240

CMOS

108

100000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.76 ns

240 CLBS, 100000 Gates

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

572 MHz

80

20 mm

XC3342A-3VQ144I

Xilinx

FPGA

Gull Wing

144

QFP

Rectangular

Plastic/Epoxy

Yes

CMOS

5

Flatpack

Quad

R-PQFP-G144

No

XC2V40-5CSG144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

576

Yes

1.575 V

64

CMOS

88

40000

1.5

1.5,1.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.425 V

.8 mm

85 °C (185 °F)

0.39 ns

64 CLBS, 40000 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

750 MHz

30 s

88

260 °C (500 °F)

12 mm

XC3S200AN-4TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.26 V

448

CMOS

200000

1.2

Flatpack, Low Profile, Fine Pitch

1.14 V

.5 mm

4.88 ns

448 CLBS, 200000 Gates

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

667 MHz

20 mm

XC2S50E-7TGGQGG144C

Xilinx

FPGA

Commercial Extended

G

144

FQFP

Square

Plastic/Epoxy

Yes

1.89 V

864

52000

1.8

Flatpack, Fine Pitch

1.71 V

.5 mm

85 °C (185 °F)

0.47 ns

864 CLBS, 52000 Gates

0 °C (32 °F)

Quad

S-PQFP-G144

1.6 mm

20 mm

No

Maximum usable gates = 150000

357 MHz

20 mm

XC4005XL-1TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

196

CMOS

3000

3.3

Flatpack, Low Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

1.3 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Max usable 5000 Logic gates

e3

200 MHz

30 s

260 °C (500 °F)

20 mm

XCV300-5TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

2.625 V

1536

CMOS

322970

2.5

Flatpack, Low Profile, Fine Pitch

2.375 V

.5 mm

0.5 ns

1536 CLBS, 322970 Gates

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

20 mm

XC2S50-5TQG144Q

Xilinx

FPGA

Automotive

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

2.625 V

384

50000

2.5

Flatpack, Low Profile, Fine Pitch

2.375 V

.5 mm

125 °C (257 °F)

384 CLBS, 50000 Gates

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

30 s

260 °C (500 °F)

20 mm

XC4005E-2TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

196

Yes

5.5 V

196

CMOS

112

3000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

4.5 V

.5 mm

1.6 ns

196 CLBS, 3000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Max usable 5000 Logic gates

e0

125 MHz

30 s

112

225 °C (437 °F)

20 mm

XC3342A-6VQ144I

Xilinx

FPGA

Gull Wing

144

QFP

Rectangular

Plastic/Epoxy

Yes

CMOS

5

Flatpack

Quad

R-PQFP-G144

No

XC2S600E-7TQ144C

Xilinx

FPGA

Commercial Extended

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.89 V

864

52000

1.8

Flatpack, Low Profile, Fine Pitch

1.71 V

.5 mm

85 °C (185 °F)

0.47 ns

864 CLBS, 52000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Maximum usable gates = 150000

e0

357 MHz

20 mm

XC5206-5TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

5.25 V

196

CMOS

6000

5

Flatpack, Low Profile, Fine Pitch

4.75 V

.5 mm

85 °C (185 °F)

4.6 ns

196 CLBS, 6000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

MAX available 10000 Logic gates

e3

83 MHz

30 s

260 °C (500 °F)

20 mm

XC5206L-5TQG144C

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

196

CMOS

6000

3.3

Flatpack, Low Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

196 CLBS, 6000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Typical gates = 6000-10000

e3

30 s

260 °C (500 °F)

20 mm

XC4013XL-1HT144I

Xilinx

FPGA

Gull Wing

144

HLFQFP

Square

Plastic/Epoxy

576

Yes

3.6 V

576

CMOS

192

10000

3.3

3.3 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HQFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

1.3 ns

576 CLBS, 10000 Gates

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Max usable 13000 Logic gates

e0

200 MHz

192

20 mm

XC2S200E-7TQ144C

Xilinx

FPGA

Commercial Extended

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.89 V

864

52000

1.8

Flatpack, Low Profile, Fine Pitch

1.71 V

.5 mm

85 °C (185 °F)

0.47 ns

864 CLBS, 52000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Maximum usable gates = 150000

e0

357 MHz

20 mm

XC4006E-4TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

256

Yes

5.5 V

256

CMOS

128

4000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

4.5 V

.5 mm

2.7 ns

256 CLBS, 4000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Max usable 6000 Logic gates

e0

111 MHz

30 s

128

225 °C (437 °F)

20 mm

XC4010XL-1TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

400

Yes

3.6 V

400

CMOS

160

7000

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

1.3 ns

400 CLBS, 7000 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Max usable 10000 Logic gates

e0

200 MHz

30 s

160

225 °C (437 °F)

20 mm

XC3S100E-4TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2160

Yes

1.26 V

240

CMOS

108

100000

1.2

1.2,1.2/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.76 ns

240 CLBS, 100000 Gates

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

572 MHz

80

20 mm

XC3142-3TQ144C

Xilinx

FPGA

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

144

Yes

5.25 V

144

CMOS

96

3000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

4.75 V

.5 mm

70 °C (158 °F)

2.7 ns

144 CLBS, 3000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

MAX 96 I/OS; 480 flip-flops; typical gates = 3000 - 3700

e0

270 MHz

30 s

96

225 °C (437 °F)

20 mm

XCV50-4CS144I

Xilinx

FPGA

Ball

144

TFBGA

Square

Plastic/Epoxy

1728

Yes

2.625 V

384

CMOS

94

57906

2.5

1.2/3.6,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

2.375 V

.8 mm

0.8 ns

384 CLBS, 57906 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

250 MHz

30 s

94

240 °C (464 °F)

12 mm

XCS10XL-3TQG144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

196

3000

3.3

Flatpack, Low Profile, Fine Pitch

3 V

.5 mm

196 CLBS, 3000 Gates

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

20 mm

XCS20XL-3TQG144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

400

20000

3.3

Flatpack, Low Profile, Fine Pitch

3 V

.5 mm

1.1 ns

400 CLBS, 20000 Gates

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

179 MHz

20 mm

XCS30XL-4TQ144Q

Xilinx

FPGA

Automotive

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

576

Yes

3.6 V

576

CMOS

192

10000

3.3

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

125 °C (257 °F)

1.1 ns

576 CLBS, 10000 Gates

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Maximum usable gates = 30000

e0

217 MHz

30 s

192

225 °C (437 °F)

20 mm

XC3342L-8TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

.5 mm

Quad

S-PQFP-G144

1.6 mm

20 mm

No

20 mm

XCV50-6CSG144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

Yes

2.625 V

384

CMOS

57906

2.5

Grid Array, Thin Profile, Fine Pitch

2.375 V

.8 mm

85 °C (185 °F)

0.6 ns

384 CLBS, 57906 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

333 MHz

30 s

260 °C (500 °F)

12 mm

XC3S1400AN-4TQ144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.26 V

2816

CMOS

1400000

1.2

Flatpack, Low Profile, Fine Pitch

1.14 V

.5 mm

85 °C (185 °F)

4.88 ns

2816 CLBS, 1400000 Gates

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

667 MHz

20 mm

XCV100-5TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

2700

Yes

2.625 V

600

CMOS

98

108904

2.5

1.5/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

0.7 ns

600 CLBS, 108904 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

294 MHz

30 s

98

225 °C (437 °F)

20 mm

XCS10-3TQG144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

5.5 V

196

3000

5

Flatpack, Low Profile, Fine Pitch

4.5 V

.5 mm

196 CLBS, 3000 Gates

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

20 mm

XCS10XL-3TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

3.6 V

196

3000

3.3

Flatpack, Low Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

196 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Can also use 10000 gates

e3

30 s

260 °C (500 °F)

20 mm

XCV100E-6CSG144C

Xilinx

FPGA

Other

Ball

144

TFBGA

Square

Plastic/Epoxy

2700

Yes

1.89 V

600

CMOS

94

32400

1.8

1.2/3.6,1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Field Programmable Gate Arrays

1.71 V

.8 mm

85 °C (185 °F)

0.47 ns

600 CLBS, 32400 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

357 MHz

30 s

94

260 °C (500 °F)

12 mm

XC4013XL-08HT144C

Xilinx

FPGA

Other

Gull Wing

144

HLFQFP

Square

Plastic/Epoxy

576

Yes

3.6 V

576

CMOS

192

10000

3.3

3.3 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

HQFP144,.87SQ,20

Field Programmable Gate Arrays

3 V

.5 mm

85 °C (185 °F)

1.1 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Quad

S-PQFP-G144

1

1.6 mm

20 mm

No

Typical gates = 10000-30000

238 MHz

192

20 mm

XC4005A-5TQ144I

Xilinx

FPGA

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

196

Yes

5.5 V

196

CMOS

112

4000

5

5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

4.5 V

.5 mm

85 °C (185 °F)

4.5 ns

196 CLBS, 4000 Gates

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

616 flip-flops; typical gates = 4000-5000

e0

133.3 MHz

30 s

112

225 °C (437 °F)

20 mm

XC4006E-4TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

5.25 V

256

CMOS

4000

5

Flatpack, Low Profile, Fine Pitch

4.75 V

.5 mm

85 °C (185 °F)

2.7 ns

256 CLBS, 4000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Max usable 6000 Logic gates

e3

111 MHz

30 s

260 °C (500 °F)

20 mm

XC3S1400AN-4TQG144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.26 V

2816

CMOS

1400000

1.2

Flatpack, Low Profile, Fine Pitch

1.14 V

.5 mm

4.88 ns

2816 CLBS, 1400000 Gates

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

667 MHz

30 s

260 °C (500 °F)

20 mm

XCS10-4TQG144C

Xilinx

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

5.25 V

196

CMOS

3000

5

Flatpack, Low Profile, Fine Pitch

4.75 V

.5 mm

85 °C (185 °F)

1.2 ns

196 CLBS, 3000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

MAXIMUM usable gates 10000

e3

166 MHz

30 s

260 °C (500 °F)

20 mm

XC4013XL-1HTG144C

Xilinx

FPGA

Other

Gull Wing

144

HLFQFP

Square

Plastic/Epoxy

Yes

3.6 V

576

CMOS

10000

3.3

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

3 V

.5 mm

85 °C (185 °F)

1.3 ns

576 CLBS, 10000 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

1.6 mm

20 mm

No

Max usable 13000 Logic gates

e3

200 MHz

20 mm

XC3S1000-4TQ144I

Xilinx

FPGA

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

Yes

1.26 V

192

50000

1.2

Flatpack, Low Profile, Fine Pitch

1.14 V

.5 mm

192 CLBS, 50000 Gates

Tin Lead

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.