144 Field Programmable Gate Arrays (FPGA) 1,421

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC5204-6TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	120	Yes	5.25 V	120	CMOS	124	4000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	5.6 ns	120 CLBS, 4000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAX available 6000 Logic gates	e0	83 MHz	30 s	124	225 °C (437 °F)	20 mm
XCV100-6CS144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS	94	108904	2.5	1.5/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	2.375 V	.8 mm		0.6 ns	600 CLBS, 108904 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	333 MHz	30 s	94	240 °C (464 °F)	12 mm
XCV100-6TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2700	Yes	2.625 V	600	CMOS	98	108904	2.5	1.5/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	2.375 V	.5 mm	85 °C (185 °F)	0.6 ns	600 CLBS, 108904 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	333 MHz	30 s	98	225 °C (437 °F)	20 mm
XCS10-4TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS	112	3000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	1.2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAXIMUM usable gates 10000	e0	166 MHz	30 s	112	225 °C (437 °F)	20 mm
XCV100-6CSG144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy		Yes	2.625 V	600	CMOS		108904	2.5		Grid Array, Thin Profile, Fine Pitch			2.375 V	.8 mm		0.6 ns	600 CLBS, 108904 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	333 MHz	30 s		260 °C (500 °F)	12 mm
XCV100-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	2.625 V	600	CMOS		108904	2.5		Flatpack, Low Profile, Fine Pitch			2.375 V	.5 mm	85 °C (185 °F)	0.8 ns	600 CLBS, 108904 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	250 MHz	30 s		260 °C (500 °F)	20 mm
XS2S100-5-TQ144I	Xilinx	FPGA		Gull Wing	144	QFP	Square	Plastic/Epoxy	2700	Yes			CMOS	196			1.5/3.3,2.5 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays		.5 mm	100 °C (212 °F)	0.7 ns		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3		20 mm	No		e0		30 s	196	225 °C (437 °F)	20 mm
XC3064A-7TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	224	CMOS		3500	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	5.1 ns	224 CLBS, 3500 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm		Max usable 4500 Logic gates	e3	113 MHz	30 s		260 °C (500 °F)	20 mm
XC3390A-6TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes			CMOS			5		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G144		1.6 mm	20 mm	No							20 mm
XC2V250-5CS144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS	92	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm	85 °C (185 °F)	0.39 ns	384 CLBS, 250000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e0	750 MHz	30 s	92	240 °C (464 °F)	12 mm
XC7S15-2TQGA144C	Xilinx	FPGA	Other	Ball	144	BGA	Square	Plastic/Epoxy		Yes	1.05 V	1000				1		Grid Array			.95 V		85 °C (185 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B144
XC4010XL-3TQG144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	400	CMOS		7000	3.3		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm		1.6 ns	400 CLBS, 7000 Gates		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 10000 Logic gates	e3	166 MHz	30 s		260 °C (500 °F)	20 mm
XC5206L-6TQG144C	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS		6000	3.3		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Typical gates = 6000-10000	e3		30 s		260 °C (500 °F)	20 mm
XC3190A-4TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	320	Yes	5.5 V	320	CMOS	122	5000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm		3.3 ns	320 CLBS, 5000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 6000 Logic gates	e0	227 MHz	30 s	122	225 °C (437 °F)	20 mm
XC7S25-2TQGA144I	Xilinx	FPGA		Ball	144	BGA	Square	Plastic/Epoxy		Yes	1.05 V	1825				1		Grid Array			.95 V			1.05 ns	1825 CLBS			Bottom	S-PBGA-B144
XC3S200-5TQ144I	Xilinx	FPGA		Gull Wing	144	QFP	Square	Plastic/Epoxy	4320	Yes			CMOS	97			1.2,1.2/3.3,2.5 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays		.5 mm					Nickel/Palladium/Gold	Quad	S-PQFP-G144	3			No		e4			97
XC2S50E-6TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS	182	23000	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 50000	e0	357 MHz	30 s	182	225 °C (437 °F)	20 mm
XC3042A-7TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	144	CMOS		2000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	5.1 ns	144 CLBS, 2000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm		Max usable 3000 Logic gates	e3	113 MHz	30 s		260 °C (500 °F)	20 mm
XC3S250E-4TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	108	250000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	572 MHz		80		20 mm
XC5202-4TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	64	Yes	5.5 V	64	CMOS	84	2000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.5 V	.5 mm		3.8 ns	64 CLBS, 2000 Gates		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Typical gates = 2000-3000	e0	83 MHz	30 s	84	225 °C (437 °F)	20 mm
XC3S700AN-4TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	1472	CMOS		700000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm		4.88 ns	1472 CLBS, 700000 Gates		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	667 MHz				20 mm
XCS50E-6TQ144I	Xilinx	FPGA	Industrial	Gull Wing	144	QFP	Square	Plastic/Epoxy	1728	Yes	1.89 V		CMOS	182		1.8	1.8,2.5,3.3 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)	0.47 ns		-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G144	3		20 mm	No		e0	357 MHz	30 s	182	225 °C (437 °F)	20 mm
XCV100-5CSG144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy		Yes	2.625 V	600	CMOS		108904	2.5		Grid Array, Thin Profile, Fine Pitch			2.375 V	.8 mm		0.7 ns	600 CLBS, 108904 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	294 MHz	30 s		260 °C (500 °F)	12 mm
XC4006E-3TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	256	CMOS		4000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	2 ns	256 CLBS, 4000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 6000 Logic gates	e3	125 MHz	30 s		260 °C (500 °F)	20 mm
XCV50-5CSG144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy		Yes	2.625 V	384	CMOS		57906	2.5		Grid Array, Thin Profile, Fine Pitch			2.375 V	.8 mm		0.7 ns	384 CLBS, 57906 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	294 MHz	30 s		260 °C (500 °F)	12 mm
XC3S100E-4TQ144CS1	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2160	Yes	1.26 V	240	CMOS	108	100000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	240 CLBS, 100000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0	572 MHz	30 s	80	225 °C (437 °F)	20 mm
XC3390L-8TQ144C	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes			CMOS			3.3		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G144		1.6 mm	20 mm	No							20 mm
XC5204-4TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	120	Yes	5.25 V	120	CMOS	124	4000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3.8 ns	120 CLBS, 4000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAX available 6000 Logic gates	e0	83 MHz	30 s	124	225 °C (437 °F)	20 mm
XC2S30-5CSG144I	Xilinx	FPGA	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	972	Yes	2.625 V	216		92	30000	2.5	1.5/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)	0.7 ns	216 CLBS, 30000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	263 MHz	30 s	92	260 °C (500 °F)	12 mm
XS2S30-5-CS144C	Xilinx	FPGA		Ball	144	FBGA	Square	Plastic/Epoxy	972	Yes			CMOS	132			1.5/3.3,2.5 V	Grid Array, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)	0.7 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B144	3		12 mm	No		e0		30 s	132	240 °C (464 °F)	12 mm
XC5210-4TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	324	Yes	5.25 V	324	CMOS	196	10000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	3.8 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAX available 16000 Logic gates	e0	83 MHz	30 s	196	225 °C (437 °F)	20 mm
XCV50-4CSG144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy		Yes	2.625 V	384	CMOS		57906	2.5		Grid Array, Thin Profile, Fine Pitch			2.375 V	.8 mm		0.8 ns	384 CLBS, 57906 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	250 MHz	30 s		260 °C (500 °F)	12 mm
XC3S200-5TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	4320	Yes	1.26 V	480	CMOS	97	200000	1.2	1.2,1.2/3.3,2.5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.53 ns	480 CLBS, 200000 Gates	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	725 MHz		97		20 mm
XC4005E-3TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	196	Yes	5.25 V	196	CMOS	112	3000	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	4.75 V	.5 mm	85 °C (185 °F)	2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 5000 Logic gates	e0	125 MHz	30 s	112	225 °C (437 °F)	20 mm
XC2S100E-6TGGQGG144I	Xilinx	FPGA		G	144	FQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Fine Pitch			1.71 V	.5 mm		0.47 ns	864 CLBS, 52000 Gates			Quad	S-PQFP-G144		1.6 mm	20 mm	No	Maximum usable gates = 150000		357 MHz				20 mm
XC3S400-5TQ144I	Xilinx	FPGA		Gull Wing	144	QFP	Square	Plastic/Epoxy	8064	Yes			CMOS	97			1.2,1.2/3.3,2.5 V	Flatpack	QFP144,.87SQ,20	Field Programmable Gate Arrays		.5 mm					Nickel Palladium Gold	Quad	S-PQFP-G144	3			No		e4			97
XC5206L-3TQG144C	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	3.6 V	196	CMOS		6000	3.3		Flatpack, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)		196 CLBS, 6000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Typical gates = 6000-10000	e3		30 s		260 °C (500 °F)	20 mm
XC4013XL-09CHTG144C	Xilinx	FPGA	Other	Gull Wing	144	HLFQFP	Square	Plastic/Epoxy		Yes	3.6 V	576	CMOS		10000	3.3		Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch			3 V	.5 mm	85 °C (185 °F)	1.2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144		1.6 mm	20 mm	No	Max usable 13000 Logic gates	e3	217 MHz				20 mm
XC5404L-4TQ144C	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes						3.3		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G144		1.6 mm	20 mm	No							20 mm
XCS30-3TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	576	CMOS		10000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 30000	e3	125 MHz	30 s		260 °C (500 °F)	20 mm
XC5410L-4TQ144C	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes						3.3		Flatpack, Low Profile, Fine Pitch				.5 mm						Quad	S-PQFP-G144		1.6 mm	20 mm	No							20 mm
XC3190A-2TQG144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.5 V	320	CMOS		5000	5		Flatpack, Low Profile, Fine Pitch			4.5 V	.5 mm		2.2 ns	320 CLBS, 5000 Gates		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm		Max usable 6000 Logic gates	e3	323 MHz	30 s		260 °C (500 °F)	20 mm
XC5204-6TQG144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.5 V	120	CMOS		4000	5		Flatpack, Low Profile, Fine Pitch			4.5 V	.5 mm		5.6 ns	120 CLBS, 4000 Gates		Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAX available 6000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	20 mm
XC2S400E-6TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.89 V	864			52000	1.8		Flatpack, Low Profile, Fine Pitch			1.71 V	.5 mm		0.47 ns	864 CLBS, 52000 Gates		Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 150000	e0	357 MHz				20 mm
XC3S1400AN-5TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	1.26 V	2816	CMOS		1400000	1.2		Flatpack, Low Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)	4.36 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e3	770 MHz	30 s		260 °C (500 °F)	20 mm
XC5210-4TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	5.25 V	324	CMOS		10000	5		Flatpack, Low Profile, Fine Pitch			4.75 V	.5 mm	85 °C (185 °F)	3.8 ns	324 CLBS, 10000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAX available 16000 Logic gates	e3	83 MHz	30 s		260 °C (500 °F)	20 mm
XCV300-6TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy		Yes	2.625 V	1536	CMOS		322970	2.5		Flatpack, Low Profile, Fine Pitch			2.375 V	.5 mm	85 °C (185 °F)	0.4 ns	1536 CLBS, 322970 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0					20 mm
XC4005XL-2TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS	112	3000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1.5 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Max usable 5000 Logic gates	e0	179 MHz	30 s	112	225 °C (437 °F)	20 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.