Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
3000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
196 CLBS, 3000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
20 mm |
|||||||||||||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
400 |
20000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
1.1 ns |
400 CLBS, 20000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
179 MHz |
20 mm |
|||||||||||||||||
Xilinx |
FPGA |
Automotive |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
3.6 V |
576 |
CMOS |
192 |
10000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
125 °C (257 °F) |
1.1 ns |
576 CLBS, 10000 Gates |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates = 30000 |
e0 |
217 MHz |
30 s |
192 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
CMOS |
3.3 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
20 mm |
|||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
Yes |
2.625 V |
384 |
CMOS |
57906 |
2.5 |
Grid Array, Thin Profile, Fine Pitch |
2.375 V |
.8 mm |
85 °C (185 °F) |
0.6 ns |
384 CLBS, 57906 Gates |
0 °C (32 °F) |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
333 MHz |
30 s |
260 °C (500 °F) |
12 mm |
|||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
2816 |
CMOS |
1400000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
85 °C (185 °F) |
4.88 ns |
2816 CLBS, 1400000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
667 MHz |
20 mm |
||||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
2700 |
Yes |
2.625 V |
600 |
CMOS |
98 |
108904 |
2.5 |
1.5/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
0.7 ns |
600 CLBS, 108904 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
294 MHz |
30 s |
98 |
225 °C (437 °F) |
20 mm |
|||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
196 |
3000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.5 V |
.5 mm |
196 CLBS, 3000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
20 mm |
|||||||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
196 |
3000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Can also use 10000 gates |
e3 |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||||
|
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
2700 |
Yes |
1.89 V |
600 |
CMOS |
94 |
32400 |
1.8 |
1.2/3.6,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.71 V |
.8 mm |
85 °C (185 °F) |
0.47 ns |
600 CLBS, 32400 Gates |
0 °C (32 °F) |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
357 MHz |
30 s |
94 |
260 °C (500 °F) |
12 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
3.6 V |
576 |
CMOS |
192 |
10000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.1 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
1 |
1.6 mm |
20 mm |
No |
Typical gates = 10000-30000 |
238 MHz |
192 |
20 mm |
|||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
196 |
Yes |
5.5 V |
196 |
CMOS |
112 |
4000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
85 °C (185 °F) |
4.5 ns |
196 CLBS, 4000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
616 flip-flops; typical gates = 4000-5000 |
e0 |
133.3 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
256 |
CMOS |
4000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
2.7 ns |
256 CLBS, 4000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 6000 Logic gates |
e3 |
111 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
2816 |
CMOS |
1400000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
4.88 ns |
2816 CLBS, 1400000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
667 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
196 |
CMOS |
3000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
1.2 ns |
196 CLBS, 3000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAXIMUM usable gates 10000 |
e3 |
166 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
576 |
CMOS |
10000 |
3.3 |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
3 V |
.5 mm |
85 °C (185 °F) |
1.3 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
Max usable 13000 Logic gates |
e3 |
200 MHz |
20 mm |
|||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.26 V |
192 |
50000 |
1.2 |
Flatpack, Low Profile, Fine Pitch |
1.14 V |
.5 mm |
192 CLBS, 50000 Gates |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e0 |
20 mm |
||||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1536 |
93000 |
1.8 |
Flatpack, Low Profile, Fine Pitch |
1.71 V |
.5 mm |
0.47 ns |
1536 CLBS, 93000 Gates |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates = 300000 |
e0 |
357 MHz |
20 mm |
|||||||||||||||||
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
400 |
Yes |
3.6 V |
400 |
CMOS |
160 |
7000 |
3.3 |
3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
3 V |
.8 mm |
85 °C (185 °F) |
1 ns |
400 CLBS, 7000 Gates |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
Maximum usable gates 20000 |
e0 |
250 MHz |
30 s |
160 |
240 °C (464 °F) |
12 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.3 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
20 mm |
||||||||||||||||||||||||||||
|
Xilinx |
FPGA |
Automotive |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
4320 |
Yes |
1.26 V |
480 |
AEC-Q100 |
173 |
200000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
125 °C (257 °F) |
480 CLBS, 200000 Gates |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e3 |
125 MHz |
30 s |
173 |
260 °C (500 °F) |
20 mm |
||||||
Xilinx |
FPGA |
Gull Wing |
144 |
QFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.89 V |
384 |
CMOS |
AEC-Q100 |
102 |
1.8 |
1.2/3.6,1.8 V |
Flatpack |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
384 CLBS |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
No |
e0 |
357 MHz |
30 s |
102 |
225 °C (437 °F) |
|||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
324 |
Yes |
5.25 V |
324 |
CMOS |
196 |
10000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
3 ns |
324 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAX available 16000 Logic gates |
e0 |
83 MHz |
30 s |
196 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
1152 |
Yes |
1.575 V |
128 |
CMOS |
92 |
80000 |
1.5 |
1.5,1.5/3.3,3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.425 V |
.8 mm |
85 °C (185 °F) |
0.44 ns |
128 CLBS, 80000 Gates |
0 °C (32 °F) |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
650 MHz |
30 s |
92 |
260 °C (500 °F) |
12 mm |
|||||
|
Xilinx |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
5508 |
Yes |
1.26 V |
612 |
CMOS |
108 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 °C (212 °F) |
0.76 ns |
612 CLBS, 250000 Gates |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
e4 |
572 MHz |
80 |
20 mm |
|||||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
144 |
Yes |
3.6 V |
144 |
CMOS |
96 |
2000 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
70 °C (158 °F) |
2.2 ns |
144 CLBS, 2000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Typical gates = 2000-3000 |
e0 |
325 MHz |
30 s |
96 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
120 |
Yes |
5.5 V |
120 |
CMOS |
124 |
4000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
3 ns |
120 CLBS, 4000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Typical gates = 4000-6000 |
e0 |
83 MHz |
30 s |
124 |
225 °C (437 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Industrial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
196 |
Yes |
5.5 V |
196 |
CMOS |
112 |
4000 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.5 V |
.5 mm |
85 °C (185 °F) |
6 ns |
196 CLBS, 4000 Gates |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
616 flip-flops; typical gates = 4000-5000 |
e0 |
90.9 MHz |
30 s |
112 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
144 |
Yes |
5.25 V |
144 |
CMOS |
96 |
3200 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
70 °C (158 °F) |
4 ns |
144 CLBS, 3200 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAX 96 I/OS; 480 flip-flops; typical gates = 3200 - 4000 |
e0 |
133.3 MHz |
30 s |
96 |
225 °C (437 °F) |
20 mm |
|||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
120 |
CMOS |
4000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
3 ns |
120 CLBS, 4000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
MAX available 6000 Logic gates |
e3 |
83 MHz |
30 s |
260 °C (500 °F) |
20 mm |
||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.3 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
20 mm |
||||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
5292 |
Yes |
1.89 V |
1176 |
CMOS |
94 |
63504 |
1.8 |
1.2/3.6,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.71 V |
.8 mm |
85 °C (185 °F) |
0.4 ns |
1176 CLBS, 63504 Gates |
0 °C (32 °F) |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
416 MHz |
30 s |
94 |
240 °C (464 °F) |
12 mm |
||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.6 V |
400 |
CMOS |
7000 |
3.3 |
Flatpack, Low Profile, Fine Pitch |
3 V |
.5 mm |
1.5 ns |
400 CLBS, 7000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 10000 Logic gates |
e3 |
179 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||||
|
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.25 V |
320 |
CMOS |
5000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.75 V |
.5 mm |
85 °C (185 °F) |
2.2 ns |
320 CLBS, 5000 Gates |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Max usable 6000 Logic gates |
e3 |
323 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||
|
Xilinx |
FPGA |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
1152 |
Yes |
1.575 V |
128 |
CMOS |
92 |
80000 |
1.5 |
1.5,1.5/3.3,3.3 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.425 V |
.8 mm |
0.44 ns |
128 CLBS, 80000 Gates |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
650 MHz |
30 s |
92 |
260 °C (500 °F) |
12 mm |
||||||||
|
Xilinx |
FPGA |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
2700 |
Yes |
1.89 V |
600 |
CMOS |
94 |
32400 |
1.8 |
1.2/3.6,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.71 V |
.8 mm |
0.42 ns |
600 CLBS, 32400 Gates |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e1 |
400 MHz |
30 s |
94 |
260 °C (500 °F) |
12 mm |
||||||||
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.89 V |
384 |
CMOS |
94 |
20736 |
1.8 |
1.2/3.6,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.71 V |
.8 mm |
85 °C (185 °F) |
0.42 ns |
384 CLBS, 20736 Gates |
0 °C (32 °F) |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
400 MHz |
30 s |
94 |
240 °C (464 °F) |
12 mm |
||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.89 V |
384 |
CMOS |
182 |
23000 |
1.8 |
1.5/3.3,1.8 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
0.47 ns |
384 CLBS, 23000 Gates |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates = 50000 |
e0 |
357 MHz |
30 s |
182 |
225 °C (437 °F) |
20 mm |
||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
224 |
Yes |
3.6 V |
224 |
CMOS |
120 |
3500 |
3.3 |
3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
6.7 ns |
224 CLBS, 3500 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 4500 Logic gates |
e0 |
80 MHz |
30 s |
120 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
576 |
Yes |
3.6 V |
576 |
CMOS |
192 |
10000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.3 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 13000 Logic gates |
e0 |
200 MHz |
192 |
20 mm |
|||||||
Xilinx |
FPGA |
Gull Wing |
144 |
QFP |
Rectangular |
Plastic/Epoxy |
Yes |
CMOS |
3.3 |
Flatpack |
Quad |
R-PQFP-G144 |
No |
|||||||||||||||||||||||||||||||
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
3.3 |
Flatpack, Low Profile, Fine Pitch |
.5 mm |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
20 mm |
||||||||||||||||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
224 |
Yes |
5.25 V |
224 |
CMOS |
120 |
3500 |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
4.75 V |
.5 mm |
85 °C (185 °F) |
3.3 ns |
224 CLBS, 3500 Gates |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Max usable 4500 Logic gates |
e0 |
227 MHz |
30 s |
120 |
225 °C (437 °F) |
20 mm |
|||||
Xilinx |
FPGA |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
1728 |
Yes |
1.89 V |
384 |
CMOS |
94 |
20736 |
1.8 |
1.2/3.6,1.8 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
1.71 V |
.8 mm |
0.4 ns |
384 CLBS, 20736 Gates |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
416 MHz |
30 s |
94 |
240 °C (464 °F) |
12 mm |
|||||||||
|
Xilinx |
FPGA |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
5.5 V |
324 |
CMOS |
10000 |
5 |
Flatpack, Low Profile, Fine Pitch |
4.5 V |
.5 mm |
3 ns |
324 CLBS, 10000 Gates |
Matte Tin |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Typical gates = 10000-16000 |
e3 |
83 MHz |
30 s |
260 °C (500 °F) |
20 mm |
|||||||||||||
Xilinx |
FPGA |
Commercial Extended |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
Yes |
1.89 V |
1536 |
93000 |
1.8 |
Flatpack, Low Profile, Fine Pitch |
1.71 V |
.5 mm |
85 °C (185 °F) |
0.42 ns |
1536 CLBS, 93000 Gates |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
No |
Maximum usable gates = 300000 |
e0 |
400 MHz |
20 mm |
||||||||||||||
Xilinx |
FPGA |
Other |
Gull Wing |
144 |
HLFQFP |
Square |
Plastic/Epoxy |
1368 |
Yes |
3.6 V |
576 |
CMOS |
113 |
10000 |
3.3 |
3.3 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 °C (185 °F) |
1.1 ns |
576 CLBS, 10000 Gates |
0 °C (32 °F) |
Quad |
S-PQFP-G144 |
1.6 mm |
20 mm |
No |
Max usable 13000 Logic gates |
238 MHz |
113 |
20 mm |
||||||||||
Xilinx |
FPGA |
Other |
Ball |
144 |
TFBGA |
Square |
Plastic/Epoxy |
1728 |
Yes |
2.625 V |
384 |
CMOS |
94 |
57906 |
2.5 |
1.2/3.6,2.5 V |
Grid Array, Thin Profile, Fine Pitch |
BGA144,13X13,32 |
Field Programmable Gate Arrays |
2.375 V |
.8 mm |
85 °C (185 °F) |
0.7 ns |
384 CLBS, 57906 Gates |
0 °C (32 °F) |
Tin/Lead (Sn63Pb37) |
Bottom |
S-PBGA-B144 |
3 |
1.2 mm |
12 mm |
No |
e0 |
294 MHz |
30 s |
94 |
240 °C (464 °F) |
12 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.